JPWO2023074811A1 - - Google Patents

Info

Publication number
JPWO2023074811A1
JPWO2023074811A1 JP2023556644A JP2023556644A JPWO2023074811A1 JP WO2023074811 A1 JPWO2023074811 A1 JP WO2023074811A1 JP 2023556644 A JP2023556644 A JP 2023556644A JP 2023556644 A JP2023556644 A JP 2023556644A JP WO2023074811 A1 JPWO2023074811 A1 JP WO2023074811A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023556644A
Other languages
Japanese (ja)
Other versions
JPWO2023074811A5 (https=
JP7685609B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023074811A1 publication Critical patent/JPWO2023074811A1/ja
Publication of JPWO2023074811A5 publication Critical patent/JPWO2023074811A5/ja
Priority to JP2025066243A priority Critical patent/JP2025108575A/ja
Application granted granted Critical
Publication of JP7685609B2 publication Critical patent/JP7685609B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02315—Support members, e.g. bases or carriers
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/02218—Material of the housings; Filling of the housings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/40—Optical elements or arrangements
    • H10F77/407—Optical elements or arrangements indirectly associated with the devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/50—Encapsulations or containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Light Receiving Elements (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Semiconductor Lasers (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
JP2023556644A 2021-10-28 2022-10-27 半導体パッケージおよび半導体装置 Active JP7685609B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2025066243A JP2025108575A (ja) 2021-10-28 2025-04-14 半導体パッケージおよび半導体装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021176646 2021-10-28
JP2021176646 2021-10-28
PCT/JP2022/040205 WO2023074811A1 (ja) 2021-10-28 2022-10-27 半導体パッケージおよび半導体装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2025066243A Division JP2025108575A (ja) 2021-10-28 2025-04-14 半導体パッケージおよび半導体装置

Publications (3)

Publication Number Publication Date
JPWO2023074811A1 true JPWO2023074811A1 (https=) 2023-05-04
JPWO2023074811A5 JPWO2023074811A5 (https=) 2024-09-09
JP7685609B2 JP7685609B2 (ja) 2025-05-29

Family

ID=86159931

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2023556644A Active JP7685609B2 (ja) 2021-10-28 2022-10-27 半導体パッケージおよび半導体装置
JP2025066243A Pending JP2025108575A (ja) 2021-10-28 2025-04-14 半導体パッケージおよび半導体装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2025066243A Pending JP2025108575A (ja) 2021-10-28 2025-04-14 半導体パッケージおよび半導体装置

Country Status (4)

Country Link
US (1) US20240421556A1 (https=)
JP (2) JP7685609B2 (https=)
CN (1) CN118160174A (https=)
WO (1) WO2023074811A1 (https=)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015099886A (ja) * 2013-11-20 2015-05-28 Ｎｇｋエレクトロデバイス株式会社 電子部品収納用パッケージ

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07218776A (ja) * 1994-02-04 1995-08-18 Fujitsu Ltd 光半導体モジュールの実装構造
JP2000131567A (ja) * 1998-10-22 2000-05-12 Mitsubishi Electric Corp 半導体レーザモジュール
JP2005050836A (ja) * 2003-07-28 2005-02-24 Kyocera Corp 半導体素子収納用パッケージおよび半導体装置
JP2010243732A (ja) * 2009-04-03 2010-10-28 Fujikura Ltd 光モジュール及びその製造方法
US8632262B2 (en) * 2011-08-30 2014-01-21 Kestrel Labs, Inc. Laser to fiber optical coupling in photoplethysmography
KR101512287B1 (ko) * 2013-06-04 2015-04-16 한국광기술원 레이저 다이오드 패키지 및 그 제조 방법
JP2016115736A (ja) * 2014-12-12 2016-06-23 京セラ株式会社 半導体素子パッケージおよび半導体装置
JP2017152557A (ja) * 2016-02-25 2017-08-31 京セラ株式会社 光半導体素子収納用パッケージおよび光半導体装置
US11362484B2 (en) * 2017-09-19 2022-06-14 Kyocera Corporation Light-emitting-element housing member, array member, and light emitting device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015099886A (ja) * 2013-11-20 2015-05-28 Ｎｇｋエレクトロデバイス株式会社 電子部品収納用パッケージ

Also Published As

Publication number Publication date
CN118160174A (zh) 2024-06-07
WO2023074811A1 (ja) 2023-05-04
JP2025108575A (ja) 2025-07-23
US20240421556A1 (en) 2024-12-19
JP7685609B2 (ja) 2025-05-29

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