JPWO2023063027A1 - - Google Patents
Info
- Publication number
- JPWO2023063027A1 JPWO2023063027A1 JP2023555053A JP2023555053A JPWO2023063027A1 JP WO2023063027 A1 JPWO2023063027 A1 JP WO2023063027A1 JP 2023555053 A JP2023555053 A JP 2023555053A JP 2023555053 A JP2023555053 A JP 2023555053A JP WO2023063027 A1 JPWO2023063027 A1 JP WO2023063027A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
- C09K3/1463—Aqueous liquid suspensions
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
- H10P52/40—Chemomechanical polishing [CMP]
- H10P52/402—Chemomechanical polishing [CMP] of semiconductor materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P90/00—Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
- H10P90/12—Preparing bulk and homogeneous wafers
- H10P90/129—Preparing bulk and homogeneous wafers by polishing
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021167127 | 2021-10-12 | ||
| PCT/JP2022/034908 WO2023063027A1 (ja) | 2021-10-12 | 2022-09-20 | 研磨用組成物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023063027A1 true JPWO2023063027A1 (https=) | 2023-04-20 |
| JPWO2023063027A5 JPWO2023063027A5 (https=) | 2024-07-24 |
Family
ID=85987670
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023555053A Pending JPWO2023063027A1 (https=) | 2021-10-12 | 2022-09-20 |
Country Status (6)
| Country | Link |
|---|---|
| EP (1) | EP4418306A4 (https=) |
| JP (1) | JPWO2023063027A1 (https=) |
| KR (1) | KR20240074866A (https=) |
| CN (1) | CN118103955A (https=) |
| TW (1) | TW202334339A (https=) |
| WO (1) | WO2023063027A1 (https=) |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6050125U (ja) | 1983-09-14 | 1985-04-09 | 小島 義彦 | 箱のコ−ナ−補強金具 |
| JP4608196B2 (ja) * | 2003-09-30 | 2011-01-05 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
| JP2005244123A (ja) * | 2004-02-27 | 2005-09-08 | Fujimi Inc | 研磨用組成物 |
| US20130302984A1 (en) | 2011-01-26 | 2013-11-14 | Fujimi Incorporated | Polishing composition, polishing method using same, and substrate production method |
| US10730755B2 (en) * | 2015-03-31 | 2020-08-04 | Jgc Catalysts And Chemicals Ltd. | Silica-based composite fine-particle dispersion, method for producing same, and polishing slurry including silica-based composite fine-particle dispersion |
| JP7250530B2 (ja) * | 2018-03-15 | 2023-04-03 | 株式会社フジミインコーポレーテッド | 研磨用組成物、研磨用組成物の製造方法、研磨方法、および半導体基板の製造方法 |
| JP7234536B2 (ja) * | 2018-03-26 | 2023-03-08 | 三菱ケミカル株式会社 | シリカゾルの製造方法 |
| WO2020196370A1 (ja) * | 2019-03-26 | 2020-10-01 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
| JP7272990B2 (ja) | 2020-04-09 | 2023-05-12 | トヨタ自動車株式会社 | コラムカバーユニット |
-
2022
- 2022-09-20 KR KR1020247015291A patent/KR20240074866A/ko active Pending
- 2022-09-20 CN CN202280068329.4A patent/CN118103955A/zh active Pending
- 2022-09-20 JP JP2023555053A patent/JPWO2023063027A1/ja active Pending
- 2022-09-20 EP EP22880723.6A patent/EP4418306A4/en active Pending
- 2022-09-20 WO PCT/JP2022/034908 patent/WO2023063027A1/ja not_active Ceased
- 2022-10-07 TW TW111138237A patent/TW202334339A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| TW202334339A (zh) | 2023-09-01 |
| CN118103955A (zh) | 2024-05-28 |
| EP4418306A4 (en) | 2025-11-05 |
| WO2023063027A1 (ja) | 2023-04-20 |
| EP4418306A1 (en) | 2024-08-21 |
| KR20240074866A (ko) | 2024-05-28 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20240404 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20250704 |