JPWO2022157870A1 - - Google Patents

Info

Publication number
JPWO2022157870A1
JPWO2022157870A1 JP2022576284A JP2022576284A JPWO2022157870A1 JP WO2022157870 A1 JPWO2022157870 A1 JP WO2022157870A1 JP 2022576284 A JP2022576284 A JP 2022576284A JP 2022576284 A JP2022576284 A JP 2022576284A JP WO2022157870 A1 JPWO2022157870 A1 JP WO2022157870A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022576284A
Other languages
Japanese (ja)
Other versions
JPWO2022157870A5 (https=
JP7373874B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022157870A1 publication Critical patent/JPWO2022157870A1/ja
Publication of JPWO2022157870A5 publication Critical patent/JPWO2022157870A5/ja
Application granted granted Critical
Publication of JP7373874B2 publication Critical patent/JP7373874B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/04—Analysing solids
    • G01N29/06—Visualisation of the interior, e.g. acoustic microscopy
    • G01N29/0654—Imaging
    • G01N29/069—Defect imaging, localisation and sizing using, e.g. time of flight diffraction [TOFD], synthetic aperture focusing technique [SAFT], Amplituden-Laufzeit-Ortskurven [ALOK] technique
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/22—Details, e.g. general constructional or apparatus details
    • G01N29/223—Supports, positioning or alignment in fixed situation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/04—Analysing solids
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/04—Analysing solids
    • G01N29/041—Analysing solids on the surface of the material, e.g. using Lamb, Rayleigh or shear waves
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/04—Analysing solids
    • G01N29/043—Analysing solids in the interior, e.g. by shear waves
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/04—Analysing solids
    • G01N29/06—Visualisation of the interior, e.g. acoustic microscopy
    • G01N29/0609—Display arrangements, e.g. colour displays
    • G01N29/0618—Display arrangements, e.g. colour displays synchronised with scanning, e.g. in real-time
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/04—Analysing solids
    • G01N29/06—Visualisation of the interior, e.g. acoustic microscopy
    • G01N29/0609—Display arrangements, e.g. colour displays
    • G01N29/0645—Display representation or displayed parameters, e.g. A-, B- or C-Scan
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/22—Details, e.g. general constructional or apparatus details
    • G01N29/24—Probes
    • G01N29/2418—Probes using optoacoustic interaction with the material, e.g. laser radiation, photoacoustics
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/34—Generating the ultrasonic, sonic or infrasonic waves, e.g. electronic circuits specially adapted therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8854—Grading and classifying of flaws
    • G01N2021/888—Marking defects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8887—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00—Indexing codes associated with group G01N29/00
    • G01N2291/02—Indexing codes associated with the analysed material
    • G01N2291/023—Solids
    • G01N2291/0231—Composite or layered materials
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00—Indexing codes associated with group G01N29/00
    • G01N2291/02—Indexing codes associated with the analysed material
    • G01N2291/028—Material parameters
    • G01N2291/0289—Internal structure, e.g. defects, grain size, texture
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00—Indexing codes associated with group G01N29/00
    • G01N2291/10—Number of transducers
    • G01N2291/104—Number of transducers two or more emitters, one receiver

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Pathology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Acoustics & Sound (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Signal Processing (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measurement Of Mechanical Vibrations Or Ultrasonic Waves (AREA)
JP2022576284A 2021-01-21 2021-01-21 不良検出装置及び不良検出方法 Active JP7373874B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/001929 WO2022157870A1 (ja) 2021-01-21 2021-01-21 不良検出装置及び不良検出方法

Publications (3)

Publication Number Publication Date
JPWO2022157870A1 true JPWO2022157870A1 (https=) 2022-07-28
JPWO2022157870A5 JPWO2022157870A5 (https=) 2023-03-15
JP7373874B2 JP7373874B2 (ja) 2023-11-06

Family

ID=82548591

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022576284A Active JP7373874B2 (ja) 2021-01-21 2021-01-21 不良検出装置及び不良検出方法

Country Status (6)

