JPWO2022239719A1 - - Google Patents

Info

Publication number
JPWO2022239719A1
JPWO2022239719A1 JP2023521006A JP2023521006A JPWO2022239719A1 JP WO2022239719 A1 JPWO2022239719 A1 JP WO2022239719A1 JP 2023521006 A JP2023521006 A JP 2023521006A JP 2023521006 A JP2023521006 A JP 2023521006A JP WO2022239719 A1 JPWO2022239719 A1 JP WO2022239719A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023521006A
Other languages
Japanese (ja)
Other versions
JPWO2022239719A5 (https=
JP7635834B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022239719A1 publication Critical patent/JPWO2022239719A1/ja
Publication of JPWO2022239719A5 publication Critical patent/JPWO2022239719A5/ja
Application granted granted Critical
Publication of JP7635834B2 publication Critical patent/JP7635834B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/33Thin- or thick-film capacitors (thin- or thick-film circuits; capacitors without a potential-jump or surface barrier specially adapted for integrated circuits, details thereof, multistep manufacturing processes therefor)
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00Auxiliary devices
    • H01P1/20Frequency-selective devices, e.g. filters
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H7/00Multiple-port networks comprising only passive electrical elements as network components
    • H03H7/01Frequency selective two-port networks
    • H03H7/0115Frequency selective two-port networks comprising only inductors and capacitors
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H7/00Multiple-port networks comprising only passive electrical elements as network components
    • H03H7/38Impedance-matching networks
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02Details
    • H03H9/02007Details of bulk acoustic wave devices
    • H03H9/02086Means for compensation or elimination of undesirable effects
    • H03H9/02125Means for compensation or elimination of undesirable effects of parasitic elements
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02Details
    • H03H9/02535Details of surface acoustic wave devices
    • H03H9/02818Means for compensation or elimination of undesirable effects
    • H03H9/02952Means for compensation or elimination of undesirable effects of parasitic capacitance
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/15Constructional features of resonators consisting of piezoelectric or electrostrictive material
    • H03H9/17Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
    • H03H9/171Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator implemented with thin-film techniques, i.e. of the film bulk acoustic resonator [FBAR] type
    • H03H9/172Means for mounting on a substrate, i.e. means constituting the material interface confining the waves to a volume
    • H03H9/173Air-gaps
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/25Constructional features of resonators using surface acoustic waves
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00Resistors, capacitors or inductors
    • H10D1/60Capacitors
    • H10D1/68Capacitors having no potential barriers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01Manufacture or treatment
    • H10D84/02Manufacture or treatment characterised by using material-based technologies
    • H10D84/03Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology
    • H10D84/038Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology using silicon technology, e.g. SiGe
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/201Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates the substrates comprising an insulating layer on a semiconductor body, e.g. SOI

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Semiconductor Integrated Circuits (AREA)
JP2023521006A 2021-05-10 2022-05-09 受動電子部品用の支持基板、受動電子部品、半導体装置、マッチング回路及びフィルタ回路 Active JP7635834B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021079850 2021-05-10
JP2021079850 2021-05-10
PCT/JP2022/019621 WO2022239719A1 (ja) 2021-05-10 2022-05-09 受動電子部品用の支持基板、受動電子部品、半導体装置、マッチング回路及びフィルタ回路

Publications (3)

Publication Number Publication Date
JPWO2022239719A1 true JPWO2022239719A1 (https=) 2022-11-17
JPWO2022239719A5 JPWO2022239719A5 (https=) 2024-02-13
JP7635834B2 JP7635834B2 (ja) 2025-02-26

Family

ID=84029622

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023521006A Active JP7635834B2 (ja) 2021-05-10 2022-05-09 受動電子部品用の支持基板、受動電子部品、半導体装置、マッチング回路及びフィルタ回路

Country Status (4)

Country Link
US (1) US20240063224A1 (https=)
JP (1) JP7635834B2 (https=)
CN (1) CN117397030A (https=)
WO (1) WO2022239719A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024252872A1 (ja) * 2023-06-07 2024-12-12 株式会社村田製作所 半導体装置、マッチング回路及びフィルタ回路

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002530868A (ja) * 1998-11-13 2002-09-17 テレフオンアクチーボラゲツト エル エム エリクソン(パブル) ポリシリコンレジスタおよびそれを生産する方法
JP2007258713A (ja) * 2006-03-17 2007-10-04 Sychip Inc 集積受動デバイス基板
JP2020170782A (ja) * 2019-04-03 2020-10-15 株式会社村田製作所 キャパシタ
JP2020188091A (ja) * 2019-05-13 2020-11-19 株式会社村田製作所 キャパシタ

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002530868A (ja) * 1998-11-13 2002-09-17 テレフオンアクチーボラゲツト エル エム エリクソン(パブル) ポリシリコンレジスタおよびそれを生産する方法
JP2007258713A (ja) * 2006-03-17 2007-10-04 Sychip Inc 集積受動デバイス基板
JP2020170782A (ja) * 2019-04-03 2020-10-15 株式会社村田製作所 キャパシタ
JP2020188091A (ja) * 2019-05-13 2020-11-19 株式会社村田製作所 キャパシタ

Also Published As

Publication number Publication date
WO2022239719A1 (ja) 2022-11-17
US20240063224A1 (en) 2024-02-22
JP7635834B2 (ja) 2025-02-26
CN117397030A (zh) 2024-01-12

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