JPWO2023013502A1 - - Google Patents
Info
- Publication number
- JPWO2023013502A1 JPWO2023013502A1 JP2023540289A JP2023540289A JPWO2023013502A1 JP WO2023013502 A1 JPWO2023013502 A1 JP WO2023013502A1 JP 2023540289 A JP2023540289 A JP 2023540289A JP 2023540289 A JP2023540289 A JP 2023540289A JP WO2023013502 A1 JPWO2023013502 A1 JP WO2023013502A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/24—After-treatment of workpieces or articles
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/04—Making non-ferrous alloys by powder metallurgy
- C22C1/05—Mixtures of metal powder with non-metallic powder
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C26/00—Alloys containing diamond or cubic or wurtzitic boron nitride, fullerenes or carbon nanotubes
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/01—Alloys based on copper with aluminium as the next major constituent
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/02—Alloys based on copper with tin as the next major constituent
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/04—Alloys based on copper with zinc as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021129856 | 2021-08-06 | ||
PCT/JP2022/028971 WO2023013502A1 (ja) | 2021-08-06 | 2022-07-27 | 放熱部材および電子装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2023013502A1 true JPWO2023013502A1 (ja) | 2023-02-09 |
JPWO2023013502A5 JPWO2023013502A5 (ja) | 2024-03-22 |
Family
ID=85154468
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2023540289A Pending JPWO2023013502A1 (ja) | 2021-08-06 | 2022-07-27 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JPWO2023013502A1 (ja) |
CN (1) | CN117795666A (ja) |
WO (1) | WO2023013502A1 (ja) |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4148123B2 (ja) * | 2003-12-08 | 2008-09-10 | 三菱マテリアル株式会社 | 放熱体及びパワーモジュール |
WO2007074720A1 (ja) * | 2005-12-28 | 2007-07-05 | A. L. M. T. Corp. | 半導体素子実装用基板とそれを用いた半導体装置および半導体素子実装用基板の製造方法 |
JP6381230B2 (ja) * | 2014-02-27 | 2018-08-29 | 国立大学法人信州大学 | 銅−ダイヤモンド複合材及びその製造方法 |
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2022
- 2022-07-27 CN CN202280054508.2A patent/CN117795666A/zh active Pending
- 2022-07-27 WO PCT/JP2022/028971 patent/WO2023013502A1/ja active Application Filing
- 2022-07-27 JP JP2023540289A patent/JPWO2023013502A1/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
CN117795666A (zh) | 2024-03-29 |
WO2023013502A1 (ja) | 2023-02-09 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20231219 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20231219 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20240903 |