JP7647920B2 - 積層セラミックコンデンサ及びバンプ製造用ペースト - Google Patents

積層セラミックコンデンサ及びバンプ製造用ペースト Download PDF

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Publication number
JP7647920B2
JP7647920B2 JP2023559637A JP2023559637A JP7647920B2 JP 7647920 B2 JP7647920 B2 JP 7647920B2 JP 2023559637 A JP2023559637 A JP 2023559637A JP 2023559637 A JP2023559637 A JP 2023559637A JP 7647920 B2 JP7647920 B2 JP 7647920B2
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Japan
Prior art keywords
bump
plating layer
multilayer ceramic
less
electrode layer
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Active
Application number
JP2023559637A
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English (en)
Japanese (ja)
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JPWO2023085263A5 (https=
JPWO2023085263A1 (https=
Inventor
孝太 善哉
教子 山本
祐輔 鎌田
忍 筑摩
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
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Murata Manufacturing Co Ltd
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Publication date
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
    • C09D11/037—Printing inks characterised by features other than the chemical nature of the binder characterised by the pigment
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/10—Printing inks based on artificial resins
    • C09D11/102—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions other than those only involving unsaturated carbon-to-carbon bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/52—Electrically conductive inks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/008—Selection of materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Ceramic Capacitors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
JP2023559637A 2021-11-10 2022-11-08 積層セラミックコンデンサ及びバンプ製造用ペースト Active JP7647920B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021183732 2021-11-10
JP2021183732 2021-11-10
PCT/JP2022/041547 WO2023085263A1 (ja) 2021-11-10 2022-11-08 積層セラミックコンデンサ及びバンプ製造用ペースト

Publications (3)

Publication Number Publication Date
JPWO2023085263A1 JPWO2023085263A1 (https=) 2023-05-19
JPWO2023085263A5 JPWO2023085263A5 (https=) 2024-06-28
JP7647920B2 true JP7647920B2 (ja) 2025-03-18

Family

ID=86335732

Family Applications (1)

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JP2023559637A Active JP7647920B2 (ja) 2021-11-10 2022-11-08 積層セラミックコンデンサ及びバンプ製造用ペースト

Country Status (3)

Country Link
US (1) US12597564B2 (https=)
JP (1) JP7647920B2 (https=)
WO (1) WO2023085263A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025163971A1 (ja) * 2024-01-29 2025-08-07 株式会社村田製作所 積層セラミック電子部品
WO2025254100A1 (ja) * 2024-06-04 2025-12-11 株式会社村田製作所 積層セラミックコンデンサ

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010226017A (ja) 2009-03-25 2010-10-07 Tdk Corp 電子部品の製造方法
WO2018101405A1 (ja) 2016-12-01 2018-06-07 株式会社村田製作所 チップ型電子部品
JP2019050278A (ja) 2017-09-08 2019-03-28 Tdk株式会社 電子部品及び電子部品装置
US10566137B2 (en) 2017-10-02 2020-02-18 Samsung Electro-Mechanics Co., Ltd. Multilayer electronic component and board having the same
JP2020181962A (ja) 2019-04-26 2020-11-05 株式会社村田製作所 チップ型電子部品および電子部品の実装構造体
JP2021027054A (ja) 2019-07-31 2021-02-22 株式会社村田製作所 チップ型電子部品、電子部品の実装構造体および電子部品連

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9877393B2 (en) * 2013-12-24 2018-01-23 Kyocera Corporation Laminated electronic component and laminated electronic component mounting structure
KR20150118385A (ko) * 2014-04-14 2015-10-22 삼성전기주식회사 적층 세라믹 커패시터, 그 제조 방법 및 그 실장 기판
KR101630037B1 (ko) 2014-05-08 2016-06-13 삼성전기주식회사 적층 세라믹 커패시터, 어레이형 적층 세라믹 커패시터, 그 제조 방법 및 그 실장 기판
KR102730020B1 (ko) * 2019-12-31 2024-11-14 삼성전기주식회사 적층형 전자 부품 및 그 실장 기판

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010226017A (ja) 2009-03-25 2010-10-07 Tdk Corp 電子部品の製造方法
WO2018101405A1 (ja) 2016-12-01 2018-06-07 株式会社村田製作所 チップ型電子部品
JP2019050278A (ja) 2017-09-08 2019-03-28 Tdk株式会社 電子部品及び電子部品装置
US10566137B2 (en) 2017-10-02 2020-02-18 Samsung Electro-Mechanics Co., Ltd. Multilayer electronic component and board having the same
JP2020181962A (ja) 2019-04-26 2020-11-05 株式会社村田製作所 チップ型電子部品および電子部品の実装構造体
JP2021027054A (ja) 2019-07-31 2021-02-22 株式会社村田製作所 チップ型電子部品、電子部品の実装構造体および電子部品連

Also Published As

Publication number Publication date
US12597564B2 (en) 2026-04-07
US20240274362A1 (en) 2024-08-15
JPWO2023085263A1 (https=) 2023-05-19
WO2023085263A1 (ja) 2023-05-19

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