JPWO2023074811A5 - - Google Patents

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Publication number
JPWO2023074811A5
JPWO2023074811A5 JP2023556644A JP2023556644A JPWO2023074811A5 JP WO2023074811 A5 JPWO2023074811 A5 JP WO2023074811A5 JP 2023556644 A JP2023556644 A JP 2023556644A JP 2023556644 A JP2023556644 A JP 2023556644A JP WO2023074811 A5 JPWO2023074811 A5 JP WO2023074811A5
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Japan
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semiconductor package
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package according
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frame
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JP2023556644A
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English (en)
Japanese (ja)
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JPWO2023074811A1 (https=
JP7685609B2 (ja
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Priority claimed from PCT/JP2022/040205 external-priority patent/WO2023074811A1/ja
Publication of JPWO2023074811A1 publication Critical patent/JPWO2023074811A1/ja
Publication of JPWO2023074811A5 publication Critical patent/JPWO2023074811A5/ja
Priority to JP2025066243A priority Critical patent/JP2025108575A/ja
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Publication of JP7685609B2 publication Critical patent/JP7685609B2/ja
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JP2023556644A 2021-10-28 2022-10-27 半導体パッケージおよび半導体装置 Active JP7685609B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2025066243A JP2025108575A (ja) 2021-10-28 2025-04-14 半導体パッケージおよび半導体装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021176646 2021-10-28
JP2021176646 2021-10-28
PCT/JP2022/040205 WO2023074811A1 (ja) 2021-10-28 2022-10-27 半導体パッケージおよび半導体装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2025066243A Division JP2025108575A (ja) 2021-10-28 2025-04-14 半導体パッケージおよび半導体装置

Publications (3)

Publication Number Publication Date
JPWO2023074811A1 JPWO2023074811A1 (https=) 2023-05-04
JPWO2023074811A5 true JPWO2023074811A5 (https=) 2024-09-09
JP7685609B2 JP7685609B2 (ja) 2025-05-29

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ID=86159931

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2023556644A Active JP7685609B2 (ja) 2021-10-28 2022-10-27 半導体パッケージおよび半導体装置
JP2025066243A Pending JP2025108575A (ja) 2021-10-28 2025-04-14 半導体パッケージおよび半導体装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2025066243A Pending JP2025108575A (ja) 2021-10-28 2025-04-14 半導体パッケージおよび半導体装置

Country Status (4)

Country Link
US (1) US20240421556A1 (https=)
JP (2) JP7685609B2 (https=)
CN (1) CN118160174A (https=)
WO (1) WO2023074811A1 (https=)

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07218776A (ja) * 1994-02-04 1995-08-18 Fujitsu Ltd 光半導体モジュールの実装構造
JP2000131567A (ja) * 1998-10-22 2000-05-12 Mitsubishi Electric Corp 半導体レーザモジュール
JP2005050836A (ja) * 2003-07-28 2005-02-24 Kyocera Corp 半導体素子収納用パッケージおよび半導体装置
JP2010243732A (ja) * 2009-04-03 2010-10-28 Fujikura Ltd 光モジュール及びその製造方法
US8632262B2 (en) * 2011-08-30 2014-01-21 Kestrel Labs, Inc. Laser to fiber optical coupling in photoplethysmography
KR101512287B1 (ko) * 2013-06-04 2015-04-16 한국광기술원 레이저 다이오드 패키지 및 그 제조 방법
JP2015099886A (ja) 2013-11-20 2015-05-28 Ｎｇｋエレクトロデバイス株式会社 電子部品収納用パッケージ
JP2016115736A (ja) * 2014-12-12 2016-06-23 京セラ株式会社 半導体素子パッケージおよび半導体装置
JP2017152557A (ja) * 2016-02-25 2017-08-31 京セラ株式会社 光半導体素子収納用パッケージおよび光半導体装置
US11362484B2 (en) * 2017-09-19 2022-06-14 Kyocera Corporation Light-emitting-element housing member, array member, and light emitting device

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