JPWO2023013579A5 - - Google Patents

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Publication number
JPWO2023013579A5
JPWO2023013579A5 JP2023540331A JP2023540331A JPWO2023013579A5 JP WO2023013579 A5 JPWO2023013579 A5 JP WO2023013579A5 JP 2023540331 A JP2023540331 A JP 2023540331A JP 2023540331 A JP2023540331 A JP 2023540331A JP WO2023013579 A5 JPWO2023013579 A5 JP WO2023013579A5
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JP
Japan
Prior art keywords
copper
diamond
composite
diamond composite
particles
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JP2023540331A
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English (en)
Japanese (ja)
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JP7622234B2 (ja
JPWO2023013579A1 (https=
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Priority claimed from PCT/JP2022/029486 external-priority patent/WO2023013579A1/ja
Publication of JPWO2023013579A1 publication Critical patent/JPWO2023013579A1/ja
Publication of JPWO2023013579A5 publication Critical patent/JPWO2023013579A5/ja
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Publication of JP7622234B2 publication Critical patent/JP7622234B2/ja
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JP2023540331A 2021-08-05 2022-08-01 銅－ダイヤモンド複合体、放熱部材および電子装置 Active JP7622234B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021128792 2021-08-05
JP2021128792 2021-08-05
PCT/JP2022/029486 WO2023013579A1 (ja) 2021-08-05 2022-08-01 銅－ダイヤモンド複合体、放熱部材および電子装置

Publications (3)

Publication Number Publication Date
JPWO2023013579A1 JPWO2023013579A1 (https=) 2023-02-09
JPWO2023013579A5 true JPWO2023013579A5 (https=) 2024-04-09
JP7622234B2 JP7622234B2 (ja) 2025-01-27

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ID=85154754

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023540331A Active JP7622234B2 (ja) 2021-08-05 2022-08-01 銅－ダイヤモンド複合体、放熱部材および電子装置

Country Status (4)

Country Link
US (1) US12612682B2 (https=)
JP (1) JP7622234B2 (https=)
CN (1) CN117813684A (https=)
WO (1) WO2023013579A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117123776A (zh) * 2023-05-26 2023-11-28 郑州大学 一种铜/硅镀覆金刚石复合导热材料及其制备方法
CN117484969A (zh) * 2023-10-12 2024-02-02 广东工业大学 一种片状的金属基金刚石复合材料及其制备方法和应用

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007074720A1 (ja) 2005-12-28 2007-07-05 A. L. M. T. Corp. 半導体素子実装用基板とそれを用いた半導体装置および半導体素子実装用基板の製造方法
JP2013098491A (ja) 2011-11-04 2013-05-20 Sumitomo Electric Ind Ltd ヒートシンク、ヒートシンクを作製する方法、半導体装置、半導体モジュール
JP6381230B2 (ja) 2014-02-27 2018-08-29 国立大学法人信州大学 銅−ダイヤモンド複合材及びその製造方法
CN106232845B (zh) * 2014-04-25 2019-04-26 电化株式会社 铝-金刚石系复合体及使用其的散热部件
WO2016035796A1 (ja) 2014-09-02 2016-03-10 株式会社アライドマテリアル 放熱部材、及び放熱部材の製造方法
CN111455205B (zh) * 2020-03-26 2021-03-12 陕西斯瑞新材料股份有限公司 一种具有夹层结构的高导热低膨胀Diamond-Cu复合材料的制备方法

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