CN118160174A - 半导体封装体以及半导体装置 - Google Patents

半导体封装体以及半导体装置 Download PDF

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Publication number
CN118160174A
CN118160174A CN202280072278.2A CN202280072278A CN118160174A CN 118160174 A CN118160174 A CN 118160174A CN 202280072278 A CN202280072278 A CN 202280072278A CN 118160174 A CN118160174 A CN 118160174A
Authority
CN
China
Prior art keywords
semiconductor package
package according
top surface
opening
frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280072278.2A
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English (en)
Chinese (zh)
Inventor
藤原宏信
佐竹猛夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Publication of CN118160174A publication Critical patent/CN118160174A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02315—Support members, e.g. bases or carriers
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/02218—Material of the housings; Filling of the housings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/40—Optical elements or arrangements
    • H10F77/407—Optical elements or arrangements indirectly associated with the devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/50—Encapsulations or containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Light Receiving Elements (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Semiconductor Lasers (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
CN202280072278.2A 2021-10-28 2022-10-27 半导体封装体以及半导体装置 Pending CN118160174A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021176646 2021-10-28
JP2021-176646 2021-10-28
PCT/JP2022/040205 WO2023074811A1 (ja) 2021-10-28 2022-10-27 半導体パッケージおよび半導体装置

Publications (1)

Publication Number Publication Date
CN118160174A true CN118160174A (zh) 2024-06-07

Family

ID=86159931

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280072278.2A Pending CN118160174A (zh) 2021-10-28 2022-10-27 半导体封装体以及半导体装置

Country Status (4)

Country Link
US (1) US20240421556A1 (https=)
JP (2) JP7685609B2 (https=)
CN (1) CN118160174A (https=)
WO (1) WO2023074811A1 (https=)

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07218776A (ja) * 1994-02-04 1995-08-18 Fujitsu Ltd 光半導体モジュールの実装構造
JP2000131567A (ja) * 1998-10-22 2000-05-12 Mitsubishi Electric Corp 半導体レーザモジュール
JP2005050836A (ja) * 2003-07-28 2005-02-24 Kyocera Corp 半導体素子収納用パッケージおよび半導体装置
JP2010243732A (ja) * 2009-04-03 2010-10-28 Fujikura Ltd 光モジュール及びその製造方法
US8632262B2 (en) * 2011-08-30 2014-01-21 Kestrel Labs, Inc. Laser to fiber optical coupling in photoplethysmography
KR101512287B1 (ko) * 2013-06-04 2015-04-16 한국광기술원 레이저 다이오드 패키지 및 그 제조 방법
JP2015099886A (ja) 2013-11-20 2015-05-28 Ｎｇｋエレクトロデバイス株式会社 電子部品収納用パッケージ
JP2016115736A (ja) * 2014-12-12 2016-06-23 京セラ株式会社 半導体素子パッケージおよび半導体装置
JP2017152557A (ja) * 2016-02-25 2017-08-31 京セラ株式会社 光半導体素子収納用パッケージおよび光半導体装置
US11362484B2 (en) * 2017-09-19 2022-06-14 Kyocera Corporation Light-emitting-element housing member, array member, and light emitting device

Also Published As

Publication number Publication date
WO2023074811A1 (ja) 2023-05-04
JP2025108575A (ja) 2025-07-23
US20240421556A1 (en) 2024-12-19
JPWO2023074811A1 (https=) 2023-05-04
JP7685609B2 (ja) 2025-05-29

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