JP7623500B2 - 放熱部材および電子装置 - Google Patents

放熱部材および電子装置 Download PDF

Info

Publication number
JP7623500B2
JP7623500B2 JP2023540288A JP2023540288A JP7623500B2 JP 7623500 B2 JP7623500 B2 JP 7623500B2 JP 2023540288 A JP2023540288 A JP 2023540288A JP 2023540288 A JP2023540288 A JP 2023540288A JP 7623500 B2 JP7623500 B2 JP 7623500B2
Authority
JP
Japan
Prior art keywords
heat dissipation
diamond
copper
dissipation member
diamond particles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2023540288A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023013501A1 (https=
JPWO2023013501A5 (https=
Inventor
基 永沢
孝眞 野口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denka Co Ltd
Original Assignee
Denka Co Ltd
Denki Kagaku Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denka Co Ltd, Denki Kagaku Kogyo KK filed Critical Denka Co Ltd
Publication of JPWO2023013501A1 publication Critical patent/JPWO2023013501A1/ja
Publication of JPWO2023013501A5 publication Critical patent/JPWO2023013501A5/ja
Application granted granted Critical
Publication of JP7623500B2 publication Critical patent/JP7623500B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/24—After-treatment of workpieces or articles
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/04—Making non-ferrous alloys by powder metallurgy
    • C22C1/05—Mixtures of metal powder with non-metallic powder
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C26/00—Alloys containing diamond or cubic or wurtzitic boron nitride, fullerenes or carbon nanotubes
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/01—Alloys based on copper with aluminium as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/02—Alloys based on copper with tin as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/04—Alloys based on copper with zinc as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/254—Diamond
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/258—Metallic materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2023540288A 2021-08-06 2022-07-27 放熱部材および電子装置 Active JP7623500B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021129884 2021-08-06
JP2021129884 2021-08-06
PCT/JP2022/028969 WO2023013501A1 (ja) 2021-08-06 2022-07-27 放熱部材および電子装置

Publications (3)

Publication Number Publication Date
JPWO2023013501A1 JPWO2023013501A1 (https=) 2023-02-09
JPWO2023013501A5 JPWO2023013501A5 (https=) 2024-03-22
JP7623500B2 true JP7623500B2 (ja) 2025-01-28

Family

ID=85154703

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023540288A Active JP7623500B2 (ja) 2021-08-06 2022-07-27 放熱部材および電子装置

Country Status (4)

Country Link
US (1) US20240347415A1 (https=)
JP (1) JP7623500B2 (https=)
CN (1) CN117795664A (https=)
WO (1) WO2023013501A1 (https=)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013098491A (ja) 2011-11-04 2013-05-20 Sumitomo Electric Ind Ltd ヒートシンク、ヒートシンクを作製する方法、半導体装置、半導体モジュール
JP2015160996A (ja) 2014-02-27 2015-09-07 国立大学法人信州大学 銅−ダイヤモンド複合材及びその製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008085096A (ja) * 2006-09-28 2008-04-10 Kyocera Corp 放熱部材およびこれを用いた電子部品収納用パッケージおよび電子装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013098491A (ja) 2011-11-04 2013-05-20 Sumitomo Electric Ind Ltd ヒートシンク、ヒートシンクを作製する方法、半導体装置、半導体モジュール
JP2015160996A (ja) 2014-02-27 2015-09-07 国立大学法人信州大学 銅−ダイヤモンド複合材及びその製造方法

Also Published As

Publication number Publication date
JPWO2023013501A1 (https=) 2023-02-09
WO2023013501A1 (ja) 2023-02-09
US20240347415A1 (en) 2024-10-17
CN117795664A (zh) 2024-03-29

Similar Documents

Publication Publication Date Title
CN109690760B (zh) 散热板及其制造方法
TWI357788B (https=)
JP7623499B2 (ja) 放熱部材および電子装置
WO1998054761A1 (en) Copper circuit junction substrate and method of producing the same
CN111742073B (zh) 复合材料和复合材料的制造方法
CN103492345A (zh) 陶瓷电路基板
TWI796503B (zh) 金屬-碳化矽質複合體、及金屬-碳化矽質複合體之製造方法
WO2003040420A1 (fr) Diamant fritte presentant une conductivite thermique elevee et procede de production d'un tel diamant et puits thermique utilisant un tel diamant
US12120852B2 (en) Composite material and heat dissipation part
CN110453126B (zh) 一种金刚石-金属基复合导热材料及其制备方法
JP7622234B2 (ja) 銅－ダイヤモンド複合体、放熱部材および電子装置
WO2015163395A1 (ja) アルミニウム－ダイヤモンド系複合体及びこれを用いた放熱部品
JP7623500B2 (ja) 放熱部材および電子装置
JP7623501B2 (ja) 放熱部材および電子装置
JP7794844B2 (ja) 放熱部材および電子装置
JP2009242899A (ja) ＳｉＣ／Ａｌ複合焼結体およびその製造方法
JP2026032086A (ja) 放熱部材および電子装置
US12612682B2 (en) Copper-diamond composite, heat dissipation member, and electronic device
JP2004055577A (ja) アルミニウム−炭化珪素質板状複合体
TW202605168A (zh) 導熱複合材料及包含其之散熱元件
JPH1088272A (ja) 放熱板，その製造方法，および半導体装置
CN121294976A (zh) 导热复合材料及包含其的散热元件
JP2025183379A (ja) 放熱部材
CN117836449A (zh) 铜-金刚石复合体、散热部件及电子设备
JP2011080145A5 (ja) 放熱部材、半導体装置、放熱部材の製造方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20231219

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20231219

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20240903

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20250107

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20250116

R150 Certificate of patent or registration of utility model

Ref document number: 7623500

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150