JPWO2023013501A5 - - Google Patents
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- Publication number
- JPWO2023013501A5 JPWO2023013501A5 JP2023540288A JP2023540288A JPWO2023013501A5 JP WO2023013501 A5 JPWO2023013501 A5 JP WO2023013501A5 JP 2023540288 A JP2023540288 A JP 2023540288A JP 2023540288 A JP2023540288 A JP 2023540288A JP WO2023013501 A5 JPWO2023013501 A5 JP WO2023013501A5
- Authority
- JP
- Japan
- Prior art keywords
- diamond particles
- heat dissipation
- dissipation member
- particle size
- diamond
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002245 particle Substances 0.000 claims 21
- 229910003460 diamond Inorganic materials 0.000 claims 17
- 239000010432 diamond Substances 0.000 claims 17
- 230000017525 heat dissipation Effects 0.000 claims 11
- 239000002184 metal Substances 0.000 claims 8
- 229910052751 metal Inorganic materials 0.000 claims 8
- 239000011159 matrix material Substances 0.000 claims 5
- 239000002131 composite material Substances 0.000 claims 4
- 230000001186 cumulative effect Effects 0.000 claims 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021129884 | 2021-08-06 | ||
| JP2021129884 | 2021-08-06 | ||
| PCT/JP2022/028969 WO2023013501A1 (ja) | 2021-08-06 | 2022-07-27 | 放熱部材および電子装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2023013501A1 JPWO2023013501A1 (https=) | 2023-02-09 |
| JPWO2023013501A5 true JPWO2023013501A5 (https=) | 2024-03-22 |
| JP7623500B2 JP7623500B2 (ja) | 2025-01-28 |
Family
ID=85154703
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023540288A Active JP7623500B2 (ja) | 2021-08-06 | 2022-07-27 | 放熱部材および電子装置 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20240347415A1 (https=) |
| JP (1) | JP7623500B2 (https=) |
| CN (1) | CN117795664A (https=) |
| WO (1) | WO2023013501A1 (https=) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008085096A (ja) * | 2006-09-28 | 2008-04-10 | Kyocera Corp | 放熱部材およびこれを用いた電子部品収納用パッケージおよび電子装置 |
| JP2013098491A (ja) * | 2011-11-04 | 2013-05-20 | Sumitomo Electric Ind Ltd | ヒートシンク、ヒートシンクを作製する方法、半導体装置、半導体モジュール |
| JP6381230B2 (ja) * | 2014-02-27 | 2018-08-29 | 国立大学法人信州大学 | 銅−ダイヤモンド複合材及びその製造方法 |
-
2022
- 2022-07-27 US US18/681,594 patent/US20240347415A1/en active Pending
- 2022-07-27 WO PCT/JP2022/028969 patent/WO2023013501A1/ja not_active Ceased
- 2022-07-27 JP JP2023540288A patent/JP7623500B2/ja active Active
- 2022-07-27 CN CN202280054488.9A patent/CN117795664A/zh active Pending
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