JPWO2023054010A5 - - Google Patents
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- JPWO2023054010A5 JPWO2023054010A5 JP2023551323A JP2023551323A JPWO2023054010A5 JP WO2023054010 A5 JPWO2023054010 A5 JP WO2023054010A5 JP 2023551323 A JP2023551323 A JP 2023551323A JP 2023551323 A JP2023551323 A JP 2023551323A JP WO2023054010 A5 JPWO2023054010 A5 JP WO2023054010A5
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- JP
- Japan
- Prior art keywords
- substrate
- modified layer
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- imaging mechanism
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021161384 | 2021-09-30 | ||
| JP2021161384 | 2021-09-30 | ||
| PCT/JP2022/034699 WO2023054010A1 (ja) | 2021-09-30 | 2022-09-16 | 処理方法及び処理システム |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2023054010A1 JPWO2023054010A1 (https=) | 2023-04-06 |
| JPWO2023054010A5 true JPWO2023054010A5 (https=) | 2024-06-11 |
| JP7780534B2 JP7780534B2 (ja) | 2025-12-04 |
Family
ID=85782507
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023551323A Active JP7780534B2 (ja) | 2021-09-30 | 2022-09-16 | 処理方法及び処理システム |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20240404852A1 (https=) |
| JP (1) | JP7780534B2 (https=) |
| KR (1) | KR20240073916A (https=) |
| CN (1) | CN117999636A (https=) |
| TW (1) | TW202322245A (https=) |
| WO (1) | WO2023054010A1 (https=) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102903522B1 (ko) * | 2020-04-02 | 2025-12-23 | 도쿄엘렉트론가부시키가이샤 | 기판 처리 방법 및 기판 처리 장치 |
| JP2024041253A (ja) * | 2022-09-14 | 2024-03-27 | 株式会社ディスコ | ウエーハの加工方法及び加工装置 |
| WO2026034066A1 (ja) * | 2024-08-05 | 2026-02-12 | 東京エレクトロン株式会社 | 基板処理システム及び基板処理方法 |
| WO2026034270A1 (ja) * | 2024-08-09 | 2026-02-12 | 東京エレクトロン株式会社 | 基板処理システム及び基板処理方法 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118263105A (zh) | 2018-03-14 | 2024-06-28 | 东京毅力科创株式会社 | 基板处理系统、基板处理方法以及计算机存储介质 |
| JP7412131B2 (ja) * | 2019-10-28 | 2024-01-12 | 東京エレクトロン株式会社 | 基板処理方法及び基板処理システム |
| JP7398242B2 (ja) * | 2019-10-28 | 2023-12-14 | 東京エレクトロン株式会社 | 基板処理方法及び基板処理システム |
| JP7412161B2 (ja) * | 2019-12-23 | 2024-01-12 | 東京エレクトロン株式会社 | 基板処理装置及び基板処理方法 |
| JP7386075B2 (ja) * | 2019-12-25 | 2023-11-24 | 東京エレクトロン株式会社 | 基板処理方法及び基板処理システム |
-
2022
- 2022-09-16 KR KR1020247013518A patent/KR20240073916A/ko active Pending
- 2022-09-16 US US18/697,028 patent/US20240404852A1/en active Pending
- 2022-09-16 WO PCT/JP2022/034699 patent/WO2023054010A1/ja not_active Ceased
- 2022-09-16 CN CN202280064190.6A patent/CN117999636A/zh active Pending
- 2022-09-16 JP JP2023551323A patent/JP7780534B2/ja active Active
- 2022-09-21 TW TW111135623A patent/TW202322245A/zh unknown
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