JPWO2022149435A5 - - Google Patents

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Publication number
JPWO2022149435A5
JPWO2022149435A5 JP2022570166A JP2022570166A JPWO2022149435A5 JP WO2022149435 A5 JPWO2022149435 A5 JP WO2022149435A5 JP 2022570166 A JP2022570166 A JP 2022570166A JP 2022570166 A JP2022570166 A JP 2022570166A JP WO2022149435 A5 JPWO2022149435 A5 JP WO2022149435A5
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JP
Japan
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maximum point
boron nitride
particle size
nitride powder
point
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JP2022570166A
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English (en)
Japanese (ja)
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JP7291304B2 (ja
JPWO2022149435A1 (https=
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Priority claimed from PCT/JP2021/046762 external-priority patent/WO2022149435A1/ja
Publication of JPWO2022149435A1 publication Critical patent/JPWO2022149435A1/ja
Publication of JPWO2022149435A5 publication Critical patent/JPWO2022149435A5/ja
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JP2022570166A 2021-01-06 2021-12-17 窒化ホウ素粉末、放熱シート及び放熱シートの製造方法 Active JP7291304B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021000881 2021-01-06
JP2021000881 2021-01-06
PCT/JP2021/046762 WO2022149435A1 (ja) 2021-01-06 2021-12-17 窒化ホウ素粉末、放熱シート及び放熱シートの製造方法

Publications (3)

Publication Number Publication Date
JPWO2022149435A1 JPWO2022149435A1 (https=) 2022-07-14
JPWO2022149435A5 true JPWO2022149435A5 (https=) 2023-02-09
JP7291304B2 JP7291304B2 (ja) 2023-06-14

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JP2022570166A Active JP7291304B2 (ja) 2021-01-06 2021-12-17 窒化ホウ素粉末、放熱シート及び放熱シートの製造方法

Country Status (5)

Country Link
US (1) US20240026198A1 (https=)
EP (1) EP4253315B1 (https=)
JP (1) JP7291304B2 (https=)
CN (1) CN116670233B (https=)
WO (1) WO2022149435A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4657519A1 (en) * 2023-03-27 2025-12-03 Denka Company Limited Thermally conductive sheet
CN120814049A (zh) * 2023-03-27 2025-10-17 电化株式会社 导热性片材及聚集氮化硼粒子
CN116589864A (zh) * 2023-05-22 2023-08-15 苏州博濬新材料科技有限公司 一种能够维持高导热性的导热性树脂组合物制备方法

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3466028B2 (ja) * 1996-08-27 2003-11-10 三井化学株式会社 窒化ホウ素粉末及びその製造方法
CN101528902A (zh) * 2006-10-17 2009-09-09 电气化学工业株式会社 油脂
JP4889110B2 (ja) * 2007-02-05 2012-03-07 日東電工株式会社 熱伝導性樹脂組成物および熱伝導性シートとその製造方法
EP2626205A1 (en) * 2010-10-06 2013-08-14 Hitachi Chemical Co., Ltd. Multilayer resin sheet and process for production thereof, resin sheet laminate and process for production thereof, cured multilayer resin sheet, metal-foil-cladded multilayer resin sheet, and semiconductor device
US9656868B2 (en) * 2013-03-07 2017-05-23 Denka Company Limited Boron-nitride powder and resin composition containing same
EP3127973B1 (en) * 2015-08-07 2019-04-03 3M Innovative Properties Company Thermally conductive pressure sensitive adhesive
KR102560615B1 (ko) * 2015-08-26 2023-07-27 덴카 주식회사 열전도성 수지 조성물
JP6816920B2 (ja) * 2016-02-22 2021-01-20 昭和電工株式会社 六方晶窒化ホウ素粉末、その製造方法、樹脂組成物及び樹脂シート
JP6746443B2 (ja) * 2016-09-13 2020-08-26 株式会社トクヤマ 六方晶窒化ホウ素粉末
CN109790025B (zh) * 2016-10-07 2023-05-30 电化株式会社 氮化硼块状粒子、其制造方法及使用了其的导热树脂组合物
KR102508160B1 (ko) * 2017-03-07 2023-03-10 가부시끼가이샤 도꾸야마 조대 입자를 포함하지 않는 질화알루미늄 분말
KR102619752B1 (ko) * 2017-10-13 2023-12-29 덴카 주식회사 질화붕소 분말, 그 제조 방법 및 그것을 사용한 방열 부재
JP7069485B2 (ja) * 2017-12-27 2022-05-18 昭和電工株式会社 六方晶窒化ホウ素粉末及びその製造方法、並びにそれを用いた組成物及び放熱材
WO2019164002A1 (ja) * 2018-02-26 2019-08-29 デンカ株式会社 絶縁放熱シート
JPWO2020049817A1 (ja) * 2018-09-07 2020-09-10 昭和電工株式会社 六方晶窒化ホウ素粉末及びその製造方法、並びにそれを用いた組成物及び放熱材
JP7467980B2 (ja) 2019-02-27 2024-04-16 三菱ケミカル株式会社 窒化ホウ素凝集粉末、放熱シート及び半導体デバイスの製造方法
US20220154059A1 (en) * 2019-03-27 2022-05-19 Denka Company Limited Boron nitride aggregated particles, thermal conductive resin composition, and heat dissipation member
DE102019204191A1 (de) * 2019-03-27 2020-10-01 Siemens Aktiengesellschaft Gießharz, Formstoff daraus, Verwendung dazu und eine elektrische Isolierung
JP7273587B2 (ja) * 2019-03-29 2023-05-15 デンカ株式会社 窒化ホウ素粉末及び樹脂組成物
JP7476482B2 (ja) * 2019-04-01 2024-05-01 住友ベークライト株式会社 熱伝導性シート

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