JPWO2023058425A5 - - Google Patents
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- JPWO2023058425A5 JPWO2023058425A5 JP2023552778A JP2023552778A JPWO2023058425A5 JP WO2023058425 A5 JPWO2023058425 A5 JP WO2023058425A5 JP 2023552778 A JP2023552778 A JP 2023552778A JP 2023552778 A JP2023552778 A JP 2023552778A JP WO2023058425 A5 JPWO2023058425 A5 JP WO2023058425A5
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- JP
- Japan
- Prior art keywords
- group
- formula
- represented
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- resin composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000011342 resin composition Substances 0.000 claims description 41
- 239000004065 semiconductor Substances 0.000 claims description 32
- 239000011229 interlayer Substances 0.000 claims description 30
- 229920001955 polyphenylene ether Polymers 0.000 claims description 18
- 239000000758 substrate Substances 0.000 claims description 18
- 239000011347 resin Substances 0.000 claims description 17
- 229920005989 resin Polymers 0.000 claims description 17
- 229920001971 elastomer Polymers 0.000 claims description 15
- KAKZBPTYRLMSJV-UHFFFAOYSA-N butadiene group Chemical group C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 claims description 14
- 239000000806 elastomer Substances 0.000 claims description 14
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 13
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Natural products C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 9
- 125000003342 alkenyl group Chemical group 0.000 claims description 9
- 125000002029 aromatic hydrocarbon group Chemical group 0.000 claims description 8
- MTAZNLWOLGHBHU-UHFFFAOYSA-N butadiene-styrene rubber Chemical compound C=CC=C.C=CC1=CC=CC=C1 MTAZNLWOLGHBHU-UHFFFAOYSA-N 0.000 claims description 8
- 229920001577 copolymer Polymers 0.000 claims description 8
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 4
- 229920002587 poly(1,3-butadiene) polymer Polymers 0.000 claims description 4
- 229920003048 styrene butadiene rubber Polymers 0.000 claims description 4
- NTXGQCSETZTARF-UHFFFAOYSA-N buta-1,3-diene;prop-2-enenitrile Chemical compound C=CC=C.C=CC#N NTXGQCSETZTARF-UHFFFAOYSA-N 0.000 claims description 3
- 125000003011 styrenyl group Chemical group [H]\C(*)=C(/[H])C1=C([H])C([H])=C([H])C([H])=C1[H] 0.000 claims description 3
- 125000000383 tetramethylene group Chemical group [H]C([H])([*:1])C([H])([H])C([H])([H])C([H])([H])[*:2] 0.000 claims description 3
- 239000010410 layer Substances 0.000 claims description 2
- 238000007789 sealing Methods 0.000 claims description 2
- 125000000217 alkyl group Chemical group 0.000 claims 11
- 125000000304 alkynyl group Chemical group 0.000 claims 8
- 239000007788 liquid Substances 0.000 claims 5
- 125000005090 alkenylcarbonyl group Chemical group 0.000 claims 4
- 238000004519 manufacturing process Methods 0.000 claims 4
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 claims 2
- 239000011203 carbon fibre reinforced carbon Substances 0.000 claims 2
- 125000005678 ethenylene group Chemical group [H]C([*:1])=C([H])[*:2] 0.000 claims 2
- 125000000524 functional group Chemical group 0.000 claims 2
- 239000002904 solvent Substances 0.000 claims 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims 2
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 claims 1
- 239000000203 mixture Substances 0.000 claims 1
- 229920006132 styrene block copolymer Polymers 0.000 claims 1
- 239000011248 coating agent Substances 0.000 description 12
- 238000000576 coating method Methods 0.000 description 12
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 9
- 239000011256 inorganic filler Substances 0.000 description 5
- 229910003475 inorganic filler Inorganic materials 0.000 description 5
- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 description 4
- 229920013636 polyphenyl ether polymer Polymers 0.000 description 4
- 239000000377 silicon dioxide Substances 0.000 description 4
- 125000004430 oxygen atom Chemical group O* 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229920001400 block copolymer Polymers 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 229920003244 diene elastomer Polymers 0.000 description 1
- -1 methacryloyl group Chemical group 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2026001025A JP2026062946A (ja) | 2021-10-04 | 2026-01-06 | 樹脂組成物、半導体装置及び半導体装置の製造方法 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021163438 | 2021-10-04 | ||
| PCT/JP2022/034526 WO2023058425A1 (ja) | 2021-10-04 | 2022-09-15 | 樹脂組成物、半導体装置及び半導体装置の製造方法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2026001025A Division JP2026062946A (ja) | 2021-10-04 | 2026-01-06 | 樹脂組成物、半導体装置及び半導体装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023058425A1 JPWO2023058425A1 (https=) | 2023-04-13 |
| JPWO2023058425A5 true JPWO2023058425A5 (https=) | 2025-04-01 |
Family
ID=85804189
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023552778A Pending JPWO2023058425A1 (https=) | 2021-10-04 | 2022-09-15 | |
| JP2026001025A Pending JP2026062946A (ja) | 2021-10-04 | 2026-01-06 | 樹脂組成物、半導体装置及び半導体装置の製造方法 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2026001025A Pending JP2026062946A (ja) | 2021-10-04 | 2026-01-06 | 樹脂組成物、半導体装置及び半導体装置の製造方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20240360310A1 (https=) |
| JP (2) | JPWO2023058425A1 (https=) |
| KR (1) | KR20240073043A (https=) |
| DE (1) | DE112022004813T5 (https=) |
| TW (1) | TW202330718A (https=) |
| WO (1) | WO2023058425A1 (https=) |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010192938A (ja) | 2010-06-07 | 2010-09-02 | Fujikura Ltd | 半導体装置 |
| JP2015090926A (ja) * | 2013-11-06 | 2015-05-11 | 日立化成株式会社 | 半導体装置製造用フィルム、これを用いた半導体装置、及び半導体装置の製造方法 |
| JP6458985B2 (ja) * | 2014-10-22 | 2019-01-30 | ナミックス株式会社 | 樹脂組成物、それを用いた絶縁フィルムおよび半導体装置 |
| JP2017092152A (ja) | 2015-11-05 | 2017-05-25 | 日立化成デュポンマイクロシステムズ株式会社 | 多層体、その製造方法及び半導体装置 |
| CN111372961A (zh) * | 2017-11-24 | 2020-07-03 | 纳美仕有限公司 | 热固性树脂组合物、绝缘性膜、层间绝缘性膜、多层线路板及半导体装置 |
| JP7137950B2 (ja) * | 2018-03-28 | 2022-09-15 | 三井金属鉱業株式会社 | 樹脂組成物、樹脂付銅箔、プリント配線板、及び樹脂付銅箔の処理方法 |
| TWI882958B (zh) * | 2018-07-20 | 2025-05-11 | 日商三菱瓦斯化學股份有限公司 | 樹脂組成物、預浸體、覆金屬箔疊層板、樹脂片、以及印刷配線板 |
-
2022
- 2022-09-15 DE DE112022004813.1T patent/DE112022004813T5/de active Pending
- 2022-09-15 US US18/689,720 patent/US20240360310A1/en active Pending
- 2022-09-15 KR KR1020247010951A patent/KR20240073043A/ko active Pending
- 2022-09-15 WO PCT/JP2022/034526 patent/WO2023058425A1/ja not_active Ceased
- 2022-09-15 JP JP2023552778A patent/JPWO2023058425A1/ja active Pending
- 2022-09-27 TW TW111136556A patent/TW202330718A/zh unknown
-
2026
- 2026-01-06 JP JP2026001025A patent/JP2026062946A/ja active Pending
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