JP2025176714A5 - - Google Patents
Info
- Publication number
- JP2025176714A5 JP2025176714A5 JP2025137303A JP2025137303A JP2025176714A5 JP 2025176714 A5 JP2025176714 A5 JP 2025176714A5 JP 2025137303 A JP2025137303 A JP 2025137303A JP 2025137303 A JP2025137303 A JP 2025137303A JP 2025176714 A5 JP2025176714 A5 JP 2025176714A5
- Authority
- JP
- Japan
- Prior art keywords
- thermally conductive
- conductive composition
- composition according
- group
- liquid silicone
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2025137303A JP2025176714A (ja) | 2022-03-30 | 2025-08-20 | 熱伝導性組成物 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022056755A JP7797942B2 (ja) | 2022-03-30 | 2022-03-30 | 熱伝導性組成物 |
| JP2025137303A JP2025176714A (ja) | 2022-03-30 | 2025-08-20 | 熱伝導性組成物 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022056755A Division JP7797942B2 (ja) | 2022-03-30 | 2022-03-30 | 熱伝導性組成物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2025176714A JP2025176714A (ja) | 2025-12-04 |
| JP2025176714A5 true JP2025176714A5 (https=) | 2026-03-12 |
Family
ID=88194714
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022056755A Active JP7797942B2 (ja) | 2022-03-30 | 2022-03-30 | 熱伝導性組成物 |
| JP2025137303A Pending JP2025176714A (ja) | 2022-03-30 | 2025-08-20 | 熱伝導性組成物 |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022056755A Active JP7797942B2 (ja) | 2022-03-30 | 2022-03-30 | 熱伝導性組成物 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20230313017A1 (https=) |
| JP (2) | JP7797942B2 (https=) |
| CN (1) | CN116891638A (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2025204719A1 (ja) * | 2024-03-29 | 2025-10-02 | 三菱マテリアル株式会社 | 熱伝導性樹脂組成物 |
| CN119039789B (zh) * | 2024-08-30 | 2025-09-26 | 北京康美特科技股份有限公司 | 一种导热硅橡胶及其制备方法 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5166677B2 (ja) | 2005-03-15 | 2013-03-21 | 東レ・ダウコーニング株式会社 | 硬化性シリコーン組成物および電子部品 |
| GB0806820D0 (en) | 2008-04-16 | 2008-05-14 | Dow Corning | Polymeric compositions |
| JP5699901B2 (ja) | 2011-10-24 | 2015-04-15 | 信越化学工業株式会社 | 室温湿気増粘型熱伝導性シリコーングリース組成物 |
| EP3087150A1 (en) | 2013-12-23 | 2016-11-02 | Dow Corning Corporation | Moisture curable compositions |
| KR102672352B1 (ko) | 2018-02-15 | 2024-06-04 | 가부시끼가이샤 쓰리본드 | 열전도성 습기 경화형 수지 조성물 및 그 경화물 |
| JP7632143B2 (ja) | 2021-07-14 | 2025-02-19 | Jnc株式会社 | シリコーン樹脂組成物 |
-
2022
- 2022-03-30 JP JP2022056755A patent/JP7797942B2/ja active Active
-
2023
- 2023-03-29 US US18/127,720 patent/US20230313017A1/en active Pending
- 2023-03-29 CN CN202310318364.3A patent/CN116891638A/zh active Pending
-
2025
- 2025-08-20 JP JP2025137303A patent/JP2025176714A/ja active Pending
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