JPWO2023013502A1 - - Google Patents

Info

Publication number
JPWO2023013502A1
JPWO2023013502A1 JP2023540289A JP2023540289A JPWO2023013502A1 JP WO2023013502 A1 JPWO2023013502 A1 JP WO2023013502A1 JP 2023540289 A JP2023540289 A JP 2023540289A JP 2023540289 A JP2023540289 A JP 2023540289A JP WO2023013502 A1 JPWO2023013502 A1 JP WO2023013502A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023540289A
Other languages
Japanese (ja)
Other versions
JP7623501B2 (ja
JPWO2023013502A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023013502A1 publication Critical patent/JPWO2023013502A1/ja
Publication of JPWO2023013502A5 publication Critical patent/JPWO2023013502A5/ja
Application granted granted Critical
Publication of JP7623501B2 publication Critical patent/JP7623501B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/254—Diamond
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/24—After-treatment of workpieces or articles
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/04—Making non-ferrous alloys by powder metallurgy
    • C22C1/05—Mixtures of metal powder with non-metallic powder
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C26/00—Alloys containing diamond or cubic or wurtzitic boron nitride, fullerenes or carbon nanotubes
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/01—Alloys based on copper with aluminium as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/02—Alloys based on copper with tin as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/04—Alloys based on copper with zinc as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/258—Metallic materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2023540289A 2021-08-06 2022-07-27 放熱部材および電子装置 Active JP7623501B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021129856 2021-08-06
JP2021129856 2021-08-06
PCT/JP2022/028971 WO2023013502A1 (ja) 2021-08-06 2022-07-27 放熱部材および電子装置

Publications (3)

Publication Number Publication Date
JPWO2023013502A1 true JPWO2023013502A1 (https=) 2023-02-09
JPWO2023013502A5 JPWO2023013502A5 (https=) 2024-03-22
JP7623501B2 JP7623501B2 (ja) 2025-01-28

Family

ID=85154468

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023540289A Active JP7623501B2 (ja) 2021-08-06 2022-07-27 放熱部材および電子装置

Country Status (4)

Country Link
US (1) US20240332120A1 (https=)
JP (1) JP7623501B2 (https=)
CN (1) CN117795666A (https=)
WO (1) WO2023013502A1 (https=)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007074720A1 (ja) * 2005-12-28 2007-07-05 A. L. M. T. Corp. 半導体素子実装用基板とそれを用いた半導体装置および半導体素子実装用基板の製造方法
JP2015160996A (ja) * 2014-02-27 2015-09-07 国立大学法人信州大学 銅−ダイヤモンド複合材及びその製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4148123B2 (ja) * 2003-12-08 2008-09-10 三菱マテリアル株式会社 放熱体及びパワーモジュール

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007074720A1 (ja) * 2005-12-28 2007-07-05 A. L. M. T. Corp. 半導体素子実装用基板とそれを用いた半導体装置および半導体素子実装用基板の製造方法
JP2015160996A (ja) * 2014-02-27 2015-09-07 国立大学法人信州大学 銅−ダイヤモンド複合材及びその製造方法

Also Published As

Publication number Publication date
US20240332120A1 (en) 2024-10-03
CN117795666A (zh) 2024-03-29
JP7623501B2 (ja) 2025-01-28
WO2023013502A1 (ja) 2023-02-09

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