KR20240073043A - 수지 조성물, 반도체 장치 및 반도체 장치의 제조 방법 - Google Patents

수지 조성물, 반도체 장치 및 반도체 장치의 제조 방법 Download PDF

Info

Publication number
KR20240073043A
KR20240073043A KR1020247010951A KR20247010951A KR20240073043A KR 20240073043 A KR20240073043 A KR 20240073043A KR 1020247010951 A KR1020247010951 A KR 1020247010951A KR 20247010951 A KR20247010951 A KR 20247010951A KR 20240073043 A KR20240073043 A KR 20240073043A
Authority
KR
South Korea
Prior art keywords
group
resin composition
formula
component
integer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020247010951A
Other languages
English (en)
Korean (ko)
Inventor
히로타츠 이카라시
마사키 요시다
도시유키 사토
신 데라키
Original Assignee
나믹스 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 나믹스 가부시끼가이샤 filed Critical 나믹스 가부시끼가이샤
Publication of KR20240073043A publication Critical patent/KR20240073043A/ko
Pending legal-status Critical Current

Links

Classifications

    • H01L23/29—
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
    • C08L71/126—Polyphenylene oxides modified by chemical after-treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L53/02—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
    • H01L23/31—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
KR1020247010951A 2021-10-04 2022-09-15 수지 조성물, 반도체 장치 및 반도체 장치의 제조 방법 Pending KR20240073043A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021163438 2021-10-04
JPJP-P-2021-163438 2021-10-04
PCT/JP2022/034526 WO2023058425A1 (ja) 2021-10-04 2022-09-15 樹脂組成物、半導体装置及び半導体装置の製造方法

Publications (1)

Publication Number Publication Date
KR20240073043A true KR20240073043A (ko) 2024-05-24

Family

ID=85804189

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020247010951A Pending KR20240073043A (ko) 2021-10-04 2022-09-15 수지 조성물, 반도체 장치 및 반도체 장치의 제조 방법

Country Status (6)

Country Link
US (1) US20240360310A1 (https=)
JP (2) JPWO2023058425A1 (https=)
KR (1) KR20240073043A (https=)
DE (1) DE112022004813T5 (https=)
TW (1) TW202330718A (https=)
WO (1) WO2023058425A1 (https=)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010192938A (ja) 2010-06-07 2010-09-02 Fujikura Ltd 半導体装置
JP2017092152A (ja) 2015-11-05 2017-05-25 日立化成デュポンマイクロシステムズ株式会社 多層体、その製造方法及び半導体装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015090926A (ja) * 2013-11-06 2015-05-11 日立化成株式会社 半導体装置製造用フィルム、これを用いた半導体装置、及び半導体装置の製造方法
JP6458985B2 (ja) * 2014-10-22 2019-01-30 ナミックス株式会社 樹脂組成物、それを用いた絶縁フィルムおよび半導体装置
CN111372961A (zh) * 2017-11-24 2020-07-03 纳美仕有限公司 热固性树脂组合物、绝缘性膜、层间绝缘性膜、多层线路板及半导体装置
JP7137950B2 (ja) * 2018-03-28 2022-09-15 三井金属鉱業株式会社 樹脂組成物、樹脂付銅箔、プリント配線板、及び樹脂付銅箔の処理方法
TWI882958B (zh) * 2018-07-20 2025-05-11 日商三菱瓦斯化學股份有限公司 樹脂組成物、預浸體、覆金屬箔疊層板、樹脂片、以及印刷配線板

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010192938A (ja) 2010-06-07 2010-09-02 Fujikura Ltd 半導体装置
JP2017092152A (ja) 2015-11-05 2017-05-25 日立化成デュポンマイクロシステムズ株式会社 多層体、その製造方法及び半導体装置

Also Published As

Publication number Publication date
US20240360310A1 (en) 2024-10-31
DE112022004813T5 (de) 2024-07-18
TW202330718A (zh) 2023-08-01
WO2023058425A1 (ja) 2023-04-13
JPWO2023058425A1 (https=) 2023-04-13
JP2026062946A (ja) 2026-04-10

Similar Documents

Publication Publication Date Title
JP6458985B2 (ja) 樹脂組成物、それを用いた絶縁フィルムおよび半導体装置
TWI682963B (zh) 樹脂組成物、使用其之絕緣薄膜及半導體裝置
JP7444154B2 (ja) 樹脂組成物
TWI910362B (zh) 樹脂組成物及其製造方法以及接著薄膜及層間接著用黏合片
CN108239501B (zh) 胶粘剂组合物及包含其的复合基材
EP3856840B1 (en) Epoxy resin composition
JP2016213321A (ja) 半導体装置の製造方法及び半導体装置
EP3925993B1 (en) Photocurable resin composition and cured product obtained by curing same
TW202216833A (zh) 樹脂組成物
JP2009245715A (ja) 絶縁シート及び積層構造体
KR20240073043A (ko) 수지 조성물, 반도체 장치 및 반도체 장치의 제조 방법
TWI795825B (zh) 黏接劑組成物
WO2022224473A1 (ja) 配線基板
KR20250154396A (ko) 반도체 장치 및 수지 조성물
JP7839364B2 (ja) 組成物、エポキシ樹脂組成物、フィルム、プリント配線板、半導体チップパッケージ、及び電子装置
JP7714976B2 (ja) 感光性樹脂組成物
JPWO2023058425A5 (https=)
JP2023046035A (ja) 感光性樹脂組成物
KR20250170599A (ko) 배선판의 제조방법
TW202600645A (zh) 樹脂組成物、預浸體、附有樹脂的金屬箔、積層板、印刷線路板及半導體封裝體
JP2022094712A (ja) 熱硬化性樹脂組成物、樹脂膜、キャリア付樹脂膜、プリプレグ、積層板、プリント配線基板および半導体装置

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
D13 Search requested

Free format text: ST27 STATUS EVENT CODE: A-1-2-D10-D13-SRH-X000 (AS PROVIDED BY THE NATIONAL OFFICE)

D13-X000 Search requested

St.27 status event code: A-1-2-D10-D13-srh-X000

D14 Search report completed

Free format text: ST27 STATUS EVENT CODE: A-1-2-D10-D14-SRH-X000 (AS PROVIDED BY THE NATIONAL OFFICE)

D14-X000 Search report completed

St.27 status event code: A-1-2-D10-D14-srh-X000

D21 Rejection of application intended

Free format text: ST27 STATUS EVENT CODE: A-1-2-D10-D21-EXM-PE0902 (AS PROVIDED BY THE NATIONAL OFFICE)

PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

P11 Amendment of application requested

Free format text: ST27 STATUS EVENT CODE: A-2-2-P10-P11-NAP-X000 (AS PROVIDED BY THE NATIONAL OFFICE)

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000