JPWO2022157870A1 - - Google Patents

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Publication number
JPWO2022157870A1
JPWO2022157870A1 JP2022576284A JP2022576284A JPWO2022157870A1 JP WO2022157870 A1 JPWO2022157870 A1 JP WO2022157870A1 JP 2022576284 A JP2022576284 A JP 2022576284A JP 2022576284 A JP2022576284 A JP 2022576284A JP WO2022157870 A1 JPWO2022157870 A1 JP WO2022157870A1
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2022576284A
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JP7373874B2 (ja
JPWO2022157870A5 (ja
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Publication of JPWO2022157870A5 publication Critical patent/JPWO2022157870A5/ja
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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/04—Analysing solids
    • G01N29/06—Visualisation of the interior, e.g. acoustic microscopy
    • G01N29/0654—Imaging
    • G01N29/069—Defect imaging, localisation and sizing using, e.g. time of flight diffraction [TOFD], synthetic aperture focusing technique [SAFT], Amplituden-Laufzeit-Ortskurven [ALOK] technique
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/04—Analysing solids
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/04—Analysing solids
    • G01N29/041—Analysing solids on the surface of the material, e.g. using Lamb, Rayleigh or shear waves
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/04—Analysing solids
    • G01N29/06—Visualisation of the interior, e.g. acoustic microscopy
    • G01N29/0609—Display arrangements, e.g. colour displays
    • G01N29/0618—Display arrangements, e.g. colour displays synchronised with scanning, e.g. in real-time
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/04—Analysing solids
    • G01N29/06—Visualisation of the interior, e.g. acoustic microscopy
    • G01N29/0609—Display arrangements, e.g. colour displays
    • G01N29/0645—Display representation or displayed parameters, e.g. A-, B- or C-Scan
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/34—Generating the ultrasonic, sonic or infrasonic waves, e.g. electronic circuits specially adapted therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8854—Grading and classifying of flaws
    • G01N2021/888—Marking defects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8887—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Immunology (AREA)
  • Biochemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Pathology (AREA)
  • Analytical Chemistry (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Signal Processing (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measurement Of Mechanical Vibrations Or Ultrasonic Waves (AREA)
JP2022576284A 2021-01-21 2021-01-21 不良検出装置及び不良検出方法 Active JP7373874B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/001929 WO2022157870A1 (ja) 2021-01-21 2021-01-21 不良検出装置及び不良検出方法

Publications (3)

Publication Number Publication Date
JPWO2022157870A1 true JPWO2022157870A1 (ja) 2022-07-28
JPWO2022157870A5 JPWO2022157870A5 (ja) 2023-03-15
JP7373874B2 JP7373874B2 (ja) 2023-11-06

Family

ID=82548591

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022576284A Active JP7373874B2 (ja) 2021-01-21 2021-01-21 不良検出装置及び不良検出方法

Country Status (5)

Country Link
JP (1) JP7373874B2 (ja)
KR (1) KR20230056721A (ja)
CN (1) CN115769071A (ja)
TW (1) TWI820581B (ja)
WO (1) WO2022157870A1 (ja)

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6085363A (ja) * 1983-10-17 1985-05-14 Hitachi Ltd 接合状態検出方法及びその装置
JPS627200A (ja) * 1985-07-03 1987-01-14 株式会社日立製作所 接合状態検出装置
JPH01145566A (ja) * 1987-12-02 1989-06-07 Shinkuraito:Kk ボンディング状態検査装置
US5146289A (en) * 1990-12-21 1992-09-08 Laser Technology, Inc. Nondestructive testing using air-coupled acoustic excitation
JPH07218449A (ja) * 1994-02-04 1995-08-18 Toyota Motor Corp 光学的表面欠陥検出方法
JP2004101189A (ja) * 2002-09-04 2004-04-02 Hitachi Ltd 欠陥検査装置及び欠陥検査方法
JP2007024674A (ja) * 2005-07-15 2007-02-01 Hitachi Ltd 表面・表層検査装置、及び表面・表層検査方法
JP2011058879A (ja) * 2009-09-08 2011-03-24 Mitsubishi Electric Corp クラック検知支援装置
JP2016130683A (ja) * 2015-01-14 2016-07-21 東芝テック株式会社 振動計測装置
JP2018132481A (ja) * 2017-02-17 2018-08-23 学校法人桐蔭学園 解析装置及び解析システム
CN108613979A (zh) * 2018-03-12 2018-10-02 华中科技大学鄂州工业技术研究院 用于粘弹性定量检测的激光散斑图像处理装置及方法
DE102018221795A1 (de) * 2018-12-14 2020-06-18 Volkswagen Aktiengesellschaft Vorrichtung zur Erzeugung eines haptisch wahrnehmbaren Bereiches sowie Konfigurations- und Steuerverfahren einer solchen Vorrichtung
CN111316093A (zh) * 2018-12-14 2020-06-19 合刃科技（深圳）有限公司 结构缺陷检测系统及结构缺陷检测方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61254834A (ja) 1985-05-08 1986-11-12 Matsushita Electric Ind Co Ltd 走査型光音響顕微鏡装置
JP2016191552A (ja) 2015-03-30 2016-11-10 三菱重工業株式会社 非破壊検査装置及び非破壊検査方法
EP3805735A4 (en) * 2018-06-11 2021-07-21 Shimadzu Corporation FAULT DETECTION METHOD AND DEVICE

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6085363A (ja) * 1983-10-17 1985-05-14 Hitachi Ltd 接合状態検出方法及びその装置
JPS627200A (ja) * 1985-07-03 1987-01-14 株式会社日立製作所 接合状態検出装置
JPH01145566A (ja) * 1987-12-02 1989-06-07 Shinkuraito:Kk ボンディング状態検査装置
US5146289A (en) * 1990-12-21 1992-09-08 Laser Technology, Inc. Nondestructive testing using air-coupled acoustic excitation
JPH07218449A (ja) * 1994-02-04 1995-08-18 Toyota Motor Corp 光学的表面欠陥検出方法
JP2004101189A (ja) * 2002-09-04 2004-04-02 Hitachi Ltd 欠陥検査装置及び欠陥検査方法
JP2007024674A (ja) * 2005-07-15 2007-02-01 Hitachi Ltd 表面・表層検査装置、及び表面・表層検査方法
JP2011058879A (ja) * 2009-09-08 2011-03-24 Mitsubishi Electric Corp クラック検知支援装置
JP2016130683A (ja) * 2015-01-14 2016-07-21 東芝テック株式会社 振動計測装置
JP2018132481A (ja) * 2017-02-17 2018-08-23 学校法人桐蔭学園 解析装置及び解析システム
CN108613979A (zh) * 2018-03-12 2018-10-02 华中科技大学鄂州工业技术研究院 用于粘弹性定量检测的激光散斑图像处理装置及方法
DE102018221795A1 (de) * 2018-12-14 2020-06-18 Volkswagen Aktiengesellschaft Vorrichtung zur Erzeugung eines haptisch wahrnehmbaren Bereiches sowie Konfigurations- und Steuerverfahren einer solchen Vorrichtung
CN111316093A (zh) * 2018-12-14 2020-06-19 合刃科技（深圳）有限公司 结构缺陷检测系统及结构缺陷检测方法

Also Published As

Publication number Publication date
JP7373874B2 (ja) 2023-11-06
KR20230056721A (ko) 2023-04-27
TWI820581B (zh) 2023-11-01
WO2022157870A1 (ja) 2022-07-28
TW202229857A (zh) 2022-08-01
CN115769071A (zh) 2023-03-07

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