JPWO2023054538A5 - - Google Patents

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Publication number
JPWO2023054538A5
JPWO2023054538A5 JP2022574662A JP2022574662A JPWO2023054538A5 JP WO2023054538 A5 JPWO2023054538 A5 JP WO2023054538A5 JP 2022574662 A JP2022574662 A JP 2022574662A JP 2022574662 A JP2022574662 A JP 2022574662A JP WO2023054538 A5 JPWO2023054538 A5 JP WO2023054538A5
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JP
Japan
Prior art keywords
thermally conductive
conductive composition
composition according
organopolysiloxane
ester compound
Prior art date
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Application number
JP2022574662A
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English (en)
Japanese (ja)
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JP7227676B1 (ja
JPWO2023054538A1 (https=
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Priority claimed from PCT/JP2022/036315 external-priority patent/WO2023054538A1/ja
Priority to JP2023015352A priority Critical patent/JP2023050205A/ja
Application granted granted Critical
Publication of JP7227676B1 publication Critical patent/JP7227676B1/ja
Publication of JPWO2023054538A1 publication Critical patent/JPWO2023054538A1/ja
Publication of JPWO2023054538A5 publication Critical patent/JPWO2023054538A5/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2022574662A 2021-09-29 2022-09-28 熱伝導性組成物及び熱伝導性部材 Active JP7227676B1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2023015352A JP2023050205A (ja) 2021-09-29 2023-02-03 熱伝導性組成物及び熱伝導性部材

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021160135 2021-09-29
JP2021160135 2021-09-29
PCT/JP2022/036315 WO2023054538A1 (ja) 2021-09-29 2022-09-28 熱伝導性組成物及び熱伝導性部材

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2023015352A Division JP2023050205A (ja) 2021-09-29 2023-02-03 熱伝導性組成物及び熱伝導性部材

Publications (3)

Publication Number Publication Date
JP7227676B1 JP7227676B1 (ja) 2023-02-22
JPWO2023054538A1 JPWO2023054538A1 (https=) 2023-04-06
JPWO2023054538A5 true JPWO2023054538A5 (https=) 2023-09-06

Family

ID=85277856

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2022574662A Active JP7227676B1 (ja) 2021-09-29 2022-09-28 熱伝導性組成物及び熱伝導性部材
JP2023015352A Pending JP2023050205A (ja) 2021-09-29 2023-02-03 熱伝導性組成物及び熱伝導性部材

Family Applications After (1)

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JP2023015352A Pending JP2023050205A (ja) 2021-09-29 2023-02-03 熱伝導性組成物及び熱伝導性部材

Country Status (4)

Country Link
US (1) US20240400878A1 (https=)
EP (1) EP4410926A4 (https=)
JP (2) JP7227676B1 (https=)
CN (1) CN118103477A (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20250277112A1 (en) * 2021-11-05 2025-09-04 Sekisui Polymatech Co., Ltd. Thermally conductive composition and thermally conductive member
KR102689513B1 (ko) * 2023-12-22 2024-07-29 동우 화인켐 주식회사 갭 필러 조성물 및 배터리 팩
KR102760155B1 (ko) * 2023-12-22 2025-01-24 동우 화인켐 주식회사 갭 필러 조성물 및 배터리 팩
KR102689514B1 (ko) * 2023-12-22 2024-07-29 동우 화인켐 주식회사 갭 필러 조성물 및 배터리 팩

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04323281A (ja) * 1991-04-24 1992-11-12 Matsushita Electric Works Ltd コーティング用組成物、放熱性絶縁膜および金属ベース基板
JP2000044805A (ja) * 1998-05-29 2000-02-15 Dow Corning Toray Silicone Co Ltd 液状シリコーンゴム用ベース組成物およびその粘度低減方法
JP2001106617A (ja) * 1999-10-04 2001-04-17 Kansai Koso Kk 皮膚保護化粧料
JP4899137B2 (ja) * 2008-07-17 2012-03-21 ニホンハンダ株式会社 熱伝導性オイル組成物、放熱剤及び電子機器
CN105860756A (zh) * 2016-05-09 2016-08-17 安徽爱莱特照明灯具有限公司 一种耐化学腐蚀的led灯座用高导热绝缘漆及其制作方法
KR101956371B1 (ko) * 2018-04-20 2019-05-30 나노팀 주식회사 절연 성능이 보강된 방열 실리콘 시트
CN108976546A (zh) * 2018-06-11 2018-12-11 安徽国华电缆集团有限公司 一种电缆通用屏蔽层材料
CN113785432A (zh) * 2019-05-06 2021-12-10 罗杰斯公司 电池包装材料、制造方法、及其用途
WO2023054538A1 (ja) * 2021-09-29 2023-04-06 積水ポリマテック株式会社 熱伝導性組成物及び熱伝導性部材
US20250277112A1 (en) * 2021-11-05 2025-09-04 Sekisui Polymatech Co., Ltd. Thermally conductive composition and thermally conductive member
TW202348736A (zh) * 2022-04-28 2023-12-16 德商漢高股份有限及兩合公司 兩液型可固化熱導性組合物

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