JPWO2022172827A5 - - Google Patents

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Publication number
JPWO2022172827A5
JPWO2022172827A5 JP2022580577A JP2022580577A JPWO2022172827A5 JP WO2022172827 A5 JPWO2022172827 A5 JP WO2022172827A5 JP 2022580577 A JP2022580577 A JP 2022580577A JP 2022580577 A JP2022580577 A JP 2022580577A JP WO2022172827 A5 JPWO2022172827 A5 JP WO2022172827A5
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JP
Japan
Prior art keywords
ring
support pins
processing system
substrate
substrate processing
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JP2022580577A
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English (en)
Japanese (ja)
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JPWO2022172827A1 (https=
JP7293517B2 (ja
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Priority claimed from PCT/JP2022/004058 external-priority patent/WO2022172827A1/ja
Publication of JPWO2022172827A1 publication Critical patent/JPWO2022172827A1/ja
Publication of JPWO2022172827A5 publication Critical patent/JPWO2022172827A5/ja
Priority to JP2023093767A priority Critical patent/JP2023113850A/ja
Application granted granted Critical
Publication of JP7293517B2 publication Critical patent/JP7293517B2/ja
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JP2022580577A 2021-02-09 2022-02-02 基板処理システム及び搬送方法 Active JP7293517B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2023093767A JP2023113850A (ja) 2021-02-09 2023-06-07 基板処理システム及び搬送方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021018937 2021-02-09
JP2021018937 2021-02-09
PCT/JP2022/004058 WO2022172827A1 (ja) 2021-02-09 2022-02-02 基板処理システム及び搬送方法

Related Child Applications (1)

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JP2023093767A Division JP2023113850A (ja) 2021-02-09 2023-06-07 基板処理システム及び搬送方法

Publications (3)

Publication Number Publication Date
JPWO2022172827A1 JPWO2022172827A1 (https=) 2022-08-18
JPWO2022172827A5 true JPWO2022172827A5 (https=) 2023-04-28
JP7293517B2 JP7293517B2 (ja) 2023-06-19

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ID=82838802

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JP2022580577A Active JP7293517B2 (ja) 2021-02-09 2022-02-02 基板処理システム及び搬送方法
JP2023093767A Pending JP2023113850A (ja) 2021-02-09 2023-06-07 基板処理システム及び搬送方法

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JP2023093767A Pending JP2023113850A (ja) 2021-02-09 2023-06-07 基板処理システム及び搬送方法

Country Status (6)

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US (2) US12165893B2 (https=)
JP (2) JP7293517B2 (https=)
KR (3) KR20250163393A (https=)
CN (1) CN116057676A (https=)
TW (2) TWI868422B (https=)
WO (1) WO2022172827A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12581825B2 (en) 2021-04-23 2026-03-17 Applied Materials, Inc. Conductive oxide overhang structures for OLED devices
KR20220156138A (ko) * 2021-05-17 2022-11-25 세메스 주식회사 링 캐리어 및 기판 처리 시스템
KR20250084933A (ko) * 2022-09-30 2025-06-11 도쿄엘렉트론가부시키가이샤 기판 처리 시스템
CN120770070A (zh) * 2023-03-17 2025-10-10 东京毅力科创株式会社 等离子体处理系统和环状构件的高度的估计方法
US20240339352A1 (en) * 2023-04-07 2024-10-10 Applied Materials, Inc. Susceptor for process chamber

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10658222B2 (en) * 2015-01-16 2020-05-19 Lam Research Corporation Moveable edge coupling ring for edge process control during semiconductor wafer processing
US9881820B2 (en) * 2015-10-22 2018-01-30 Lam Research Corporation Front opening ring pod
US9892956B1 (en) * 2016-10-12 2018-02-13 Lam Research Corporation Wafer positioning pedestal for semiconductor processing
US11043400B2 (en) * 2017-12-21 2021-06-22 Applied Materials, Inc. Movable and removable process kit
KR102433436B1 (ko) * 2018-07-04 2022-08-17 삼성전자주식회사 기판 처리 시스템, 기판 처리 시스템에서의 에지 링 정렬 검사 방법 및 이를 수행하기 위한 원반형 비젼 센서
JP7129325B2 (ja) * 2018-12-14 2022-09-01 東京エレクトロン株式会社 搬送方法及び搬送システム
JP7134104B2 (ja) 2019-01-09 2022-09-09 東京エレクトロン株式会社 プラズマ処理装置およびプラズマ処理装置の載置台
US20200234928A1 (en) * 2019-01-17 2020-07-23 Applied Materials, Inc. Semiconductor plasma processing equipment with wafer edge plasma sheath tuning ability
TWM588883U (zh) * 2019-05-10 2020-01-01 美商蘭姆研究公司 半導體製程模組的中環
JP7345289B2 (ja) * 2019-06-18 2023-09-15 東京エレクトロン株式会社 基板処理装置、基板処理システム及び基板搬送方法
JP7465733B2 (ja) * 2019-09-26 2024-04-11 東京エレクトロン株式会社 基板支持器及びプラズマ処理装置
KR102747645B1 (ko) * 2019-10-10 2024-12-27 삼성전자주식회사 정전 척 및 상기 정전 척을 포함하는 기판 처리 장치

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