JPWO2023013500A1 - - Google Patents

Info

Publication number
JPWO2023013500A1
JPWO2023013500A1 JP2023540287A JP2023540287A JPWO2023013500A1 JP WO2023013500 A1 JPWO2023013500 A1 JP WO2023013500A1 JP 2023540287 A JP2023540287 A JP 2023540287A JP 2023540287 A JP2023540287 A JP 2023540287A JP WO2023013500 A1 JPWO2023013500 A1 JP WO2023013500A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023540287A
Other languages
Japanese (ja)
Other versions
JP7623499B2 (ja
JPWO2023013500A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023013500A1 publication Critical patent/JPWO2023013500A1/ja
Publication of JPWO2023013500A5 publication Critical patent/JPWO2023013500A5/ja
Application granted granted Critical
Publication of JP7623499B2 publication Critical patent/JP7623499B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/24—After-treatment of workpieces or articles
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/04—Making non-ferrous alloys by powder metallurgy
    • C22C1/05—Mixtures of metal powder with non-metallic powder
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C26/00—Alloys containing diamond or cubic or wurtzitic boron nitride, fullerenes or carbon nanotubes
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/01—Alloys based on copper with aluminium as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/02—Alloys based on copper with tin as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/04—Alloys based on copper with zinc as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/254—Diamond
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/258—Metallic materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Ceramic Engineering (AREA)
JP2023540287A 2021-08-06 2022-07-27 放熱部材および電子装置 Active JP7623499B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021129883 2021-08-06
JP2021129883 2021-08-06
PCT/JP2022/028968 WO2023013500A1 (ja) 2021-08-06 2022-07-27 放熱部材および電子装置

Publications (3)

Publication Number Publication Date
JPWO2023013500A1 true JPWO2023013500A1 (https=) 2023-02-09
JPWO2023013500A5 JPWO2023013500A5 (https=) 2024-03-22
JP7623499B2 JP7623499B2 (ja) 2025-01-28

Family

ID=85154566

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023540287A Active JP7623499B2 (ja) 2021-08-06 2022-07-27 放熱部材および電子装置

Country Status (4)

Country Link
US (1) US20240371723A1 (https=)
JP (1) JP7623499B2 (https=)
CN (1) CN117795665A (https=)
WO (1) WO2023013500A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN121100405A (zh) * 2023-04-28 2025-12-09 电化株式会社 铝-金刚石复合体、铝-金刚石复合体的制造方法、以及半导体封装体
EP4704151A1 (en) * 2023-04-28 2026-03-04 Denka Company Limited Aluminum-diamond composite, method for producing aluminum-diamond composite, and semiconductor package

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8178893B2 (en) * 2005-12-28 2012-05-15 A. L. M. T. Corp. Semiconductor element mounting substrate, semiconductor device using the same, and method for manufacturing semiconductor element mounting substrate
JP2013098491A (ja) * 2011-11-04 2013-05-20 Sumitomo Electric Ind Ltd ヒートシンク、ヒートシンクを作製する方法、半導体装置、半導体モジュール
JP2015160996A (ja) * 2014-02-27 2015-09-07 国立大学法人信州大学 銅−ダイヤモンド複合材及びその製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3617232B2 (ja) * 1997-02-06 2005-02-02 住友電気工業株式会社 半導体用ヒートシンクおよびその製造方法ならびにそれを用いた半導体パッケージ
US11799065B2 (en) * 2020-01-31 2023-10-24 Nichia Corporation Method of producing heat dissipation substrate and method of producing composite substrate

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8178893B2 (en) * 2005-12-28 2012-05-15 A. L. M. T. Corp. Semiconductor element mounting substrate, semiconductor device using the same, and method for manufacturing semiconductor element mounting substrate
JP2013098491A (ja) * 2011-11-04 2013-05-20 Sumitomo Electric Ind Ltd ヒートシンク、ヒートシンクを作製する方法、半導体装置、半導体モジュール
JP2015160996A (ja) * 2014-02-27 2015-09-07 国立大学法人信州大学 銅−ダイヤモンド複合材及びその製造方法

Also Published As

Publication number Publication date
US20240371723A1 (en) 2024-11-07
JP7623499B2 (ja) 2025-01-28
WO2023013500A1 (ja) 2023-02-09
CN117795665A (zh) 2024-03-29

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