CN118103955A - 研磨用组合物 - Google Patents

研磨用组合物 Download PDF

Info

Publication number
CN118103955A
CN118103955A CN202280068329.4A CN202280068329A CN118103955A CN 118103955 A CN118103955 A CN 118103955A CN 202280068329 A CN202280068329 A CN 202280068329A CN 118103955 A CN118103955 A CN 118103955A
Authority
CN
China
Prior art keywords
polishing
less
polymer
water
polishing composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280068329.4A
Other languages
English (en)
Chinese (zh)
Inventor
后藤修
高间大辉
田中优己
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujimi Inc
Original Assignee
Fujimi Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujimi Inc filed Critical Fujimi Inc
Publication of CN118103955A publication Critical patent/CN118103955A/zh
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/402—Chemomechanical polishing [CMP] of semiconductor materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P90/00—Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
    • H10P90/12—Preparing bulk and homogeneous wafers
    • H10P90/129—Preparing bulk and homogeneous wafers by polishing

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
CN202280068329.4A 2021-10-12 2022-09-20 研磨用组合物 Pending CN118103955A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021-167127 2021-10-12
JP2021167127 2021-10-12
PCT/JP2022/034908 WO2023063027A1 (ja) 2021-10-12 2022-09-20 研磨用組成物

Publications (1)

Publication Number Publication Date
CN118103955A true CN118103955A (zh) 2024-05-28

Family

ID=85987670

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280068329.4A Pending CN118103955A (zh) 2021-10-12 2022-09-20 研磨用组合物

Country Status (6)

Country Link
EP (1) EP4418306A4 (https=)
JP (1) JPWO2023063027A1 (https=)
KR (1) KR20240074866A (https=)
CN (1) CN118103955A (https=)
TW (1) TW202334339A (https=)
WO (1) WO2023063027A1 (https=)

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6050125U (ja) 1983-09-14 1985-04-09 小島　義彦 箱のコ−ナ−補強金具
JP4608196B2 (ja) * 2003-09-30 2011-01-05 株式会社フジミインコーポレーテッド 研磨用組成物
JP2005244123A (ja) * 2004-02-27 2005-09-08 Fujimi Inc 研磨用組成物
US20130302984A1 (en) 2011-01-26 2013-11-14 Fujimi Incorporated Polishing composition, polishing method using same, and substrate production method
US10730755B2 (en) * 2015-03-31 2020-08-04 Jgc Catalysts And Chemicals Ltd. Silica-based composite fine-particle dispersion, method for producing same, and polishing slurry including silica-based composite fine-particle dispersion
JP7250530B2 (ja) * 2018-03-15 2023-04-03 株式会社フジミインコーポレーテッド 研磨用組成物、研磨用組成物の製造方法、研磨方法、および半導体基板の製造方法
JP7234536B2 (ja) * 2018-03-26 2023-03-08 三菱ケミカル株式会社 シリカゾルの製造方法
WO2020196370A1 (ja) * 2019-03-26 2020-10-01 株式会社フジミインコーポレーテッド 研磨用組成物
JP7272990B2 (ja) 2020-04-09 2023-05-12 トヨタ自動車株式会社 コラムカバーユニット

Also Published As

Publication number Publication date
TW202334339A (zh) 2023-09-01
EP4418306A4 (en) 2025-11-05
WO2023063027A1 (ja) 2023-04-20
EP4418306A1 (en) 2024-08-21
KR20240074866A (ko) 2024-05-28
JPWO2023063027A1 (https=) 2023-04-20

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