JPWO2023085263A5 - - Google Patents

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Publication number
JPWO2023085263A5
JPWO2023085263A5 JP2023559637A JP2023559637A JPWO2023085263A5 JP WO2023085263 A5 JPWO2023085263 A5 JP WO2023085263A5 JP 2023559637 A JP2023559637 A JP 2023559637A JP 2023559637 A JP2023559637 A JP 2023559637A JP WO2023085263 A5 JPWO2023085263 A5 JP WO2023085263A5
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JP
Japan
Prior art keywords
plating layer
less
bump
weight
volume
Prior art date
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Application number
JP2023559637A
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English (en)
Japanese (ja)
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JPWO2023085263A1 (https=
JP7647920B2 (ja
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Priority claimed from PCT/JP2022/041547 external-priority patent/WO2023085263A1/ja
Publication of JPWO2023085263A1 publication Critical patent/JPWO2023085263A1/ja
Publication of JPWO2023085263A5 publication Critical patent/JPWO2023085263A5/ja
Application granted granted Critical
Publication of JP7647920B2 publication Critical patent/JP7647920B2/ja
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JP2023559637A 2021-11-10 2022-11-08 積層セラミックコンデンサ及びバンプ製造用ペースト Active JP7647920B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021183732 2021-11-10
JP2021183732 2021-11-10
PCT/JP2022/041547 WO2023085263A1 (ja) 2021-11-10 2022-11-08 積層セラミックコンデンサ及びバンプ製造用ペースト

Publications (3)

Publication Number Publication Date
JPWO2023085263A1 JPWO2023085263A1 (https=) 2023-05-19
JPWO2023085263A5 true JPWO2023085263A5 (https=) 2024-06-28
JP7647920B2 JP7647920B2 (ja) 2025-03-18

Family

ID=86335732

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023559637A Active JP7647920B2 (ja) 2021-11-10 2022-11-08 積層セラミックコンデンサ及びバンプ製造用ペースト

Country Status (3)

Country Link
US (1) US12597564B2 (https=)
JP (1) JP7647920B2 (https=)
WO (1) WO2023085263A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025163971A1 (ja) * 2024-01-29 2025-08-07 株式会社村田製作所 積層セラミック電子部品
WO2025254100A1 (ja) * 2024-06-04 2025-12-11 株式会社村田製作所 積層セラミックコンデンサ

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4947076B2 (ja) 2009-03-25 2012-06-06 Ｔｄｋ株式会社 電子部品の製造方法
US9877393B2 (en) * 2013-12-24 2018-01-23 Kyocera Corporation Laminated electronic component and laminated electronic component mounting structure
KR20150118385A (ko) * 2014-04-14 2015-10-22 삼성전기주식회사 적층 세라믹 커패시터, 그 제조 방법 및 그 실장 기판
KR101630037B1 (ko) 2014-05-08 2016-06-13 삼성전기주식회사 적층 세라믹 커패시터, 어레이형 적층 세라믹 커패시터, 그 제조 방법 및 그 실장 기판
CN112908693B (zh) * 2016-12-01 2022-10-21 株式会社村田制作所 芯片型电子部件
JP6946876B2 (ja) * 2017-09-08 2021-10-13 Tdk株式会社 電子部品及び電子部品装置
KR102473422B1 (ko) * 2017-10-02 2022-12-02 삼성전기주식회사 적층형 전자 부품 및 그 실장 기판
JP7292958B2 (ja) * 2019-04-26 2023-06-19 株式会社村田製作所 電子部品の実装構造体
JP7451103B2 (ja) * 2019-07-31 2024-03-18 株式会社村田製作所 チップ型電子部品、電子部品の実装構造体および電子部品連
KR102730020B1 (ko) * 2019-12-31 2024-11-14 삼성전기주식회사 적층형 전자 부품 및 그 실장 기판

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