JPWO2023157566A5 - - Google Patents

Download PDF

Info

Publication number
JPWO2023157566A5
JPWO2023157566A5 JP2024501044A JP2024501044A JPWO2023157566A5 JP WO2023157566 A5 JPWO2023157566 A5 JP WO2023157566A5 JP 2024501044 A JP2024501044 A JP 2024501044A JP 2024501044 A JP2024501044 A JP 2024501044A JP WO2023157566 A5 JPWO2023157566 A5 JP WO2023157566A5
Authority
JP
Japan
Prior art keywords
substrate
laser light
outer edge
amount
interface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2024501044A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023157566A1 (https=
JP7851390B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/001867 external-priority patent/WO2023157566A1/ja
Publication of JPWO2023157566A1 publication Critical patent/JPWO2023157566A1/ja
Publication of JPWO2023157566A5 publication Critical patent/JPWO2023157566A5/ja
Application granted granted Critical
Publication of JP7851390B2 publication Critical patent/JP7851390B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2024501044A 2022-02-18 2023-01-23 処理方法及び処理システム Active JP7851390B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022024175 2022-02-18
JP2022024175 2022-02-18
PCT/JP2023/001867 WO2023157566A1 (ja) 2022-02-18 2023-01-23 処理方法及び処理システム

Publications (3)

Publication Number Publication Date
JPWO2023157566A1 JPWO2023157566A1 (https=) 2023-08-24
JPWO2023157566A5 true JPWO2023157566A5 (https=) 2024-10-18
JP7851390B2 JP7851390B2 (ja) 2026-04-24

Family

ID=87578373

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024501044A Active JP7851390B2 (ja) 2022-02-18 2023-01-23 処理方法及び処理システム

Country Status (6)

Country Link
US (1) US20250153278A1 (https=)
JP (1) JP7851390B2 (https=)
KR (1) KR20240148891A (https=)
CN (1) CN118661245A (https=)
TW (1) TW202338958A (https=)
WO (1) WO2023157566A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024127237A (ja) * 2023-03-09 2024-09-20 株式会社ディスコ ウエーハの加工方法
WO2025216062A1 (ja) * 2024-04-09 2025-10-16 東京エレクトロン株式会社 基板処理システム、基板処理方法及びコンピュータ記憶媒体
WO2026034270A1 (ja) * 2024-08-09 2026-02-12 東京エレクトロン株式会社 基板処理システム及び基板処理方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118263105A (zh) 2018-03-14 2024-06-28 东京毅力科创株式会社 基板处理系统、基板处理方法以及计算机存储介质
JP7034797B2 (ja) * 2018-03-28 2022-03-14 株式会社東京精密 貼り合せ基板の測定方法および加工方法並びにそれらに用いる装置
KR102903523B1 (ko) * 2018-04-27 2025-12-23 도쿄엘렉트론가부시키가이샤 기판 처리 시스템 및 기판 처리 방법
EP3872840A4 (en) * 2018-10-23 2022-07-27 Tokyo Electron Limited SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD
JP7152290B2 (ja) * 2018-12-14 2022-10-12 株式会社東京精密 貼り合わせウェーハのエッジトリミング加工方法
JP2021174806A (ja) * 2020-04-20 2021-11-01 東京エレクトロン株式会社 基板処理装置及び基板処理方法

Similar Documents

Publication Publication Date Title
JPWO2023157566A5 (https=)
TWI706455B (zh) 晶圓之加工方法
TWI626107B (zh) Plate processing method
JP6210902B2 (ja) レーザー加工溝の検出方法
JP6124547B2 (ja) 加工方法
TWI680821B (zh) 雷射加工裝置
JP2015102389A (ja) ウェーハの検出方法
JP7437958B2 (ja) ウエーハの中心検出方法及びウエーハの中心検出装置
KR20090004609A (ko) 반도체 웨이퍼로의 점착 테이프 부착 방법 및 보호테이프의 박리 방법
JP6466692B2 (ja) ウエーハの加工方法
CN113169057B (zh) 激光加工装置及其控制方法
KR102768026B1 (ko) 웨이퍼의 가공 방법
US12538763B2 (en) Bonded wafer processing method
US20250014949A1 (en) Processing method of wafer
JP2015220447A (ja) リソグラフィ装置、および物品の製造方法
KR102231739B1 (ko) 레이저 광선의 검사 방법
JP2017041472A (ja) 貼り合せ基板の加工方法
JPWO2023054010A5 (https=)
US20250153278A1 (en) Processing method and processing system
CN118629860A (zh) 贴合晶片的加工方法
CN118629861A (zh) 贴合晶片的加工方法
JP5394172B2 (ja) 加工方法
TW201909261A (zh) 晶圓的加工方法
KR20240073916A (ko) 처리 방법 및 처리 시스템
KR20230004673A (ko) 기판 처리 장치 및 기판 처리 방법