JPWO2023053594A5 - - Google Patents

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Publication number
JPWO2023053594A5
JPWO2023053594A5 JP2023551074A JP2023551074A JPWO2023053594A5 JP WO2023053594 A5 JPWO2023053594 A5 JP WO2023053594A5 JP 2023551074 A JP2023551074 A JP 2023551074A JP 2023551074 A JP2023551074 A JP 2023551074A JP WO2023053594 A5 JPWO2023053594 A5 JP WO2023053594A5
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JP
Japan
Prior art keywords
layer
heat transfer
transfer layer
main surface
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023551074A
Other languages
English (en)
Japanese (ja)
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JPWO2023053594A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2022/024172 external-priority patent/WO2023053594A1/ja
Publication of JPWO2023053594A1 publication Critical patent/JPWO2023053594A1/ja
Publication of JPWO2023053594A5 publication Critical patent/JPWO2023053594A5/ja
Pending legal-status Critical Current

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JP2023551074A 2021-09-30 2022-06-16 Pending JPWO2023053594A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021160318 2021-09-30
PCT/JP2022/024172 WO2023053594A1 (ja) 2021-09-30 2022-06-16 チップ抵抗器

Publications (2)

Publication Number Publication Date
JPWO2023053594A1 JPWO2023053594A1 (https=) 2023-04-06
JPWO2023053594A5 true JPWO2023053594A5 (https=) 2024-06-20

Family

ID=85780556

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023551074A Pending JPWO2023053594A1 (https=) 2021-09-30 2022-06-16

Country Status (5)

Country Link
US (1) US20240212890A1 (https=)
JP (1) JPWO2023053594A1 (https=)
CN (1) CN118020117A (https=)
DE (1) DE112022004740T5 (https=)
WO (1) WO2023053594A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024017316A (ja) * 2022-07-27 2024-02-08 株式会社村田製作所 高周波モジュール

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3665385B2 (ja) * 1995-05-15 2005-06-29 ローム株式会社 電子部品
JP4061729B2 (ja) * 1998-09-01 2008-03-19 松下電器産業株式会社 抵抗器およびその製造方法
JP2000277301A (ja) * 1999-03-29 2000-10-06 Taiyo Yuden Co Ltd 伝熱層を有する絶縁基板及び抵抗器
JP2007088161A (ja) * 2005-09-21 2007-04-05 Koa Corp チップ抵抗器
JP2008277638A (ja) 2007-05-01 2008-11-13 Rohm Co Ltd チップ抵抗器及びその製造方法
TW201401305A (zh) * 2012-06-25 2014-01-01 Ralec Electronic Corp 微型金屬片電阻的量產方法
JP2015079872A (ja) * 2013-10-17 2015-04-23 コーア株式会社 チップ抵抗器
US10319501B2 (en) * 2014-02-27 2019-06-11 Panasonic Intellectual Property Management Co., Ltd. Chip resistor
JP6453599B2 (ja) * 2014-09-26 2019-01-16 Koa株式会社 チップ抵抗器の製造方法
DE112018005181B4 (de) * 2017-11-02 2025-04-10 Rohm Co., Ltd. Chip-widerstand
JP7336636B2 (ja) * 2017-12-11 2023-09-01 パナソニックＩｐマネジメント株式会社 チップ抵抗器

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