JPWO2022202485A5 - - Google Patents

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Publication number
JPWO2022202485A5
JPWO2022202485A5 JP2022561081A JP2022561081A JPWO2022202485A5 JP WO2022202485 A5 JPWO2022202485 A5 JP WO2022202485A5 JP 2022561081 A JP2022561081 A JP 2022561081A JP 2022561081 A JP2022561081 A JP 2022561081A JP WO2022202485 A5 JPWO2022202485 A5 JP WO2022202485A5
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JP
Japan
Prior art keywords
photosensitive resin
compound
resin composition
composition according
ditrimethylolpropane
Prior art date
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Application number
JP2022561081A
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English (en)
Japanese (ja)
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JP7287581B2 (ja
JPWO2022202485A1 (https=
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Priority claimed from PCT/JP2022/011565 external-priority patent/WO2022202485A1/ja
Publication of JPWO2022202485A1 publication Critical patent/JPWO2022202485A1/ja
Publication of JPWO2022202485A5 publication Critical patent/JPWO2022202485A5/ja
Application granted granted Critical
Publication of JP7287581B2 publication Critical patent/JP7287581B2/ja
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JP2022561081A 2021-03-24 2022-03-15 感光性樹脂組成物、感光性エレメント、及び、積層体の製造方法 Active JP7287581B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021050122 2021-03-24
JP2021050122 2021-03-24
PCT/JP2022/011565 WO2022202485A1 (ja) 2021-03-24 2022-03-15 感光性樹脂組成物、感光性エレメント、及び、積層体の製造方法

Publications (3)

Publication Number Publication Date
JPWO2022202485A1 JPWO2022202485A1 (https=) 2022-09-29
JPWO2022202485A5 true JPWO2022202485A5 (https=) 2023-02-21
JP7287581B2 JP7287581B2 (ja) 2023-06-06

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ID=83397235

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022561081A Active JP7287581B2 (ja) 2021-03-24 2022-03-15 感光性樹脂組成物、感光性エレメント、及び、積層体の製造方法

Country Status (5)

Country Link
JP (1) JP7287581B2 (https=)
KR (1) KR20230161863A (https=)
CN (1) CN117043677A (https=)
TW (1) TW202244078A (https=)
WO (1) WO2022202485A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025243400A1 (ja) * 2024-05-21 2025-11-27 株式会社レゾナック 感光性樹脂組成物、感光性エレメント、硬化物、硬化物パターンの製造方法、及び、導体パターンの製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8105759B2 (en) 2005-07-05 2012-01-31 Hitachi Chemical Company, Ltd. Photosensitive resin composition, and, photosensitive element, method for forming resist pattern, method for manufacturing printed wiring board and method for manufacturing partition wall for plasma display panel using the composition
JP4997201B2 (ja) * 2008-09-05 2012-08-08 富士フイルム株式会社 平版印刷版の作製方法
CN105467765B (zh) * 2014-09-30 2020-04-24 富士胶片株式会社 感光性组合物、硬化膜的制造方法、硬化膜及其应用
CN109791450B (zh) * 2016-09-29 2021-10-26 富士胶片株式会社 触摸面板的制造方法
WO2021192058A1 (ja) * 2020-03-24 2021-09-30 昭和電工マテリアルズ株式会社 感光性樹脂組成物、感光性エレメント、及び配線基板の製造方法

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