CN117915623B - 包括双石墨层的电力电子设备组件和包含该组件的冷板 - Google Patents

包括双石墨层的电力电子设备组件和包含该组件的冷板

Info

Publication number
CN117915623B
CN117915623B CN202311352452.1A CN202311352452A CN117915623B CN 117915623 B CN117915623 B CN 117915623B CN 202311352452 A CN202311352452 A CN 202311352452A CN 117915623 B CN117915623 B CN 117915623B
Authority
CN
China
Prior art keywords
power electronics
layer
graphite layer
graphite
assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202311352452.1A
Other languages
English (en)
Chinese (zh)
Other versions
CN117915623A (zh
Inventor
樊天竺
周锋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Toyota Motor Corp
Mirise Technologies Corp
Original Assignee
Toyota Motor Engineering and Manufacturing North America Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyota Motor Engineering and Manufacturing North America Inc filed Critical Toyota Motor Engineering and Manufacturing North America Inc
Publication of CN117915623A publication Critical patent/CN117915623A/zh
Application granted granted Critical
Publication of CN117915623B publication Critical patent/CN117915623B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20254—Cold plates transferring heat from heat source to coolant
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
    • H05K7/20854—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20927—Liquid coolant without phase change
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
CN202311352452.1A 2022-10-18 2023-10-18 包括双石墨层的电力电子设备组件和包含该组件的冷板 Active CN117915623B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US17/968,162 2022-10-18
US17/968,162 US12096596B2 (en) 2022-10-18 2022-10-18 Power electronics device assemblies including dual graphite layers and cold plates incorporating the same

Publications (2)

Publication Number Publication Date
CN117915623A CN117915623A (zh) 2024-04-19
CN117915623B true CN117915623B (zh) 2025-09-26

Family

ID=90626053

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202311352452.1A Active CN117915623B (zh) 2022-10-18 2023-10-18 包括双石墨层的电力电子设备组件和包含该组件的冷板

Country Status (3)

Country Link
US (1) US12096596B2 (https=)
JP (2) JP2024059580A (https=)
CN (1) CN117915623B (https=)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005005528A (ja) * 2003-06-12 2005-01-06 Hitachi Metals Ltd 半導体素子搭載用モジュール

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WO2007016649A2 (en) 2005-08-02 2007-02-08 Satcon Technology Corporation Double-sided package for power module
JP2008028352A (ja) * 2006-06-02 2008-02-07 Nec Lighting Ltd 電子機器および電子機器の製造方法
US20090308571A1 (en) 2008-05-09 2009-12-17 Thermal Centric Corporation Heat transfer assembly and methods therefor
US20150064533A1 (en) * 2013-08-28 2015-03-05 Robert Bosch Gmbh Bipolar Solid State Battery with Insulating Package
US9741635B2 (en) 2014-01-21 2017-08-22 Infineon Technologies Austria Ag Electronic component
CN106133901B (zh) * 2014-04-08 2019-05-03 松下知识产权经营株式会社 热传导片及其制造方法
US9781819B2 (en) 2015-07-31 2017-10-03 Laird Technologies, Inc. Multifunctional components for electronic devices and related methods of providing thermal management and board level shielding
JP6607792B2 (ja) * 2016-01-18 2019-11-20 株式会社豊田中央研究所 ヒートスプレッダ
CN205383911U (zh) 2016-02-23 2016-07-13 南通久信石墨科技开发有限公司 方块孔式石墨换热器
KR102073256B1 (ko) * 2016-06-09 2020-02-04 주식회사 엘지화학 다공성 구조의 냉각 겸용 완충 부재를 포함하는 전지모듈
JP7025181B2 (ja) 2016-11-21 2022-02-24 ローム株式会社 パワーモジュールおよびその製造方法、グラファイトプレート、および電源装置
EP3355349B1 (en) * 2017-01-26 2022-05-11 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Efficient heat removal from component carrier with embedded diode
US10149413B1 (en) * 2017-07-31 2018-12-04 Toyota Motor Engineering & Manufacturing North America, Inc. Integrated thermal management assembly for gate drivers and power components
JP2021100006A (ja) * 2018-03-28 2021-07-01 株式会社カネカ 半導体パッケージ
CN113169144B (zh) * 2018-12-03 2023-11-10 罗姆股份有限公司 半导体装置
US11832419B2 (en) * 2019-12-20 2023-11-28 Intel Corporation Full package vapor chamber with IHS
US11602044B2 (en) * 2020-07-30 2023-03-07 Toyota Motor Engineering & Manufacturing North America, Inc. Driver board assemblies and methods of forming the same
US11849539B2 (en) * 2020-08-13 2023-12-19 Toyota Motor Engineering & Manufacturing North America, Inc. Embedded cooling systems utilizing heat pipes
JP7631792B2 (ja) * 2020-12-24 2025-02-19 セイコーエプソン株式会社 積層構造体、熱伝導構造体、及び熱伝導構造体の製造方法
US12156344B2 (en) * 2021-07-09 2024-11-26 Toyota Motor Engineering & Manufacturing North America, Inc. Systems and methods of 3D-printing a circuit board on a heat sink assembly having power devices bonded thereto
US11582866B1 (en) * 2021-07-22 2023-02-14 Toyota Motor Engineering & Manufacturing North America, Inc. Systems including a power device-embedded PCB directly joined with a cooling assembly and method of forming the same
US11997838B2 (en) * 2022-02-01 2024-05-28 Toyota Motor Engineering & Manufacturing North America, Inc. Power device assemblies and methods of fabricating the same
US11869760B1 (en) * 2022-07-27 2024-01-09 Toyota Motor Engineering & Manufacturing North America, Inc. Power electronic device assemblies having an electrically insulating layer
US12165954B2 (en) * 2022-08-19 2024-12-10 Toyota Motor Engineering & Manufacturing North America Inc. Cold plates incorporating S-cells
US12207450B2 (en) * 2022-08-19 2025-01-21 Toyota Motor Engineering & Manufacturing North America Inc. Cold plates incorporating reactive multilayer systems and S-cells

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005005528A (ja) * 2003-06-12 2005-01-06 Hitachi Metals Ltd 半導体素子搭載用モジュール

Also Published As

Publication number Publication date
US12096596B2 (en) 2024-09-17
JP2026062644A (ja) 2026-04-10
JP2024059580A (ja) 2024-05-01
CN117915623A (zh) 2024-04-19
US20240130076A1 (en) 2024-04-18

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Effective date of registration: 20260311

Address after: Japan

Patentee after: Toyota Motor Corporation

Country or region after: Japan

Patentee after: Future Vision Technology Co.,Ltd.

Patentee after: DENSO Corp.

Address before: Texas in the United States

Patentee before: TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, Inc.

Country or region before: U.S.A.