KR20240074866A - 연마용 조성물 - Google Patents

연마용 조성물 Download PDF

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Publication number
KR20240074866A
KR20240074866A KR1020247015291A KR20247015291A KR20240074866A KR 20240074866 A KR20240074866 A KR 20240074866A KR 1020247015291 A KR1020247015291 A KR 1020247015291A KR 20247015291 A KR20247015291 A KR 20247015291A KR 20240074866 A KR20240074866 A KR 20240074866A
Authority
KR
South Korea
Prior art keywords
polishing
weight
less
water
polishing composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020247015291A
Other languages
English (en)
Korean (ko)
Inventor
오사무 고토
다이키 다카마
유키 다나카
Original Assignee
가부시키가이샤 후지미인코퍼레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 후지미인코퍼레이티드 filed Critical 가부시키가이샤 후지미인코퍼레이티드
Publication of KR20240074866A publication Critical patent/KR20240074866A/ko
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • H01L21/30625—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/402—Chemomechanical polishing [CMP] of semiconductor materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P90/00—Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
    • H10P90/12—Preparing bulk and homogeneous wafers
    • H10P90/129—Preparing bulk and homogeneous wafers by polishing

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
KR1020247015291A 2021-10-12 2022-09-20 연마용 조성물 Pending KR20240074866A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2021-167127 2021-10-12
JP2021167127 2021-10-12
PCT/JP2022/034908 WO2023063027A1 (ja) 2021-10-12 2022-09-20 研磨用組成物

Publications (1)

Publication Number Publication Date
KR20240074866A true KR20240074866A (ko) 2024-05-28

Family

ID=85987670

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020247015291A Pending KR20240074866A (ko) 2021-10-12 2022-09-20 연마용 조성물

Country Status (6)

Country Link
EP (1) EP4418306A4 (https=)
JP (1) JPWO2023063027A1 (https=)
KR (1) KR20240074866A (https=)
CN (1) CN118103955A (https=)
TW (1) TW202334339A (https=)
WO (1) WO2023063027A1 (https=)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6050125U (ja) 1983-09-14 1985-04-09 小島　義彦 箱のコ−ナ−補強金具

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4608196B2 (ja) * 2003-09-30 2011-01-05 株式会社フジミインコーポレーテッド 研磨用組成物
JP2005244123A (ja) * 2004-02-27 2005-09-08 Fujimi Inc 研磨用組成物
US20130302984A1 (en) 2011-01-26 2013-11-14 Fujimi Incorporated Polishing composition, polishing method using same, and substrate production method
US10730755B2 (en) * 2015-03-31 2020-08-04 Jgc Catalysts And Chemicals Ltd. Silica-based composite fine-particle dispersion, method for producing same, and polishing slurry including silica-based composite fine-particle dispersion
JP7250530B2 (ja) * 2018-03-15 2023-04-03 株式会社フジミインコーポレーテッド 研磨用組成物、研磨用組成物の製造方法、研磨方法、および半導体基板の製造方法
JP7234536B2 (ja) * 2018-03-26 2023-03-08 三菱ケミカル株式会社 シリカゾルの製造方法
WO2020196370A1 (ja) * 2019-03-26 2020-10-01 株式会社フジミインコーポレーテッド 研磨用組成物
JP7272990B2 (ja) 2020-04-09 2023-05-12 トヨタ自動車株式会社 コラムカバーユニット

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6050125U (ja) 1983-09-14 1985-04-09 小島　義彦 箱のコ−ナ−補強金具

Also Published As

Publication number Publication date
TW202334339A (zh) 2023-09-01
CN118103955A (zh) 2024-05-28
EP4418306A4 (en) 2025-11-05
WO2023063027A1 (ja) 2023-04-20
EP4418306A1 (en) 2024-08-21
JPWO2023063027A1 (https=) 2023-04-20

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Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000