CN116670233B - 氮化硼粉末、散热片材及散热片材的制造方法 - Google Patents

氮化硼粉末、散热片材及散热片材的制造方法 Download PDF

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CN116670233B
CN116670233B CN202180088577.0A CN202180088577A CN116670233B CN 116670233 B CN116670233 B CN 116670233B CN 202180088577 A CN202180088577 A CN 202180088577A CN 116670233 B CN116670233 B CN 116670233B
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boron nitride
nitride powder
maximum point
particle diameter
sheet
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CN116670233A (zh
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和田光祐
藤清隆
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Denka Co Ltd
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Denka Co Ltd
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    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
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    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
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    • C01B21/00—Nitrogen; Compounds thereof
    • C01B21/06—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron
    • C01B21/064—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron with boron
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
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    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
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    • C01P2002/70—Crystal-structural characteristics defined by measured X-ray, neutron or electron diffraction data
    • C01P2002/76—Crystal-structural characteristics defined by measured X-ray, neutron or electron diffraction data by a space-group or by other symmetry indications
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    • C01—INORGANIC CHEMISTRY
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    • C01P2004/60—Particles characterised by their size
    • C01P2004/62—Submicrometer sized, i.e. from 0.1-1 micrometer
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    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
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    • C08J2383/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
    • C08J2383/04—Polysiloxanes
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
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    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/251—Organics

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  • Polymers & Plastics (AREA)
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  • Manufacturing & Machinery (AREA)
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  • Physics & Mathematics (AREA)
  • Combustion & Propulsion (AREA)
  • Thermal Sciences (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Ceramic Products (AREA)
CN202180088577.0A 2021-01-06 2021-12-17 氮化硼粉末、散热片材及散热片材的制造方法 Active CN116670233B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021-000881 2021-01-06
JP2021000881 2021-01-06
PCT/JP2021/046762 WO2022149435A1 (ja) 2021-01-06 2021-12-17 窒化ホウ素粉末、放熱シート及び放熱シートの製造方法

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CN116670233A CN116670233A (zh) 2023-08-29
CN116670233B true CN116670233B (zh) 2024-08-09

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US (1) US20240026198A1 (https=)
EP (1) EP4253315B1 (https=)
JP (1) JP7291304B2 (https=)
CN (1) CN116670233B (https=)
WO (1) WO2022149435A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4657519A1 (en) * 2023-03-27 2025-12-03 Denka Company Limited Thermally conductive sheet
CN120814049A (zh) * 2023-03-27 2025-10-17 电化株式会社 导热性片材及聚集氮化硼粒子
CN116589864A (zh) * 2023-05-22 2023-08-15 苏州博濬新材料科技有限公司 一种能够维持高导热性的导热性树脂组合物制备方法

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JP2008189818A (ja) * 2007-02-05 2008-08-21 Nitto Denko Corp 熱伝導性樹脂組成物および熱伝導性シートとその製造方法
JP2020164365A (ja) * 2019-03-29 2020-10-08 デンカ株式会社 窒化ホウ素粉末及び樹脂組成物

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JP3466028B2 (ja) * 1996-08-27 2003-11-10 三井化学株式会社 窒化ホウ素粉末及びその製造方法
CN101528902A (zh) * 2006-10-17 2009-09-09 电气化学工业株式会社 油脂
EP2626205A1 (en) * 2010-10-06 2013-08-14 Hitachi Chemical Co., Ltd. Multilayer resin sheet and process for production thereof, resin sheet laminate and process for production thereof, cured multilayer resin sheet, metal-foil-cladded multilayer resin sheet, and semiconductor device
US9656868B2 (en) * 2013-03-07 2017-05-23 Denka Company Limited Boron-nitride powder and resin composition containing same
EP3127973B1 (en) * 2015-08-07 2019-04-03 3M Innovative Properties Company Thermally conductive pressure sensitive adhesive
KR102560615B1 (ko) * 2015-08-26 2023-07-27 덴카 주식회사 열전도성 수지 조성물
JP6816920B2 (ja) * 2016-02-22 2021-01-20 昭和電工株式会社 六方晶窒化ホウ素粉末、その製造方法、樹脂組成物及び樹脂シート
JP6746443B2 (ja) * 2016-09-13 2020-08-26 株式会社トクヤマ 六方晶窒化ホウ素粉末
CN109790025B (zh) * 2016-10-07 2023-05-30 电化株式会社 氮化硼块状粒子、其制造方法及使用了其的导热树脂组合物
KR102508160B1 (ko) * 2017-03-07 2023-03-10 가부시끼가이샤 도꾸야마 조대 입자를 포함하지 않는 질화알루미늄 분말
KR102619752B1 (ko) * 2017-10-13 2023-12-29 덴카 주식회사 질화붕소 분말, 그 제조 방법 및 그것을 사용한 방열 부재
JP7069485B2 (ja) * 2017-12-27 2022-05-18 昭和電工株式会社 六方晶窒化ホウ素粉末及びその製造方法、並びにそれを用いた組成物及び放熱材
WO2019164002A1 (ja) * 2018-02-26 2019-08-29 デンカ株式会社 絶縁放熱シート
JPWO2020049817A1 (ja) * 2018-09-07 2020-09-10 昭和電工株式会社 六方晶窒化ホウ素粉末及びその製造方法、並びにそれを用いた組成物及び放熱材
JP7467980B2 (ja) 2019-02-27 2024-04-16 三菱ケミカル株式会社 窒化ホウ素凝集粉末、放熱シート及び半導体デバイスの製造方法
US20220154059A1 (en) * 2019-03-27 2022-05-19 Denka Company Limited Boron nitride aggregated particles, thermal conductive resin composition, and heat dissipation member
DE102019204191A1 (de) * 2019-03-27 2020-10-01 Siemens Aktiengesellschaft Gießharz, Formstoff daraus, Verwendung dazu und eine elektrische Isolierung
JP7476482B2 (ja) * 2019-04-01 2024-05-01 住友ベークライト株式会社 熱伝導性シート

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JP2008189818A (ja) * 2007-02-05 2008-08-21 Nitto Denko Corp 熱伝導性樹脂組成物および熱伝導性シートとその製造方法
JP2020164365A (ja) * 2019-03-29 2020-10-08 デンカ株式会社 窒化ホウ素粉末及び樹脂組成物

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EP4253315A1 (en) 2023-10-04
WO2022149435A1 (ja) 2022-07-14
US20240026198A1 (en) 2024-01-25
JP7291304B2 (ja) 2023-06-14
EP4253315A4 (en) 2024-07-03
EP4253315B1 (en) 2025-09-17
JPWO2022149435A1 (https=) 2022-07-14
CN116670233A (zh) 2023-08-29

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