Country Link
US (1) US12487206B2 (https=)
JP (1) JP7373874B2 (https=)
KR (1) KR102811974B1 (https=)
CN (1) CN115769071B (https=)
TW (1) TWI820581B (https=)
WO (1) WO2022157870A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI847338B (zh) * 2022-11-01 2024-07-01 華碩電腦股份有限公司 電子裝置之震動控制方法
TW202548237A (zh) * 2023-12-27 2025-12-16 新加坡商聯達科技控股有限公司 針對裝置之側壁附近處由晶圓切割製程所致之內部缺陷的裝置檢測系統及方法
TWI874280B (zh) * 2024-09-20 2025-02-21 新加坡商先進科技新加坡有限公司 用於電子器件的缺陷檢驗方法和裝置
CN120495217B (zh) * 2025-05-06 2026-01-23 徐州远翔机车科技有限公司 一种钢轮表面划痕检测方法及系统

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6085363A (ja) * 1983-10-17 1985-05-14 Hitachi Ltd 接合状態検出方法及びその装置
JPS627200A (ja) * 1985-07-03 1987-01-14 株式会社日立製作所 接合状態検出装置
JPH01145566A (ja) * 1987-12-02 1989-06-07 Shinkuraito:Kk ボンディング状態検査装置
US5146289A (en) * 1990-12-21 1992-09-08 Laser Technology, Inc. Nondestructive testing using air-coupled acoustic excitation
JPH07218449A (ja) * 1994-02-04 1995-08-18 Toyota Motor Corp 光学的表面欠陥検出方法
JP2004101189A (ja) * 2002-09-04 2004-04-02 Hitachi Ltd 欠陥検査装置及び欠陥検査方法
JP2007024674A (ja) * 2005-07-15 2007-02-01 Hitachi Ltd 表面・表層検査装置、及び表面・表層検査方法
JP2011058879A (ja) * 2009-09-08 2011-03-24 Mitsubishi Electric Corp クラック検知支援装置
JP2016130683A (ja) * 2015-01-14 2016-07-21 東芝テック株式会社 振動計測装置
JP2018132481A (ja) * 2017-02-17 2018-08-23 学校法人桐蔭学園 解析装置及び解析システム
CN108613979A (zh) * 2018-03-12 2018-10-02 华中科技大学鄂州工业技术研究院 用于粘弹性定量检测的激光散斑图像处理装置及方法
DE102018221795A1 (de) * 2018-12-14 2020-06-18 Volkswagen Aktiengesellschaft Vorrichtung zur Erzeugung eines haptisch wahrnehmbaren Bereiches sowie Konfigurations- und Steuerverfahren einer solchen Vorrichtung
CN111316093A (zh) * 2018-12-14 2020-06-19 合刃科技（深圳）有限公司 结构缺陷检测系统及结构缺陷检测方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61254834A (ja) 1985-05-08 1986-11-12 Matsushita Electric Ind Co Ltd 走査型光音響顕微鏡装置
JP5421763B2 (ja) * 2009-12-24 2014-02-19 ヤマハ発動機株式会社 検査装置および検査方法
JP2014228486A (ja) * 2013-05-24 2014-12-08 インスペック株式会社 三次元プロファイル取得装置、パターン検査装置及び三次元プロファイル取得方法
JP6433268B2 (ja) * 2014-03-31 2018-12-05 国立大学法人 東京大学 検査システムおよび検査方法
JP2016191552A (ja) 2015-03-30 2016-11-10 三菱重工業株式会社 非破壊検査装置及び非破壊検査方法
CN107710114A (zh) * 2015-06-25 2018-02-16 富士通株式会社 电子设备、以及驱动控制方法
CN206892031U (zh) * 2016-07-12 2018-01-16 纳路易爱姆斯株式会社 具备位置识别飞行单元与图像拍摄部的检查用飞行体
KR20190108598A (ko) * 2017-03-29 2019-09-24 닛폰세이테츠 가부시키가이샤 결함 검출 장치, 결함 검출 방법 및 프로그램
US10778912B2 (en) * 2018-03-31 2020-09-15 Open Water Internet Inc. System and device for optical transformation
EP3779378B1 (en) * 2018-04-05 2022-05-11 Shimadzu Corporation Vibration measurement device
WO2019239618A1 (ja) * 2018-06-11 2019-12-19 株式会社島津製作所 欠陥検出方法及び装置
US10966612B2 (en) * 2018-06-14 2021-04-06 Open Water Internet Inc. Expanding beam optical element
US10962929B2 (en) * 2018-09-14 2021-03-30 Open Water Internet Inc. Interference optics for optical imaging device

