JPWO2022239719A5 - - Google Patents

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Publication number
JPWO2022239719A5
JPWO2022239719A5 JP2023521006A JP2023521006A JPWO2022239719A5 JP WO2022239719 A5 JPWO2022239719 A5 JP WO2022239719A5 JP 2023521006 A JP2023521006 A JP 2023521006A JP 2023521006 A JP2023521006 A JP 2023521006A JP WO2022239719 A5 JPWO2022239719 A5 JP WO2022239719A5
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JP
Japan
Prior art keywords
insulating layer
type
support substrate
layer
substrate according
Prior art date
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JP2023521006A
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English (en)
Japanese (ja)
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JPWO2022239719A1 (https=
JP7635834B2 (ja
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Priority claimed from PCT/JP2022/019621 external-priority patent/WO2022239719A1/ja
Publication of JPWO2022239719A1 publication Critical patent/JPWO2022239719A1/ja
Publication of JPWO2022239719A5 publication Critical patent/JPWO2022239719A5/ja
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Publication of JP7635834B2 publication Critical patent/JP7635834B2/ja
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JP2023521006A 2021-05-10 2022-05-09 受動電子部品用の支持基板、受動電子部品、半導体装置、マッチング回路及びフィルタ回路 Active JP7635834B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021079850 2021-05-10
JP2021079850 2021-05-10
PCT/JP2022/019621 WO2022239719A1 (ja) 2021-05-10 2022-05-09 受動電子部品用の支持基板、受動電子部品、半導体装置、マッチング回路及びフィルタ回路

Publications (3)

Publication Number Publication Date
JPWO2022239719A1 JPWO2022239719A1 (https=) 2022-11-17
JPWO2022239719A5 true JPWO2022239719A5 (https=) 2024-02-13
JP7635834B2 JP7635834B2 (ja) 2025-02-26

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ID=84029622

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023521006A Active JP7635834B2 (ja) 2021-05-10 2022-05-09 受動電子部品用の支持基板、受動電子部品、半導体装置、マッチング回路及びフィルタ回路

Country Status (4)

Country Link
US (1) US20240063224A1 (https=)
JP (1) JP7635834B2 (https=)
CN (1) CN117397030A (https=)
WO (1) WO2022239719A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2024252872A1 (https=) * 2023-06-07 2024-12-12

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE513116C2 (sv) * 1998-11-13 2000-07-10 Ericsson Telefon Ab L M Polykiselresistor och sätt att framställa sådan
US7936043B2 (en) * 2006-03-17 2011-05-03 Sychip Inc. Integrated passive device substrates
JP7318279B2 (ja) * 2019-04-03 2023-08-01 株式会社村田製作所 キャパシタ
JP7439392B2 (ja) * 2019-05-13 2024-02-28 株式会社村田製作所 キャパシタ

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