JPWO2023032519A5 - - Google Patents

Download PDF

Info

Publication number
JPWO2023032519A5
JPWO2023032519A5 JP2023545156A JP2023545156A JPWO2023032519A5 JP WO2023032519 A5 JPWO2023032519 A5 JP WO2023032519A5 JP 2023545156 A JP2023545156 A JP 2023545156A JP 2023545156 A JP2023545156 A JP 2023545156A JP WO2023032519 A5 JPWO2023032519 A5 JP WO2023032519A5
Authority
JP
Japan
Prior art keywords
electronic component
plating film
component according
formula
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023545156A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023032519A1 (https=
JP7663126B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2022/028463 external-priority patent/WO2023032519A1/ja
Publication of JPWO2023032519A1 publication Critical patent/JPWO2023032519A1/ja
Publication of JPWO2023032519A5 publication Critical patent/JPWO2023032519A5/ja
Application granted granted Critical
Publication of JP7663126B2 publication Critical patent/JP7663126B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2023545156A 2021-08-31 2022-07-22 電子部品 Active JP7663126B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021141837 2021-08-31
JP2021141837 2021-08-31
PCT/JP2022/028463 WO2023032519A1 (ja) 2021-08-31 2022-07-22 電子部品

Publications (3)

Publication Number Publication Date
JPWO2023032519A1 JPWO2023032519A1 (https=) 2023-03-09
JPWO2023032519A5 true JPWO2023032519A5 (https=) 2024-04-24
JP7663126B2 JP7663126B2 (ja) 2025-04-16

Family

ID=85412153

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023545156A Active JP7663126B2 (ja) 2021-08-31 2022-07-22 電子部品

Country Status (5)

Country Link
US (1) US20240161949A1 (https=)
JP (1) JP7663126B2 (https=)
CN (1) CN117916832A (https=)
DE (1) DE112022003373T5 (https=)
WO (1) WO2023032519A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2022196501A1 (https=) * 2021-03-16 2022-09-22

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11162771A (ja) * 1997-11-25 1999-06-18 Kyocera Corp 積層セラミックコンデンサ
JP4120336B2 (ja) 2002-09-27 2008-07-16 株式会社村田製作所 チップ型電子部品及びその製造方法
JP5974457B2 (ja) 2011-11-24 2016-08-23 Tdk株式会社 セラミック電子部品
JP2017197788A (ja) 2016-04-25 2017-11-02 日本高純度化学株式会社 電子部品接点部材の製造方法及び電子部品接点部材
JP7573976B2 (ja) 2020-03-11 2024-10-28 サントリーホールディングス株式会社 ビールテイスト飲料およびその製造方法

Similar Documents

Publication Publication Date Title
JP7764650B2 (ja) ひずみゲージ
CN1038166C (zh) 片状电阻器及其制造方法
US20160351319A1 (en) Coil electronic component
JP2009295813A5 (https=)
JPWO2023032519A5 (https=)
JPWO2014024593A1 (ja) セラミック電子部品
JP2004518022A5 (https=)
US4495524A (en) Part for a slide variable resistor
JP2019174387A (ja) ひずみゲージ
JP2024109649A5 (https=)
JPWO2023132293A5 (https=)
JP2005051226A (ja) チップ状電子部品およびその製造方法
JP7021922B2 (ja) ひずみゲージ
JP2003282301A (ja) チップ抵抗器およびその製造方法
JPH0235785A (ja) 積層型変位素子
JP2021156815A (ja) ひずみゲージ
JP2003253454A (ja) 電子部品のめっき方法、及び電子部品
JPWO2023189418A5 (https=)
JP3838559B2 (ja) 低い抵抗値を有するチップ抵抗器とその製造方法
JPWO2023189417A5 (https=)
JP7053215B2 (ja) ひずみゲージ
JP2006269588A (ja) 厚膜抵抗体ペースト、厚膜抵抗器およびその製造方法
JP2008047604A5 (https=)
JP2011119172A (ja) 過電圧保護部品
KR20190130998A (ko) 전극형성용 도전성 금속 분말, 그 제조방법 및 이를 포함하는 전자부품 외부전극용 도전성 페이스트