DE112022004813T5 - Harzzusammensetzung, halbleitervorrichtung, und verfahren zur herstellung einer halbleitervorrichtung - Google Patents

Harzzusammensetzung, halbleitervorrichtung, und verfahren zur herstellung einer halbleitervorrichtung Download PDF

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Publication number
DE112022004813T5
DE112022004813T5 DE112022004813.1T DE112022004813T DE112022004813T5 DE 112022004813 T5 DE112022004813 T5 DE 112022004813T5 DE 112022004813 T DE112022004813 T DE 112022004813T DE 112022004813 T5 DE112022004813 T5 DE 112022004813T5
Authority
DE
Germany
Prior art keywords
resin composition
group
butadiene
integer
styrene
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE112022004813.1T
Other languages
German (de)
English (en)
Inventor
Hirotatsu Ikarashi
Masaki Yoshida
Toshiyuki Sato
Shin Teraki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Namics Corp
Original Assignee
Namics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Namics Corp filed Critical Namics Corp
Publication of DE112022004813T5 publication Critical patent/DE112022004813T5/de
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
    • C08L71/126—Polyphenylene oxides modified by chemical after-treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L53/02—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
DE112022004813.1T 2021-10-04 2022-09-15 Harzzusammensetzung, halbleitervorrichtung, und verfahren zur herstellung einer halbleitervorrichtung Pending DE112022004813T5 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021163438 2021-10-04
JP2021-163438 2021-10-04
PCT/JP2022/034526 WO2023058425A1 (ja) 2021-10-04 2022-09-15 樹脂組成物、半導体装置及び半導体装置の製造方法

Publications (1)

Publication Number Publication Date
DE112022004813T5 true DE112022004813T5 (de) 2024-07-18

Family

ID=85804189

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112022004813.1T Pending DE112022004813T5 (de) 2021-10-04 2022-09-15 Harzzusammensetzung, halbleitervorrichtung, und verfahren zur herstellung einer halbleitervorrichtung

Country Status (6)

Country Link
US (1) US20240360310A1 (https=)
JP (2) JPWO2023058425A1 (https=)
KR (1) KR20240073043A (https=)
DE (1) DE112022004813T5 (https=)
TW (1) TW202330718A (https=)
WO (1) WO2023058425A1 (https=)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010192938A (ja) 2010-06-07 2010-09-02 Fujikura Ltd 半導体装置
JP2017092152A (ja) 2015-11-05 2017-05-25 日立化成デュポンマイクロシステムズ株式会社 多層体、その製造方法及び半導体装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015090926A (ja) * 2013-11-06 2015-05-11 日立化成株式会社 半導体装置製造用フィルム、これを用いた半導体装置、及び半導体装置の製造方法
JP6458985B2 (ja) * 2014-10-22 2019-01-30 ナミックス株式会社 樹脂組成物、それを用いた絶縁フィルムおよび半導体装置
CN111372961A (zh) * 2017-11-24 2020-07-03 纳美仕有限公司 热固性树脂组合物、绝缘性膜、层间绝缘性膜、多层线路板及半导体装置
JP7137950B2 (ja) * 2018-03-28 2022-09-15 三井金属鉱業株式会社 樹脂組成物、樹脂付銅箔、プリント配線板、及び樹脂付銅箔の処理方法
TWI882958B (zh) * 2018-07-20 2025-05-11 日商三菱瓦斯化學股份有限公司 樹脂組成物、預浸體、覆金屬箔疊層板、樹脂片、以及印刷配線板

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010192938A (ja) 2010-06-07 2010-09-02 Fujikura Ltd 半導体装置
JP2017092152A (ja) 2015-11-05 2017-05-25 日立化成デュポンマイクロシステムズ株式会社 多層体、その製造方法及び半導体装置

Also Published As

Publication number Publication date
US20240360310A1 (en) 2024-10-31
TW202330718A (zh) 2023-08-01
WO2023058425A1 (ja) 2023-04-13
JPWO2023058425A1 (https=) 2023-04-13
JP2026062946A (ja) 2026-04-10
KR20240073043A (ko) 2024-05-24

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