JP7797942B2 - 熱伝導性組成物 - Google Patents

熱伝導性組成物

Info

Publication number
JP7797942B2
JP7797942B2 JP2022056755A JP2022056755A JP7797942B2 JP 7797942 B2 JP7797942 B2 JP 7797942B2 JP 2022056755 A JP2022056755 A JP 2022056755A JP 2022056755 A JP2022056755 A JP 2022056755A JP 7797942 B2 JP7797942 B2 JP 7797942B2
Authority
JP
Japan
Prior art keywords
thermally conductive
silicone resin
conductive composition
mass
cured product
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2022056755A
Other languages
English (en)
Japanese (ja)
Other versions
JP2023148623A (ja
Inventor
一 舟橋
光 佐藤
初 行武
郁恵 小林
武志 家村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
Resonac Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd, Showa Denko Materials Co Ltd, Resonac Corp filed Critical Hitachi Chemical Co Ltd
Priority to JP2022056755A priority Critical patent/JP7797942B2/ja
Priority to CN202310318364.3A priority patent/CN116891638A/zh
Priority to US18/127,720 priority patent/US20230313017A1/en
Publication of JP2023148623A publication Critical patent/JP2023148623A/ja
Priority to JP2025137303A priority patent/JP2025176714A/ja
Application granted granted Critical
Publication of JP7797942B2 publication Critical patent/JP7797942B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/16—Polysiloxanes containing silicon bound to oxygen-containing groups to hydroxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/28—Nitrogen-containing compounds
    • C08K2003/282—Binary compounds of nitrogen with aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/08—Stabilised against heat, light or radiation or oxydation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Thermal Sciences (AREA)
  • Materials Engineering (AREA)
  • Combustion & Propulsion (AREA)
  • Physics & Mathematics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2022056755A 2022-03-30 2022-03-30 熱伝導性組成物 Active JP7797942B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2022056755A JP7797942B2 (ja) 2022-03-30 2022-03-30 熱伝導性組成物
CN202310318364.3A CN116891638A (zh) 2022-03-30 2023-03-29 导热性组合物
US18/127,720 US20230313017A1 (en) 2022-03-30 2023-03-29 Thermally conductive composition
JP2025137303A JP2025176714A (ja) 2022-03-30 2025-08-20 熱伝導性組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2022056755A JP7797942B2 (ja) 2022-03-30 2022-03-30 熱伝導性組成物

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2025137303A Division JP2025176714A (ja) 2022-03-30 2025-08-20 熱伝導性組成物

Publications (2)

Publication Number Publication Date
JP2023148623A JP2023148623A (ja) 2023-10-13
JP7797942B2 true JP7797942B2 (ja) 2026-01-14

Family

ID=88194714

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2022056755A Active JP7797942B2 (ja) 2022-03-30 2022-03-30 熱伝導性組成物
JP2025137303A Pending JP2025176714A (ja) 2022-03-30 2025-08-20 熱伝導性組成物

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2025137303A Pending JP2025176714A (ja) 2022-03-30 2025-08-20 熱伝導性組成物

Country Status (3)

Country Link
US (1) US20230313017A1 (https=)
JP (2) JP7797942B2 (https=)
CN (1) CN116891638A (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025204719A1 (ja) * 2024-03-29 2025-10-02 三菱マテリアル株式会社 熱伝導性樹脂組成物
CN119039789B (zh) * 2024-08-30 2025-09-26 北京康美特科技股份有限公司 一种导热硅橡胶及其制备方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006257115A (ja) 2005-03-15 2006-09-28 Dow Corning Toray Co Ltd 硬化性シリコーン組成物および電子部品
JP2011519386A (ja) 2008-04-16 2011-07-07 ダウ・コーニング・コーポレイション ポリマー組成物
JP2013091683A (ja) 2011-10-24 2013-05-16 Shin-Etsu Chemical Co Ltd 室温湿気増粘型熱伝導性シリコーングリース組成物
JP2017502147A (ja) 2013-12-23 2017-01-19 ダウ コーニング コーポレーションＤｏｗ Ｃｏｒｎｉｎｇ Ｃｏｒｐｏｒａｔｉｏｎ 湿気硬化性組成物
WO2019159753A1 (ja) 2018-02-15 2019-08-22 株式会社スリーボンド 熱伝導性湿気硬化型樹脂組成物およびその硬化物
JP2023012918A (ja) 2021-07-14 2023-01-26 Jnc株式会社 シリコーン樹脂組成物

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006257115A (ja) 2005-03-15 2006-09-28 Dow Corning Toray Co Ltd 硬化性シリコーン組成物および電子部品
JP2011519386A (ja) 2008-04-16 2011-07-07 ダウ・コーニング・コーポレイション ポリマー組成物
JP2013091683A (ja) 2011-10-24 2013-05-16 Shin-Etsu Chemical Co Ltd 室温湿気増粘型熱伝導性シリコーングリース組成物
JP2017502147A (ja) 2013-12-23 2017-01-19 ダウ コーニング コーポレーションＤｏｗ Ｃｏｒｎｉｎｇ Ｃｏｒｐｏｒａｔｉｏｎ 湿気硬化性組成物
WO2019159753A1 (ja) 2018-02-15 2019-08-22 株式会社スリーボンド 熱伝導性湿気硬化型樹脂組成物およびその硬化物
JP2023012918A (ja) 2021-07-14 2023-01-26 Jnc株式会社 シリコーン樹脂組成物

Also Published As

Publication number Publication date
US20230313017A1 (en) 2023-10-05
JP2025176714A (ja) 2025-12-04
JP2023148623A (ja) 2023-10-13
CN116891638A (zh) 2023-10-17

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