JPWO2023013500A5 - - Google Patents

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Publication number
JPWO2023013500A5
JPWO2023013500A5 JP2023540287A JP2023540287A JPWO2023013500A5 JP WO2023013500 A5 JPWO2023013500 A5 JP WO2023013500A5 JP 2023540287 A JP2023540287 A JP 2023540287A JP 2023540287 A JP2023540287 A JP 2023540287A JP WO2023013500 A5 JPWO2023013500 A5 JP WO2023013500A5
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JP
Japan
Prior art keywords
heat dissipation
particle size
dissipation member
diamond particles
copper
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JP2023540287A
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English (en)
Japanese (ja)
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JP7623499B2 (ja
JPWO2023013500A1 (https=
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Priority claimed from PCT/JP2022/028968 external-priority patent/WO2023013500A1/ja
Publication of JPWO2023013500A1 publication Critical patent/JPWO2023013500A1/ja
Publication of JPWO2023013500A5 publication Critical patent/JPWO2023013500A5/ja
Application granted granted Critical
Publication of JP7623499B2 publication Critical patent/JP7623499B2/ja
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Anticipated expiration legal-status Critical

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JP2023540287A 2021-08-06 2022-07-27 放熱部材および電子装置 Active JP7623499B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021129883 2021-08-06
JP2021129883 2021-08-06
PCT/JP2022/028968 WO2023013500A1 (ja) 2021-08-06 2022-07-27 放熱部材および電子装置

Publications (3)

Publication Number Publication Date
JPWO2023013500A1 JPWO2023013500A1 (https=) 2023-02-09
JPWO2023013500A5 true JPWO2023013500A5 (https=) 2024-03-22
JP7623499B2 JP7623499B2 (ja) 2025-01-28

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ID=85154566

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023540287A Active JP7623499B2 (ja) 2021-08-06 2022-07-27 放熱部材および電子装置

Country Status (4)

Country Link
US (1) US20240371723A1 (https=)
JP (1) JP7623499B2 (https=)
CN (1) CN117795665A (https=)
WO (1) WO2023013500A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN121100405A (zh) * 2023-04-28 2025-12-09 电化株式会社 铝-金刚石复合体、铝-金刚石复合体的制造方法、以及半导体封装体
EP4704151A1 (en) * 2023-04-28 2026-03-04 Denka Company Limited Aluminum-diamond composite, method for producing aluminum-diamond composite, and semiconductor package

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3617232B2 (ja) * 1997-02-06 2005-02-02 住友電気工業株式会社 半導体用ヒートシンクおよびその製造方法ならびにそれを用いた半導体パッケージ
WO2007074720A1 (ja) * 2005-12-28 2007-07-05 A. L. M. T. Corp. 半導体素子実装用基板とそれを用いた半導体装置および半導体素子実装用基板の製造方法
JP2013098491A (ja) * 2011-11-04 2013-05-20 Sumitomo Electric Ind Ltd ヒートシンク、ヒートシンクを作製する方法、半導体装置、半導体モジュール
JP6381230B2 (ja) * 2014-02-27 2018-08-29 国立大学法人信州大学 銅−ダイヤモンド複合材及びその製造方法
US11799065B2 (en) * 2020-01-31 2023-10-24 Nichia Corporation Method of producing heat dissipation substrate and method of producing composite substrate

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