CN121039805A - 铝-金刚石复合体、铝-金刚石复合体的制造方法、以及半导体封装体 - Google Patents

铝-金刚石复合体、铝-金刚石复合体的制造方法、以及半导体封装体

Info

Publication number
CN121039805A
CN121039805A CN202480026818.2A CN202480026818A CN121039805A CN 121039805 A CN121039805 A CN 121039805A CN 202480026818 A CN202480026818 A CN 202480026818A CN 121039805 A CN121039805 A CN 121039805A
Authority
CN
China
Prior art keywords
aluminum
diamond
particles
composite
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202480026818.2A
Other languages
English (en)
Chinese (zh)
Inventor
太田宽朗
后藤大助
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denka Co Ltd
Original Assignee
Denka Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denka Co Ltd filed Critical Denka Co Ltd
Publication of CN121039805A publication Critical patent/CN121039805A/zh
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C26/00—Alloys containing diamond or cubic or wurtzitic boron nitride, fullerenes or carbon nanotubes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/10—Alloys containing non-metals
    • C22C1/1036—Alloys containing non-metals starting from a melt
    • C22C1/1073—Infiltration or casting under mechanical pressure, e.g. squeeze casting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/254—Diamond
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/258—Metallic materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Carbon And Carbon Compounds (AREA)
CN202480026818.2A 2023-04-28 2024-04-24 铝-金刚石复合体、铝-金刚石复合体的制造方法、以及半导体封装体 Pending CN121039805A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2023-075165 2023-04-28
JP2023075165 2023-04-28
PCT/JP2024/016152 WO2024225345A1 (ja) 2023-04-28 2024-04-24 アルミニウム－ダイヤモンド複合体、及びアルミニウム－ダイヤモンド複合体の製造方法、並びに半導体パッケージ

Publications (1)

Publication Number Publication Date
CN121039805A true CN121039805A (zh) 2025-11-28

Family

ID=93256567

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202480026818.2A Pending CN121039805A (zh) 2023-04-28 2024-04-24 铝-金刚石复合体、铝-金刚石复合体的制造方法、以及半导体封装体

Country Status (4)

Country Link
EP (1) EP4704151A1 (https=)
JP (1) JPWO2024225345A1 (https=)
CN (1) CN121039805A (https=)
WO (1) WO2024225345A1 (https=)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101986860B1 (ko) * 2011-07-28 2019-06-07 덴카 주식회사 반도체 소자용 방열 부품
JP6105262B2 (ja) 2012-11-29 2017-03-29 デンカ株式会社 アルミニウム−ダイヤモンド系複合体放熱部品
CN106415822B (zh) 2014-05-27 2021-04-06 电化株式会社 半导体封装体及其制造方法
JP7447694B2 (ja) * 2020-06-22 2024-03-12 ウシオ電機株式会社 半導体発光装置
US20240371723A1 (en) * 2021-08-06 2024-11-07 Denka Company Limited Heat dissipation member and electronic device

Also Published As

Publication number Publication date
WO2024225345A1 (ja) 2024-10-31
JPWO2024225345A1 (https=) 2024-10-31
EP4704151A1 (en) 2026-03-04

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