JPWO2022091192A1 - - Google Patents
Info
- Publication number
- JPWO2022091192A1 JPWO2022091192A1 JP2022558624A JP2022558624A JPWO2022091192A1 JP WO2022091192 A1 JPWO2022091192 A1 JP WO2022091192A1 JP 2022558624 A JP2022558624 A JP 2022558624A JP 2022558624 A JP2022558624 A JP 2022558624A JP WO2022091192 A1 JPWO2022091192 A1 JP WO2022091192A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/66—High-frequency adaptations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49838—Geometry or layout
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/345—Arrangements for heating
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/481—Internal lead connections, e.g. via connections, feedthrough structures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49568—Lead-frames or other flat leads specifically adapted to facilitate heat dissipation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
- H01L28/20—Resistors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
- H01L28/40—Capacitors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/30—Auxiliary devices for compensation of, or protection against, temperature or moisture effects ; for improving power handling capability
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
- H01L2223/64—Impedance arrangements
- H01L2223/66—High-frequency adaptations
- H01L2223/6605—High-frequency electrical connections
- H01L2223/6611—Wire connections
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
- H01L2223/64—Impedance arrangements
- H01L2223/66—High-frequency adaptations
- H01L2223/6605—High-frequency electrical connections
- H01L2223/6616—Vertical connections, e.g. vias
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
- H01L2223/64—Impedance arrangements
- H01L2223/66—High-frequency adaptations
- H01L2223/6644—Packaging aspects of high-frequency amplifiers
- H01L2223/6655—Matching arrangements, e.g. arrangement of inductive and capacitive components
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
- H01L2223/64—Impedance arrangements
- H01L2223/66—High-frequency adaptations
- H01L2223/6661—High-frequency adaptations for passive devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
- H01L2924/141—Analog devices
- H01L2924/142—HF devices
- H01L2924/1421—RF devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
- H01L2924/30111—Impedance matching
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Geometry (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Non-Reversible Transmitting Devices (AREA)
- Details Of Resistors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2020/040165 WO2022091192A1 (ja) | 2020-10-27 | 2020-10-27 | 高周波回路 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2022091192A1 true JPWO2022091192A1 (ja) | 2022-05-05 |
JP7267511B2 JP7267511B2 (ja) | 2023-05-01 |
Family
ID=81382153
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022558624A Active JP7267511B2 (ja) | 2020-10-27 | 2020-10-27 | 高周波回路 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20230223363A1 (ja) |
JP (1) | JP7267511B2 (ja) |
GB (1) | GB2615426B (ja) |
WO (1) | WO2022091192A1 (ja) |
Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63500838A (ja) * | 1984-12-19 | 1988-03-24 | マ−チン・マリエッタ・コ−ポレ−ション | 複式誘電体多心伝送回線とその応用装置 |
JPH03121601A (ja) * | 1989-10-04 | 1991-05-23 | Fujitsu Ltd | マイクロ波帯終端器 |
JPH03136403A (ja) * | 1989-10-20 | 1991-06-11 | Fujitsu Ltd | T型固定減衰器 |
JPH04290001A (ja) * | 1991-03-19 | 1992-10-14 | Toshiba Lighting & Technol Corp | 電子回路板 |
