JP2024059580A - ２重のグラファイト層を含むパワーエレクトロニクスデバイスアセンブリ、及びパワーエレクトロニクスデバイスアセンブリを組み込んだ冷却板 - Google Patents

２重のグラファイト層を含むパワーエレクトロニクスデバイスアセンブリ、及びパワーエレクトロニクスデバイスアセンブリを組み込んだ冷却板 Download PDF

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Publication number
JP2024059580A
JP2024059580A JP2023172570A JP2023172570A JP2024059580A JP 2024059580 A JP2024059580 A JP 2024059580A JP 2023172570 A JP2023172570 A JP 2023172570A JP 2023172570 A JP2023172570 A JP 2023172570A JP 2024059580 A JP2024059580 A JP 2024059580A
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JP
Japan
Prior art keywords
layer
axis
cell
graphite layer
electronic device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023172570A
Other languages
English (en)
Japanese (ja)
Other versions
JP2024059580A5 (https=
Inventor
ティエンチュー ファン
Tianzhu Fan
チョウ フォン
Zhou Feng
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyota Motor Engineering and Manufacturing North America Inc
Original Assignee
Toyota Motor Engineering and Manufacturing North America Inc
Toyota Engineering and Manufacturing North America Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyota Motor Engineering and Manufacturing North America Inc, Toyota Engineering and Manufacturing North America Inc filed Critical Toyota Motor Engineering and Manufacturing North America Inc
Publication of JP2024059580A publication Critical patent/JP2024059580A/ja
Publication of JP2024059580A5 publication Critical patent/JP2024059580A5/ja
Priority to JP2025207914A priority Critical patent/JP2026062644A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20254—Cold plates transferring heat from heat source to coolant
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
    • H05K7/20854—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20927—Liquid coolant without phase change
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP2023172570A 2022-10-18 2023-10-04 ２重のグラファイト層を含むパワーエレクトロニクスデバイスアセンブリ、及びパワーエレクトロニクスデバイスアセンブリを組み込んだ冷却板 Pending JP2024059580A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2025207914A JP2026062644A (ja) 2022-10-18 2025-11-28 ２重のグラファイト層を含むパワーエレクトロニクスデバイスアセンブリ、及びパワーエレクトロニクスデバイスアセンブリを組み込んだ冷却板

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US17/968,162 2022-10-18
US17/968,162 US12096596B2 (en) 2022-10-18 2022-10-18 Power electronics device assemblies including dual graphite layers and cold plates incorporating the same

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2025207914A Division JP2026062644A (ja) 2022-10-18 2025-11-28 ２重のグラファイト層を含むパワーエレクトロニクスデバイスアセンブリ、及びパワーエレクトロニクスデバイスアセンブリを組み込んだ冷却板

Publications (2)

Publication Number Publication Date
JP2024059580A true JP2024059580A (ja) 2024-05-01
JP2024059580A5 JP2024059580A5 (https=) 2024-11-15

Family

ID=90626053

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2023172570A Pending JP2024059580A (ja) 2022-10-18 2023-10-04 ２重のグラファイト層を含むパワーエレクトロニクスデバイスアセンブリ、及びパワーエレクトロニクスデバイスアセンブリを組み込んだ冷却板
JP2025207914A Pending JP2026062644A (ja) 2022-10-18 2025-11-28 ２重のグラファイト層を含むパワーエレクトロニクスデバイスアセンブリ、及びパワーエレクトロニクスデバイスアセンブリを組み込んだ冷却板

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2025207914A Pending JP2026062644A (ja) 2022-10-18 2025-11-28 ２重のグラファイト層を含むパワーエレクトロニクスデバイスアセンブリ、及びパワーエレクトロニクスデバイスアセンブリを組み込んだ冷却板

Country Status (3)

Country Link
US (1) US12096596B2 (https=)
JP (2) JP2024059580A (https=)
CN (1) CN117915623B (https=)

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JP2017130494A (ja) * 2016-01-18 2017-07-27 株式会社豊田中央研究所 ヒートスプレッダ
WO2019188614A1 (ja) * 2018-03-28 2019-10-03 株式会社カネカ 半導体パッケージ
WO2020116116A1 (ja) * 2018-12-03 2020-06-11 ローム株式会社 半導体装置
JP2022100659A (ja) * 2020-12-24 2022-07-06 セイコーエプソン株式会社 積層構造体、熱伝導構造体、及び熱伝導構造体の製造方法

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WO2007016649A2 (en) 2005-08-02 2007-02-08 Satcon Technology Corporation Double-sided package for power module
JP2008028352A (ja) * 2006-06-02 2008-02-07 Nec Lighting Ltd 電子機器および電子機器の製造方法
US20090308571A1 (en) 2008-05-09 2009-12-17 Thermal Centric Corporation Heat transfer assembly and methods therefor
US20150064533A1 (en) * 2013-08-28 2015-03-05 Robert Bosch Gmbh Bipolar Solid State Battery with Insulating Package
US9741635B2 (en) 2014-01-21 2017-08-22 Infineon Technologies Austria Ag Electronic component
CN106133901B (zh) * 2014-04-08 2019-05-03 松下知识产权经营株式会社 热传导片及其制造方法
US9781819B2 (en) 2015-07-31 2017-10-03 Laird Technologies, Inc. Multifunctional components for electronic devices and related methods of providing thermal management and board level shielding
CN205383911U (zh) 2016-02-23 2016-07-13 南通久信石墨科技开发有限公司 方块孔式石墨换热器
KR102073256B1 (ko) * 2016-06-09 2020-02-04 주식회사 엘지화학 다공성 구조의 냉각 겸용 완충 부재를 포함하는 전지모듈
JP7025181B2 (ja) 2016-11-21 2022-02-24 ローム株式会社 パワーモジュールおよびその製造方法、グラファイトプレート、および電源装置
EP3355349B1 (en) * 2017-01-26 2022-05-11 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Efficient heat removal from component carrier with embedded diode
US10149413B1 (en) * 2017-07-31 2018-12-04 Toyota Motor Engineering & Manufacturing North America, Inc. Integrated thermal management assembly for gate drivers and power components
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Patent Citations (4)

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Publication number Priority date Publication date Assignee Title
JP2017130494A (ja) * 2016-01-18 2017-07-27 株式会社豊田中央研究所 ヒートスプレッダ
WO2019188614A1 (ja) * 2018-03-28 2019-10-03 株式会社カネカ 半導体パッケージ
WO2020116116A1 (ja) * 2018-12-03 2020-06-11 ローム株式会社 半導体装置
JP2022100659A (ja) * 2020-12-24 2022-07-06 セイコーエプソン株式会社 積層構造体、熱伝導構造体、及び熱伝導構造体の製造方法

Also Published As

Publication number Publication date
US12096596B2 (en) 2024-09-17
JP2026062644A (ja) 2026-04-10
CN117915623A (zh) 2024-04-19
CN117915623B (zh) 2025-09-26
US20240130076A1 (en) 2024-04-18

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