JPWO2023026908A1 - - Google Patents
Info
- Publication number
- JPWO2023026908A1 JPWO2023026908A1 JP2023543832A JP2023543832A JPWO2023026908A1 JP WO2023026908 A1 JPWO2023026908 A1 JP WO2023026908A1 JP 2023543832 A JP2023543832 A JP 2023543832A JP 2023543832 A JP2023543832 A JP 2023543832A JP WO2023026908 A1 JPWO2023026908 A1 JP WO2023026908A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3244—Gas supply means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32623—Mechanical discharge control means
- H01J37/32642—Focus rings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
- H10P72/722—Details of electrostatic chucks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/32137—Radio frequency generated discharge controlling of the discharge by modulation of energy
- H01J37/32155—Frequency modulation
- H01J37/32165—Plural frequencies
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32715—Workpiece holder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32715—Workpiece holder
- H01J37/32724—Temperature
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
- H05H1/46—Generating plasma using applied electromagnetic fields, e.g. high frequency or microwave energy
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P50/00—Etching of wafers, substrates or parts of devices
- H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
- H10P50/24—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials
- H10P50/242—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials of Group IV materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0431—Apparatus for thermal treatment
- H10P72/0434—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
- H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/20—Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
- H01J2237/2007—Holding mechanisms
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Electromagnetism (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Drying Of Semiconductors (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Chemical Vapour Deposition (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US202163237813P | 2021-08-27 | 2021-08-27 | |
| JP2022021526 | 2022-02-15 | ||
| PCT/JP2022/031012 WO2023026908A1 (ja) | 2021-08-27 | 2022-08-17 | 基板支持器及び基板処理装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023026908A1 true JPWO2023026908A1 (https=) | 2023-03-02 |
| JPWO2023026908A5 JPWO2023026908A5 (https=) | 2025-03-04 |
Family
ID=85321990
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023543832A Pending JPWO2023026908A1 (https=) | 2021-08-27 | 2022-08-17 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20240194514A1 (https=) |
| JP (1) | JPWO2023026908A1 (https=) |
| KR (1) | KR20240046246A (https=) |
| TW (1) | TW202329192A (https=) |
| WO (1) | WO2023026908A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024252740A1 (ja) * | 2023-06-05 | 2024-12-12 | 東京エレクトロン株式会社 | プラズマ処理装置 |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002080962A (ja) * | 2000-09-07 | 2002-03-22 | Ulvac Japan Ltd | スパッタリング装置及び薄膜製造方法 |
| JP2004158751A (ja) * | 2002-11-08 | 2004-06-03 | Matsushita Electric Ind Co Ltd | プラズマ処理装置 |
| JP2011009351A (ja) * | 2009-06-24 | 2011-01-13 | Hitachi High-Technologies Corp | プラズマ処理装置およびプラズマ処理方法 |
| JP2014150186A (ja) * | 2013-02-01 | 2014-08-21 | Hitachi High-Technologies Corp | プラズマ処理装置 |
| JP2016127170A (ja) * | 2015-01-06 | 2016-07-11 | 東京エレクトロン株式会社 | 載置台及び基板処理装置 |
| JP2021064750A (ja) * | 2019-10-17 | 2021-04-22 | 東京エレクトロン株式会社 | プラズマ処理装置及びプラズマ処理方法 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2021141277A (ja) | 2020-03-09 | 2021-09-16 | 東京エレクトロン株式会社 | 載置台及びプラズマ処理装置 |
-
2022
- 2022-08-17 TW TW111130862A patent/TW202329192A/zh unknown
- 2022-08-17 WO PCT/JP2022/031012 patent/WO2023026908A1/ja not_active Ceased
- 2022-08-17 KR KR1020247008584A patent/KR20240046246A/ko active Pending
- 2022-08-17 JP JP2023543832A patent/JPWO2023026908A1/ja active Pending
-
2024
- 2024-02-26 US US18/586,860 patent/US20240194514A1/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002080962A (ja) * | 2000-09-07 | 2002-03-22 | Ulvac Japan Ltd | スパッタリング装置及び薄膜製造方法 |
| JP2004158751A (ja) * | 2002-11-08 | 2004-06-03 | Matsushita Electric Ind Co Ltd | プラズマ処理装置 |
| JP2011009351A (ja) * | 2009-06-24 | 2011-01-13 | Hitachi High-Technologies Corp | プラズマ処理装置およびプラズマ処理方法 |
| JP2014150186A (ja) * | 2013-02-01 | 2014-08-21 | Hitachi High-Technologies Corp | プラズマ処理装置 |
| JP2016127170A (ja) * | 2015-01-06 | 2016-07-11 | 東京エレクトロン株式会社 | 載置台及び基板処理装置 |
| JP2021064750A (ja) * | 2019-10-17 | 2021-04-22 | 東京エレクトロン株式会社 | プラズマ処理装置及びプラズマ処理方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2023026908A1 (ja) | 2023-03-02 |
| US20240194514A1 (en) | 2024-06-13 |
| TW202329192A (zh) | 2023-07-16 |
| KR20240046246A (ko) | 2024-04-08 |
Similar Documents
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