JPH07106759A (ja) * | 1993-09-30 | 1995-04-21 | Sony Corp | 薄膜多層基板 |
JPH07221509A (ja) * | 1994-02-01 | 1995-08-18 | Hitachi Ltd | マイクロ波帯終端器 |
JPH1141031A (ja) * | 1997-07-15 | 1999-02-12 | Mitsubishi Electric Corp | 電圧制御発振器 |
JP2007306502A (ja) * | 2006-05-15 | 2007-11-22 | Japan Radio Co Ltd | マイクロストリップ線路終端器 |
JP2009021485A (ja) * | 2007-07-13 | 2009-01-29 | Mitsubishi Electric Corp | 電子部品装置 |
JP2009105480A (ja) * | 2007-10-19 | 2009-05-14 | Mitsubishi Electric Corp | 排熱回路および高出力増幅器 |
JP2009124072A (ja) * | 2007-11-19 | 2009-06-04 | Mitsubishi Electric Corp | 高周波モジュール |
JP2010154235A (ja) * | 2008-12-25 | 2010-07-08 | Mitsubishi Electric Corp | 高周波半導体増幅器 |
JP2017059884A (ja) * | 2015-09-14 | 2017-03-23 | 株式会社東芝 | 断熱導波路及び無線通信装置 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4670723A (en) * | 1985-03-18 | 1987-06-02 | Tektronix, Inc. | Broad band, thin film attenuator and method for construction thereof |
JP3121601B2 (ja) | 1989-04-12 | 2001-01-09 | 株式会社東芝 | 微粉砕装置 |
JP3136403B2 (ja) | 1998-10-06 | 2001-02-19 | 大塚化学株式会社 | 発泡剤粉末及びその製造方法 |
US6693939B2 (en) | 2001-01-29 | 2004-02-17 | Cymer, Inc. | Laser lithography light source with beam delivery |
JP5342995B2 (ja) * | 2009-12-28 | 2013-11-13 | 京セラ株式会社 | 高周波モジュール |
JP7221509B2 (ja) | 2016-04-27 | 2023-02-14 | クラシエホームプロダクツ株式会社 | 毛髪の洗浄及びコンディショニング用の組成物 |
JP6737634B2 (ja) * | 2016-05-12 | 2020-08-12 | イリソ電子工業株式会社 | 放熱チップ及び放熱構造 |
JP6683020B2 (ja) * | 2016-06-01 | 2020-04-15 | 株式会社デンソー | 電力変換装置、及び、これを用いた電動パワーステアリング装置 |
US11083079B2 (en) * | 2016-12-26 | 2021-08-03 | Mitsubishi Electric Corporation | Terminal device |
US11345043B2 (en) | 2018-07-02 | 2022-05-31 | Flexiv Ltd. | Axial force sensor, robot gripper, and robot having the same |
-
2020
- 2020-10-27 GB GB2304927.3A patent/GB2615426B/en active Active
- 2020-10-27 JP JP2022558624A patent/JP7267511B2/ja active Active
- 2020-10-27 WO PCT/JP2020/040165 patent/WO2022091192A1/ja active Application Filing
-
2023
- 2023-03-17 US US18/185,627 patent/US20230223363A1/en active Pending
Patent Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63500838A (ja) * | 1984-12-19 | 1988-03-24 | マ−チン・マリエッタ・コ−ポレ−ション | 複式誘電体多心伝送回線とその応用装置 |
JPH03121601A (ja) * | 1989-10-04 | 1991-05-23 | Fujitsu Ltd | マイクロ波帯終端器 |
JPH03136403A (ja) * | 1989-10-20 | 1991-06-11 | Fujitsu Ltd | T型固定減衰器 |
JPH04290001A (ja) * | 1991-03-19 | 1992-10-14 | Toshiba Lighting & Technol Corp | 電子回路板 |
JPH07106759A (ja) * | 1993-09-30 | 1995-04-21 | Sony Corp | 薄膜多層基板 |
JPH07221509A (ja) * | 1994-02-01 | 1995-08-18 | Hitachi Ltd | マイクロ波帯終端器 |
JPH1141031A (ja) * | 1997-07-15 | 1999-02-12 | Mitsubishi Electric Corp | 電圧制御発振器 |
JP2007306502A (ja) * | 2006-05-15 | 2007-11-22 | Japan Radio Co Ltd | マイクロストリップ線路終端器 |
JP2009021485A (ja) * | 2007-07-13 | 2009-01-29 | Mitsubishi Electric Corp | 電子部品装置 |
JP2009105480A (ja) * | 2007-10-19 | 2009-05-14 | Mitsubishi Electric Corp | 排熱回路および高出力増幅器 |
JP2009124072A (ja) * | 2007-11-19 | 2009-06-04 | Mitsubishi Electric Corp | 高周波モジュール |
JP2010154235A (ja) * | 2008-12-25 | 2010-07-08 | Mitsubishi Electric Corp | 高周波半導体増幅器 |
JP2017059884A (ja) * | 2015-09-14 | 2017-03-23 | 株式会社東芝 | 断熱導波路及び無線通信装置 |
Also Published As
Publication number | Publication date |
---|---|
JP7267511B2 (ja) | 2023-05-01 |
US20230223363A1 (en) | 2023-07-13 |
GB2615426A (en) | 2023-08-09 |
GB2615426B (en) | 2024-04-10 |
GB202304927D0 (en) | 2023-05-17 |
WO2022091192A1 (ja) | 2022-05-05 |
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