JPWO2023013502A5 - - Google Patents

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Publication number
JPWO2023013502A5
JPWO2023013502A5 JP2023540289A JP2023540289A JPWO2023013502A5 JP WO2023013502 A5 JPWO2023013502 A5 JP WO2023013502A5 JP 2023540289 A JP2023540289 A JP 2023540289A JP 2023540289 A JP2023540289 A JP 2023540289A JP WO2023013502 A5 JPWO2023013502 A5 JP WO2023013502A5
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JP
Japan
Prior art keywords
heat dissipation
particle size
dissipation member
copper
size distribution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023540289A
Other languages
English (en)
Japanese (ja)
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JPWO2023013502A1 (https=
JP7623501B2 (ja
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Publication date
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Priority claimed from PCT/JP2022/028971 external-priority patent/WO2023013502A1/ja
Publication of JPWO2023013502A1 publication Critical patent/JPWO2023013502A1/ja
Publication of JPWO2023013502A5 publication Critical patent/JPWO2023013502A5/ja
Application granted granted Critical
Publication of JP7623501B2 publication Critical patent/JP7623501B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2023540289A 2021-08-06 2022-07-27 放熱部材および電子装置 Active JP7623501B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021129856 2021-08-06
JP2021129856 2021-08-06
PCT/JP2022/028971 WO2023013502A1 (ja) 2021-08-06 2022-07-27 放熱部材および電子装置

Publications (3)

Publication Number Publication Date
JPWO2023013502A1 JPWO2023013502A1 (https=) 2023-02-09
JPWO2023013502A5 true JPWO2023013502A5 (https=) 2024-03-22
JP7623501B2 JP7623501B2 (ja) 2025-01-28

Family

ID=85154468

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023540289A Active JP7623501B2 (ja) 2021-08-06 2022-07-27 放熱部材および電子装置

Country Status (4)

Country Link
US (1) US20240332120A1 (https=)
JP (1) JP7623501B2 (https=)
CN (1) CN117795666A (https=)
WO (1) WO2023013502A1 (https=)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4148123B2 (ja) * 2003-12-08 2008-09-10 三菱マテリアル株式会社 放熱体及びパワーモジュール
WO2007074720A1 (ja) * 2005-12-28 2007-07-05 A. L. M. T. Corp. 半導体素子実装用基板とそれを用いた半導体装置および半導体素子実装用基板の製造方法
JP6381230B2 (ja) * 2014-02-27 2018-08-29 国立大学法人信州大学 銅−ダイヤモンド複合材及びその製造方法

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