JP2024059580A5 - - Google Patents
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- Publication number
- JP2024059580A5 JP2024059580A5 JP2023172570A JP2023172570A JP2024059580A5 JP 2024059580 A5 JP2024059580 A5 JP 2024059580A5 JP 2023172570 A JP2023172570 A JP 2023172570A JP 2023172570 A JP2023172570 A JP 2023172570A JP 2024059580 A5 JP2024059580 A5 JP 2024059580A5
- Authority
- JP
- Japan
- Prior art keywords
- axis
- graphite layer
- layer
- power electronics
- cell
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2025207914A JP2026062644A (ja) | 2022-10-18 | 2025-11-28 | ２重のグラファイト層を含むパワーエレクトロニクスデバイスアセンブリ、及びパワーエレクトロニクスデバイスアセンブリを組み込んだ冷却板 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US17/968,162 | 2022-10-18 | ||
| US17/968,162 US12096596B2 (en) | 2022-10-18 | 2022-10-18 | Power electronics device assemblies including dual graphite layers and cold plates incorporating the same |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025207914A Division JP2026062644A (ja) | 2022-10-18 | 2025-11-28 | ２重のグラファイト層を含むパワーエレクトロニクスデバイスアセンブリ、及びパワーエレクトロニクスデバイスアセンブリを組み込んだ冷却板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2024059580A JP2024059580A (ja) | 2024-05-01 |
| JP2024059580A5 true JP2024059580A5 (https=) | 2024-11-15 |
Family
ID=90626053
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023172570A Pending JP2024059580A (ja) | 2022-10-18 | 2023-10-04 | ２重のグラファイト層を含むパワーエレクトロニクスデバイスアセンブリ、及びパワーエレクトロニクスデバイスアセンブリを組み込んだ冷却板 |
| JP2025207914A Pending JP2026062644A (ja) | 2022-10-18 | 2025-11-28 | ２重のグラファイト層を含むパワーエレクトロニクスデバイスアセンブリ、及びパワーエレクトロニクスデバイスアセンブリを組み込んだ冷却板 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025207914A Pending JP2026062644A (ja) | 2022-10-18 | 2025-11-28 | ２重のグラファイト層を含むパワーエレクトロニクスデバイスアセンブリ、及びパワーエレクトロニクスデバイスアセンブリを組み込んだ冷却板 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US12096596B2 (https=) |
| JP (2) | JP2024059580A (https=) |
| CN (1) | CN117915623B (https=) |
Family Cites Families (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005005528A (ja) * | 2003-06-12 | 2005-01-06 | Hitachi Metals Ltd | 半導体素子搭載用モジュール |
| WO2007016649A2 (en) | 2005-08-02 | 2007-02-08 | Satcon Technology Corporation | Double-sided package for power module |
| JP2008028352A (ja) * | 2006-06-02 | 2008-02-07 | Nec Lighting Ltd | 電子機器および電子機器の製造方法 |
| US20090308571A1 (en) | 2008-05-09 | 2009-12-17 | Thermal Centric Corporation | Heat transfer assembly and methods therefor |
| US20150064533A1 (en) * | 2013-08-28 | 2015-03-05 | Robert Bosch Gmbh | Bipolar Solid State Battery with Insulating Package |
| US9741635B2 (en) | 2014-01-21 | 2017-08-22 | Infineon Technologies Austria Ag | Electronic component |
| CN106133901B (zh) * | 2014-04-08 | 2019-05-03 | 松下知识产权经营株式会社 | 热传导片及其制造方法 |
| US9781819B2 (en) | 2015-07-31 | 2017-10-03 | Laird Technologies, Inc. | Multifunctional components for electronic devices and related methods of providing thermal management and board level shielding |
| JP6607792B2 (ja) * | 2016-01-18 | 2019-11-20 | 株式会社豊田中央研究所 | ヒートスプレッダ |
| CN205383911U (zh) | 2016-02-23 | 2016-07-13 | 南通久信石墨科技开发有限公司 | 方块孔式石墨换热器 |
| KR102073256B1 (ko) * | 2016-06-09 | 2020-02-04 | 주식회사 엘지화학 | 다공성 구조의 냉각 겸용 완충 부재를 포함하는 전지모듈 |
| JP7025181B2 (ja) | 2016-11-21 | 2022-02-24 | ローム株式会社 | パワーモジュールおよびその製造方法、グラファイトプレート、および電源装置 |
| EP3355349B1 (en) * | 2017-01-26 | 2022-05-11 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Efficient heat removal from component carrier with embedded diode |
| US10149413B1 (en) * | 2017-07-31 | 2018-12-04 | Toyota Motor Engineering & Manufacturing North America, Inc. | Integrated thermal management assembly for gate drivers and power components |
| JP2021100006A (ja) * | 2018-03-28 | 2021-07-01 | 株式会社カネカ | 半導体パッケージ |
| CN113169144B (zh) * | 2018-12-03 | 2023-11-10 | 罗姆股份有限公司 | 半导体装置 |
| US11832419B2 (en) * | 2019-12-20 | 2023-11-28 | Intel Corporation | Full package vapor chamber with IHS |
| US11602044B2 (en) * | 2020-07-30 | 2023-03-07 | Toyota Motor Engineering & Manufacturing North America, Inc. | Driver board assemblies and methods of forming the same |
| US11849539B2 (en) * | 2020-08-13 | 2023-12-19 | Toyota Motor Engineering & Manufacturing North America, Inc. | Embedded cooling systems utilizing heat pipes |
| JP7631792B2 (ja) * | 2020-12-24 | 2025-02-19 | セイコーエプソン株式会社 | 積層構造体、熱伝導構造体、及び熱伝導構造体の製造方法 |
| US12156344B2 (en) * | 2021-07-09 | 2024-11-26 | Toyota Motor Engineering & Manufacturing North America, Inc. | Systems and methods of 3D-printing a circuit board on a heat sink assembly having power devices bonded thereto |
| US11582866B1 (en) * | 2021-07-22 | 2023-02-14 | Toyota Motor Engineering & Manufacturing North America, Inc. | Systems including a power device-embedded PCB directly joined with a cooling assembly and method of forming the same |
| US11997838B2 (en) * | 2022-02-01 | 2024-05-28 | Toyota Motor Engineering & Manufacturing North America, Inc. | Power device assemblies and methods of fabricating the same |
| US11869760B1 (en) * | 2022-07-27 | 2024-01-09 | Toyota Motor Engineering & Manufacturing North America, Inc. | Power electronic device assemblies having an electrically insulating layer |
| US12165954B2 (en) * | 2022-08-19 | 2024-12-10 | Toyota Motor Engineering & Manufacturing North America Inc. | Cold plates incorporating S-cells |
| US12207450B2 (en) * | 2022-08-19 | 2025-01-21 | Toyota Motor Engineering & Manufacturing North America Inc. | Cold plates incorporating reactive multilayer systems and S-cells |
-
2022
- 2022-10-18 US US17/968,162 patent/US12096596B2/en active Active
-
2023
- 2023-10-04 JP JP2023172570A patent/JP2024059580A/ja active Pending
- 2023-10-18 CN CN202311352452.1A patent/CN117915623B/zh active Active
-
2025
- 2025-11-28 JP JP2025207914A patent/JP2026062644A/ja active Pending
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