JPWO2023058425A1 - - Google Patents
Info
- Publication number
- JPWO2023058425A1 JPWO2023058425A1 JP2023552778A JP2023552778A JPWO2023058425A1 JP WO2023058425 A1 JPWO2023058425 A1 JP WO2023058425A1 JP 2023552778 A JP2023552778 A JP 2023552778A JP 2023552778 A JP2023552778 A JP 2023552778A JP WO2023058425 A1 JPWO2023058425 A1 JP WO2023058425A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
- C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
- C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
- C08L71/12—Polyphenylene oxides
- C08L71/126—Polyphenylene oxides modified by chemical after-treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
- C08L53/02—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
- C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
- C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
- C08L71/12—Polyphenylene oxides
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
- H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Macromonomer-Based Addition Polymer (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2026001025A JP2026062946A (ja) | 2021-10-04 | 2026-01-06 | 樹脂組成物、半導体装置及び半導体装置の製造方法 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021163438 | 2021-10-04 | ||
| PCT/JP2022/034526 WO2023058425A1 (ja) | 2021-10-04 | 2022-09-15 | 樹脂組成物、半導体装置及び半導体装置の製造方法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2026001025A Division JP2026062946A (ja) | 2021-10-04 | 2026-01-06 | 樹脂組成物、半導体装置及び半導体装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023058425A1 true JPWO2023058425A1 (https=) | 2023-04-13 |
| JPWO2023058425A5 JPWO2023058425A5 (https=) | 2025-04-01 |
Family
ID=85804189
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023552778A Pending JPWO2023058425A1 (https=) | 2021-10-04 | 2022-09-15 | |
| JP2026001025A Pending JP2026062946A (ja) | 2021-10-04 | 2026-01-06 | 樹脂組成物、半導体装置及び半導体装置の製造方法 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2026001025A Pending JP2026062946A (ja) | 2021-10-04 | 2026-01-06 | 樹脂組成物、半導体装置及び半導体装置の製造方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20240360310A1 (https=) |
| JP (2) | JPWO2023058425A1 (https=) |
| KR (1) | KR20240073043A (https=) |
| DE (1) | DE112022004813T5 (https=) |
| TW (1) | TW202330718A (https=) |
| WO (1) | WO2023058425A1 (https=) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015090926A (ja) * | 2013-11-06 | 2015-05-11 | 日立化成株式会社 | 半導体装置製造用フィルム、これを用いた半導体装置、及び半導体装置の製造方法 |
| JP2016079354A (ja) * | 2014-10-22 | 2016-05-16 | ナミックス株式会社 | 樹脂組成物、それを用いた絶縁フィルムおよび半導体装置 |
| WO2019103086A1 (ja) * | 2017-11-24 | 2019-05-31 | ナミックス株式会社 | 熱硬化性樹脂組成物、絶縁性フィルム、層間絶縁性フィルム、多層配線板、および半導体装置 |
| JP2019172803A (ja) * | 2018-03-28 | 2019-10-10 | 三井金属鉱業株式会社 | 樹脂組成物、樹脂付銅箔、プリント配線板、及び樹脂付銅箔の処理方法 |
| WO2020017412A1 (ja) * | 2018-07-20 | 2020-01-23 | 三菱瓦斯化学株式会社 | 樹脂組成物、プリプレグ、金属箔張積層板、樹脂シートおよびプリント配線板 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010192938A (ja) | 2010-06-07 | 2010-09-02 | Fujikura Ltd | 半導体装置 |
| JP2017092152A (ja) | 2015-11-05 | 2017-05-25 | 日立化成デュポンマイクロシステムズ株式会社 | 多層体、その製造方法及び半導体装置 |
-
2022
- 2022-09-15 DE DE112022004813.1T patent/DE112022004813T5/de active Pending
- 2022-09-15 US US18/689,720 patent/US20240360310A1/en active Pending
- 2022-09-15 KR KR1020247010951A patent/KR20240073043A/ko active Pending
- 2022-09-15 WO PCT/JP2022/034526 patent/WO2023058425A1/ja not_active Ceased
- 2022-09-15 JP JP2023552778A patent/JPWO2023058425A1/ja active Pending
- 2022-09-27 TW TW111136556A patent/TW202330718A/zh unknown
-
2026
- 2026-01-06 JP JP2026001025A patent/JP2026062946A/ja active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015090926A (ja) * | 2013-11-06 | 2015-05-11 | 日立化成株式会社 | 半導体装置製造用フィルム、これを用いた半導体装置、及び半導体装置の製造方法 |
| JP2016079354A (ja) * | 2014-10-22 | 2016-05-16 | ナミックス株式会社 | 樹脂組成物、それを用いた絶縁フィルムおよび半導体装置 |
| WO2019103086A1 (ja) * | 2017-11-24 | 2019-05-31 | ナミックス株式会社 | 熱硬化性樹脂組成物、絶縁性フィルム、層間絶縁性フィルム、多層配線板、および半導体装置 |
| JP2019172803A (ja) * | 2018-03-28 | 2019-10-10 | 三井金属鉱業株式会社 | 樹脂組成物、樹脂付銅箔、プリント配線板、及び樹脂付銅箔の処理方法 |
| WO2020017412A1 (ja) * | 2018-07-20 | 2020-01-23 | 三菱瓦斯化学株式会社 | 樹脂組成物、プリプレグ、金属箔張積層板、樹脂シートおよびプリント配線板 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20240360310A1 (en) | 2024-10-31 |
| DE112022004813T5 (de) | 2024-07-18 |
| TW202330718A (zh) | 2023-08-01 |
| WO2023058425A1 (ja) | 2023-04-13 |
| JP2026062946A (ja) | 2026-04-10 |
| KR20240073043A (ko) | 2024-05-24 |
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