JPWO2024225345A1 - - Google Patents
Info
- Publication number
- JPWO2024225345A1 JPWO2024225345A1 JP2025516862A JP2025516862A JPWO2024225345A1 JP WO2024225345 A1 JPWO2024225345 A1 JP WO2024225345A1 JP 2025516862 A JP2025516862 A JP 2025516862A JP 2025516862 A JP2025516862 A JP 2025516862A JP WO2024225345 A1 JPWO2024225345 A1 JP WO2024225345A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C26/00—Alloys containing diamond or cubic or wurtzitic boron nitride, fullerenes or carbon nanotubes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/10—Alloys containing non-metals
- C22C1/1036—Alloys containing non-metals starting from a melt
- C22C1/1073—Infiltration or casting under mechanical pressure, e.g. squeeze casting
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/20—Arrangements for cooling
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/20—Arrangements for cooling
- H10W40/25—Arrangements for cooling characterised by their materials
- H10W40/254—Diamond
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/20—Arrangements for cooling
- H10W40/25—Arrangements for cooling characterised by their materials
- H10W40/258—Metallic materials
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Carbon And Carbon Compounds (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023075165 | 2023-04-28 | ||
| PCT/JP2024/016152 WO2024225345A1 (ja) | 2023-04-28 | 2024-04-24 | アルミニウム－ダイヤモンド複合体、及びアルミニウム－ダイヤモンド複合体の製造方法、並びに半導体パッケージ |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2024225345A1 true JPWO2024225345A1 (https=) | 2024-10-31 |
Family
ID=93256567
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025516862A Pending JPWO2024225345A1 (https=) | 2023-04-28 | 2024-04-24 |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP4704151A1 (https=) |
| JP (1) | JPWO2024225345A1 (https=) |
| CN (1) | CN121039805A (https=) |
| WO (1) | WO2024225345A1 (https=) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101986860B1 (ko) * | 2011-07-28 | 2019-06-07 | 덴카 주식회사 | 반도체 소자용 방열 부품 |
| JP6105262B2 (ja) | 2012-11-29 | 2017-03-29 | デンカ株式会社 | アルミニウム−ダイヤモンド系複合体放熱部品 |
| CN106415822B (zh) | 2014-05-27 | 2021-04-06 | 电化株式会社 | 半导体封装体及其制造方法 |
| JP7447694B2 (ja) * | 2020-06-22 | 2024-03-12 | ウシオ電機株式会社 | 半導体発光装置 |
| US20240371723A1 (en) * | 2021-08-06 | 2024-11-07 | Denka Company Limited | Heat dissipation member and electronic device |
-
2024
- 2024-04-24 JP JP2025516862A patent/JPWO2024225345A1/ja active Pending
- 2024-04-24 EP EP24797091.6A patent/EP4704151A1/en active Pending
- 2024-04-24 CN CN202480026818.2A patent/CN121039805A/zh active Pending
- 2024-04-24 WO PCT/JP2024/016152 patent/WO2024225345A1/ja not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024225345A1 (ja) | 2024-10-31 |
| EP4704151A1 (en) | 2026-03-04 |
| CN121039805A (zh) | 2025-11-28 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20251001 |