JPWO2023080202A5 - - Google Patents
Download PDFInfo
- Publication number
- JPWO2023080202A5 JPWO2023080202A5 JP2023502606A JP2023502606A JPWO2023080202A5 JP WO2023080202 A5 JPWO2023080202 A5 JP WO2023080202A5 JP 2023502606 A JP2023502606 A JP 2023502606A JP 2023502606 A JP2023502606 A JP 2023502606A JP WO2023080202 A5 JPWO2023080202 A5 JP WO2023080202A5
- Authority
- JP
- Japan
- Prior art keywords
- thermally conductive
- conductive composition
- composition according
- mixture
- liquid polymer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000203 mixture Substances 0.000 claims 34
- 239000007788 liquid Substances 0.000 claims 13
- 239000003795 chemical substances by application Substances 0.000 claims 12
- 229920000642 polymer Polymers 0.000 claims 11
- 238000005259 measurement Methods 0.000 claims 6
- -1 ester compound Chemical class 0.000 claims 4
- 229920001296 polysiloxane Polymers 0.000 claims 4
- 239000011231 conductive filler Substances 0.000 claims 3
- 239000004020 conductor Substances 0.000 claims 3
- 238000001816 cooling Methods 0.000 claims 2
- 238000010438 heat treatment Methods 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 2
- 239000000463 material Substances 0.000 claims 2
- 238000007259 addition reaction Methods 0.000 claims 1
- 125000003342 alkenyl group Chemical group 0.000 claims 1
- 125000004432 carbon atom Chemical group C* 0.000 claims 1
- 229910052739 hydrogen Inorganic materials 0.000 claims 1
- 239000001257 hydrogen Substances 0.000 claims 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims 1
- 238000002844 melting Methods 0.000 claims 1
- 230000008018 melting Effects 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 239000007787 solid Substances 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023175221A JP2023184534A (ja) | 2021-11-05 | 2023-10-10 | 熱伝導性組成物、及び熱伝導性部材 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021181478 | 2021-11-05 | ||
| JP2021181478 | 2021-11-05 | ||
| PCT/JP2022/041195 WO2023080202A1 (ja) | 2021-11-05 | 2022-11-04 | 熱伝導性組成物、及び熱伝導性部材 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023175221A Division JP2023184534A (ja) | 2021-11-05 | 2023-10-10 | 熱伝導性組成物、及び熱伝導性部材 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2023080202A1 JPWO2023080202A1 (https=) | 2023-05-11 |
| JPWO2023080202A5 true JPWO2023080202A5 (https=) | 2023-10-03 |
| JP7370120B2 JP7370120B2 (ja) | 2023-10-27 |
Family
ID=86241565
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023502606A Active JP7370120B2 (ja) | 2021-11-05 | 2022-11-04 | 熱伝導性組成物、及び熱伝導性部材 |
| JP2023175221A Pending JP2023184534A (ja) | 2021-11-05 | 2023-10-10 | 熱伝導性組成物、及び熱伝導性部材 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023175221A Pending JP2023184534A (ja) | 2021-11-05 | 2023-10-10 | 熱伝導性組成物、及び熱伝導性部材 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20250277112A1 (https=) |
| EP (1) | EP4428199A4 (https=) |
| JP (2) | JP7370120B2 (https=) |
| KR (1) | KR20240095196A (https=) |
| CN (1) | CN118103457A (https=) |
| WO (1) | WO2023080202A1 (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20240400878A1 (en) * | 2021-09-29 | 2024-12-05 | Sekisui Polymatech Co., Ltd. | Thermally conductive composition and thermally conductive member |
| EP4703435A1 (en) * | 2023-04-28 | 2026-03-04 | Sekisui Chemical Co., Ltd. | Thermally conductive member, thermally conductive composition, structure, and method for reworking structure |