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6085363A (ja) * 1983-10-17 1985-05-14 Hitachi Ltd 接合状態検出方法及びその装置
JPS627200A (ja) * 1985-07-03 1987-01-14 株式会社日立製作所 接合状態検出装置
JPH01145566A (ja) * 1987-12-02 1989-06-07 Shinkuraito:Kk ボンディング状態検査装置
US5146289A (en) * 1990-12-21 1992-09-08 Laser Technology, Inc. Nondestructive testing using air-coupled acoustic excitation
JPH07218449A (ja) * 1994-02-04 1995-08-18 Toyota Motor Corp 光学的表面欠陥検出方法
JP2004101189A (ja) * 2002-09-04 2004-04-02 Hitachi Ltd 欠陥検査装置及び欠陥検査方法
JP2007024674A (ja) * 2005-07-15 2007-02-01 Hitachi Ltd 表面・表層検査装置、及び表面・表層検査方法
JP2011058879A (ja) * 2009-09-08 2011-03-24 Mitsubishi Electric Corp クラック検知支援装置
JP2016130683A (ja) * 2015-01-14 2016-07-21 東芝テック株式会社 振動計測装置
JP2018132481A (ja) * 2017-02-17 2018-08-23 学校法人桐蔭学園 解析装置及び解析システム
CN108613979A (zh) * 2018-03-12 2018-10-02 华中科技大学鄂州工业技术研究院 用于粘弹性定量检测的激光散斑图像处理装置及方法
DE102018221795A1 (de) * 2018-12-14 2020-06-18 Volkswagen Aktiengesellschaft Vorrichtung zur Erzeugung eines haptisch wahrnehmbaren Bereiches sowie Konfigurations- und Steuerverfahren einer solchen Vorrichtung
CN111316093A (zh) * 2018-12-14 2020-06-19 合刃科技（深圳）有限公司 结构缺陷检测系统及结构缺陷检测方法

Also Published As

Publication number Publication date
WO2022157870A1 (ja) 2022-07-28
JP7373874B2 (ja) 2023-11-06
US20240426790A1 (en) 2024-12-26
US12487206B2 (en) 2025-12-02
KR20230056721A (ko) 2023-04-27
KR102811974B1 (ko) 2025-05-22
TW202229857A (zh) 2022-08-01
CN115769071A (zh) 2023-03-07
TWI820581B (zh) 2023-11-01
CN115769071B (zh) 2025-07-04

Similar Documents

Publication Publication Date Title
BR112023005462A2 (https=)
BR112023012656A2 (https=)
BR112021014123A2 (https=)
BR112023009656A2 (https=)
JPWO2022059710A1 (https=)
BR112022009896A2 (https=)
BR112021017747A2 (https=)
JPWO2022157870A1 (https=)
BR112022024743A2 (https=)
BR112022026905A2 (https=)
BR112023011738A2 (https=)
BR112023004146A2 (https=)
BR112023006729A2 (https=)
BR102021018859A2 (https=)
BR102021015500A2 (https=)
BR112023016292A2 (https=)
BR112023011610A2 (https=)
BR112023011539A2 (https=)
BR112023008976A2 (https=)
BR102021020147A2 (https=)
BR102021018926A2 (https=)
BR102021018167A2 (https=)
BR102021017576A2 (https=)
BR102021016837A2 (https=)
BR102021016551A2 (https=)

Legal Events

Date Code Title Description
A529 Written submission of copy of amendment under article 34 pct

Free format text: JAPANESE INTERMEDIATE CODE: A5211

Effective date: 20221122

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20221122

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20230718

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20230822

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20231003

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20231017

R150 Certificate of patent or registration of utility model

Ref document number: 7373874

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150