TW202334339A - 研磨用組成物 - Google Patents

研磨用組成物 Download PDF

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Publication number
TW202334339A
TW202334339A TW111138237A TW111138237A TW202334339A TW 202334339 A TW202334339 A TW 202334339A TW 111138237 A TW111138237 A TW 111138237A TW 111138237 A TW111138237 A TW 111138237A TW 202334339 A TW202334339 A TW 202334339A
Authority
TW
Taiwan
Prior art keywords
weight
polishing
less
water
polishing composition
Prior art date
Application number
TW111138237A
Other languages
English (en)
Chinese (zh)
Inventor
後藤修
髙間大輝
田中優己
Original Assignee
日商福吉米股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商福吉米股份有限公司 filed Critical 日商福吉米股份有限公司
Publication of TW202334339A publication Critical patent/TW202334339A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/402—Chemomechanical polishing [CMP] of semiconductor materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P90/00—Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
    • H10P90/12—Preparing bulk and homogeneous wafers
    • H10P90/129—Preparing bulk and homogeneous wafers by polishing

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW111138237A 2021-10-12 2022-10-07 研磨用組成物 TW202334339A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021-167127 2021-10-12
JP2021167127 2021-10-12

Publications (1)

Publication Number Publication Date
TW202334339A true TW202334339A (zh) 2023-09-01

Family

ID=85987670

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111138237A TW202334339A (zh) 2021-10-12 2022-10-07 研磨用組成物

Country Status (6)

Country Link
EP (1) EP4418306A4 (https=)
JP (1) JPWO2023063027A1 (https=)
KR (1) KR20240074866A (https=)
CN (1) CN118103955A (https=)
TW (1) TW202334339A (https=)
WO (1) WO2023063027A1 (https=)

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6050125U (ja) 1983-09-14 1985-04-09 小島　義彦 箱のコ−ナ−補強金具
JP4608196B2 (ja) * 2003-09-30 2011-01-05 株式会社フジミインコーポレーテッド 研磨用組成物
JP2005244123A (ja) * 2004-02-27 2005-09-08 Fujimi Inc 研磨用組成物
US20130302984A1 (en) 2011-01-26 2013-11-14 Fujimi Incorporated Polishing composition, polishing method using same, and substrate production method
US10730755B2 (en) * 2015-03-31 2020-08-04 Jgc Catalysts And Chemicals Ltd. Silica-based composite fine-particle dispersion, method for producing same, and polishing slurry including silica-based composite fine-particle dispersion
JP7250530B2 (ja) * 2018-03-15 2023-04-03 株式会社フジミインコーポレーテッド 研磨用組成物、研磨用組成物の製造方法、研磨方法、および半導体基板の製造方法
JP7234536B2 (ja) * 2018-03-26 2023-03-08 三菱ケミカル株式会社 シリカゾルの製造方法
WO2020196370A1 (ja) * 2019-03-26 2020-10-01 株式会社フジミインコーポレーテッド 研磨用組成物
JP7272990B2 (ja) 2020-04-09 2023-05-12 トヨタ自動車株式会社 コラムカバーユニット

Also Published As

Publication number Publication date
CN118103955A (zh) 2024-05-28
EP4418306A4 (en) 2025-11-05
WO2023063027A1 (ja) 2023-04-20
EP4418306A1 (en) 2024-08-21
KR20240074866A (ko) 2024-05-28
JPWO2023063027A1 (https=) 2023-04-20

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