JPWO2022209356A5 - - Google Patents

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Publication number
JPWO2022209356A5
JPWO2022209356A5 JP2023510611A JP2023510611A JPWO2022209356A5 JP WO2022209356 A5 JPWO2022209356 A5 JP WO2022209356A5 JP 2023510611 A JP2023510611 A JP 2023510611A JP 2023510611 A JP2023510611 A JP 2023510611A JP WO2022209356 A5 JPWO2022209356 A5 JP WO2022209356A5
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JP
Japan
Prior art keywords
shutter
disposed
sputtering apparatus
retracted state
exhaust pump
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023510611A
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English (en)
Japanese (ja)
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JP7547616B2 (ja
JPWO2022209356A1 (https=
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Publication date
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Priority claimed from PCT/JP2022/005657 external-priority patent/WO2022209356A1/ja
Publication of JPWO2022209356A1 publication Critical patent/JPWO2022209356A1/ja
Publication of JPWO2022209356A5 publication Critical patent/JPWO2022209356A5/ja
Application granted granted Critical
Publication of JP7547616B2 publication Critical patent/JP7547616B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2023510611A 2021-03-29 2022-02-14 スパッタリング装置 Active JP7547616B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021055065 2021-03-29
JP2021055065 2021-03-29
PCT/JP2022/005657 WO2022209356A1 (ja) 2021-03-29 2022-02-14 スパッタリング装置

Publications (3)

Publication Number Publication Date
JPWO2022209356A1 JPWO2022209356A1 (https=) 2022-10-06
JPWO2022209356A5 true JPWO2022209356A5 (https=) 2023-10-18
JP7547616B2 JP7547616B2 (ja) 2024-09-09

Family

ID=83455890

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023510611A Active JP7547616B2 (ja) 2021-03-29 2022-02-14 スパッタリング装置

Country Status (4)

Country Link
US (1) US20240162021A1 (https=)
JP (1) JP7547616B2 (https=)
CN (1) CN117043386A (https=)
WO (1) WO2022209356A1 (https=)

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4473410B2 (ja) * 2000-05-24 2010-06-02 キヤノンアネルバ株式会社 スパッタリング装置及び成膜方法
JP2001144017A (ja) * 2000-09-29 2001-05-25 Semiconductor Energy Lab Co Ltd スパッタ装置
US20040084305A1 (en) * 2002-10-25 2004-05-06 Semiconductor Energy Laboratory Co., Ltd. Sputtering system and manufacturing method of thin film
JP2006016627A (ja) * 2004-06-30 2006-01-19 Nec Kansai Ltd 真空蒸着装置
JP5480290B2 (ja) * 2009-12-04 2014-04-23 キヤノンアネルバ株式会社 スパッタリング装置、及び電子デバイスの製造方法
CN103924206B (zh) * 2010-03-26 2017-01-04 佳能安内华股份有限公司 一种溅射设备
JP5860063B2 (ja) * 2011-12-22 2016-02-16 キヤノンアネルバ株式会社 基板処理装置
KR101330225B1 (ko) * 2012-05-25 2013-11-18 피에스케이 주식회사 기판 접합 방법 및 기판 리플로우 처리 장치
JP5998654B2 (ja) * 2012-05-31 2016-09-28 東京エレクトロン株式会社 真空処理装置、真空処理方法及び記憶媒体
CN104947039B (zh) * 2014-03-24 2017-07-04 北京北方微电子基地设备工艺研究中心有限责任公司 隔热挡板及反应腔室
CN110808384B (zh) * 2019-10-11 2021-04-27 浙江锋源氢能科技有限公司 一种金属双极板及其制备方法以及燃料电池

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