| JP2024172885A (ja) * | 2023-06-01 | 2024-12-12 | 信越化学工業株式会社 | 熱伝導性２液付加硬化型シリコーン組成物、硬化物及びシート |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5619487B2 (ja) | 2010-06-24 | 2014-11-05 | 東レ・ダウコーニング株式会社 | 熱伝導性シリコーングリース組成物 |
| CN107735439B (zh) * | 2015-07-02 | 2020-03-17 | 株式会社钟化 | 导热性树脂组合物 |
| JP6771218B2 (ja) * | 2016-10-21 | 2020-10-21 | 積水ポリマテック株式会社 | 熱伝導性組成物および熱伝導性部材 |
| CN110431710B (zh) | 2017-03-22 | 2023-04-04 | 积水保力马科技株式会社 | 电池模块及电池组 |
| KR102146540B1 (ko) * | 2017-09-15 | 2020-08-20 | 주식회사 엘지화학 | 배터리 모듈 |
| KR102578330B1 (ko) * | 2018-06-27 | 2023-09-18 | 다우 실리콘즈 코포레이션 | 열 갭 충전제 및 배터리 관리 시스템을 위한 이의 응용 |
| JP7145732B2 (ja) * | 2018-11-09 | 2022-10-03 | 株式会社ジャパンディスプレイ | 表示装置 |
| US20210371660A1 (en) * | 2018-11-09 | 2021-12-02 | Sekisui Polymatech Co., Ltd. | Thermally conductive composition, thermally conductive member, method for producing thermally conductive member, heat dissipation structure, heat generating composite member, and heat dissipating composite member |
| JP2021051905A (ja) * | 2019-09-25 | 2021-04-01 | 富士高分子工業株式会社 | シーリング材用熱伝導シート及びこれを組み込んだ発熱性電気・電子部品 |
| JP7136065B2 (ja) * | 2019-11-14 | 2022-09-13 | 信越化学工業株式会社 | 熱伝導性シリコーン組成物及び熱伝導性シリコーンシート |
| US20240400878A1 (en) * | 2021-09-29 | 2024-12-05 | Sekisui Polymatech Co., Ltd. | Thermally conductive composition and thermally conductive member |
-
2022
- 2022-11-04 US US18/702,575 patent/US20250277112A1/en active Pending
- 2022-11-04 CN CN202280069913.1A patent/CN118103457A/zh active Pending
- 2022-11-04 JP JP2023502606A patent/JP7370120B2/ja active Active
- 2022-11-04 EP EP22890022.1A patent/EP4428199A4/en active Pending
- 2022-11-04 WO PCT/JP2022/041195 patent/WO2023080202A1/ja not_active Ceased
- 2022-11-04 KR KR1020247012677A patent/KR20240095196A/ko active Pending
-
2023
- 2023-10-10 JP JP2023175221A patent/JP2023184534A/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPWO2023080202A5 (https=) | ||
| JP6461475B2 (ja) | 注型成形用エポキシ樹脂組成物、並びにそれを用いた高電圧機器用モールド製品の製造方法 | |
| Wang et al. | Triple shape memory effect of foamed natural Eucommia ulmoides gum/high‐density polyethylene composites | |
| KR102427037B1 (ko) | 경화 수지용 조성물, 상기 조성물의 경화물, 상기 조성물 및 상기 경화물의 제조방법, 및 반도체 장치 | |
| US11753515B2 (en) | Method for producing molded foam articles, and molded foam articles | |
| TW201211150A (en) | Method for producing liquid crystal polyester composition | |
| JP7370120B2 (ja) | 熱伝導性組成物、及び熱伝導性部材 | |
| CN109689742A (zh) | 固化性树脂混合物及固化性树脂组合物的制造方法 | |
| JP2025176714A5 (https=) | ||
| CN107880503A (zh) | 一种phbv/pbat/ehbp共混物及其制备方法 | |
| CN101781545B (zh) | 有机硅脱氢缩合型光缆粘接剂及其使用方法 | |
| JPH0462012A (ja) | シリコーンゴム成形品の製造方法及び該成形品製造用の成形材料 | |
| CN221315147U (zh) | 一种用于医用防辐射制备3d打印装置 | |
| Sabzevari et al. | Effect of thermoplastic toughening agent on glass transition temperature and cure kinetics of an epoxy prepreg | |
| CN105295765A (zh) | 一种封框胶的填充物、其制作方法及封框胶 | |
| CN106519702B (zh) | 用于制备开孔硅橡胶海绵的组合物和制备开孔硅橡胶海绵的方法 | |
| KR20240095594A (ko) | 임베디드 3d 프린팅 시스템 | |
| WO2019024224A1 (zh) | 一种玻纤增强聚苯硫醚复合材料及其制备方法 | |
| TW201200338A (en) | Method for producing molded article | |
| RU2645481C1 (ru) | Морозостойкий силиконовый пеногерметик | |
| JP5246132B2 (ja) | 液状付加硬化型シリコーンゴム組成物の射出成形方法 | |
| CN108047628A (zh) | 一种宽温域阻尼减振弹性体复合材料及其制备方法 | |
| CN108795393A (zh) | 一种碳纤维柔性石墨片的制作方法 | |
| CN109608877B (zh) | 一种精度高、结构复杂制品注塑用增强尼龙料及制备方法 | |
| JP2026505500A (ja) | バッテリーモジュール、その製造方法およびバッテリーモジュールに含まれる硬化性樹脂組成物 |