JPWO2022091192A1 - - Google Patents

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Publication number
JPWO2022091192A1
JPWO2022091192A1 JP2022558624A JP2022558624A JPWO2022091192A1 JP WO2022091192 A1 JPWO2022091192 A1 JP WO2022091192A1 JP 2022558624 A JP2022558624 A JP 2022558624A JP 2022558624 A JP2022558624 A JP 2022558624A JP WO2022091192 A1 JPWO2022091192 A1 JP WO2022091192A1
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JP
Japan
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Application number
JP2022558624A
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JP7267511B2 (ja
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49838—Geometry or layout
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/345—Arrangements for heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/481—Internal lead connections, e.g. via connections, feedthrough structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49568—Lead-frames or other flat leads specifically adapted to facilitate heat dissipation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
    • H01L28/20—Resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
    • H01L28/40—Capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/30—Auxiliary devices for compensation of, or protection against, temperature or moisture effects ; for improving power handling capability
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6605—High-frequency electrical connections
    • H01L2223/6611—Wire connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6605—High-frequency electrical connections
    • H01L2223/6616—Vertical connections, e.g. vias
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6644—Packaging aspects of high-frequency amplifiers
    • H01L2223/6655—Matching arrangements, e.g. arrangement of inductive and capacitive components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6661—High-frequency adaptations for passive devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H01L2924/141—Analog devices
    • H01L2924/142—HF devices
    • H01L2924/1421—RF devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H01L2924/30111—Impedance matching

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Non-Reversible Transmitting Devices (AREA)
  • Details Of Resistors (AREA)
JP2022558624A 2020-10-27 2020-10-27 高周波回路 Active JP7267511B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2020/040165 WO2022091192A1 (ja) 2020-10-27 2020-10-27 高周波回路

Publications (2)

Publication Number Publication Date
JPWO2022091192A1 true JPWO2022091192A1 (ja) 2022-05-05
JP7267511B2 JP7267511B2 (ja) 2023-05-01

Family

ID=81382153

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022558624A Active JP7267511B2 (ja) 2020-10-27 2020-10-27 高周波回路

Country Status (4)

Country Link
US (1) US20230223363A1 (ja)
JP (1) JP7267511B2 (ja)
GB (1) GB2615426B (ja)
WO (1) WO2022091192A1 (ja)

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63500838A (ja) * 1984-12-19 1988-03-24 マ−チン・マリエッタ・コ−ポレ−ション 複式誘電体多心伝送回線とその応用装置
JPH03121601A (ja) * 1989-10-04 1991-05-23 Fujitsu Ltd マイクロ波帯終端器
JPH03136403A (ja) * 1989-10-20 1991-06-11 Fujitsu Ltd Ｔ型固定減衰器
JPH04290001A (ja) * 1991-03-19 1992-10-14 Toshiba Lighting & Technol Corp 電子回路板
JPH07106759A (ja) * 1993-09-30 1995-04-21 Sony Corp 薄膜多層基板
JPH07221509A (ja) * 1994-02-01 1995-08-18 Hitachi Ltd マイクロ波帯終端器
JPH1141031A (ja) * 1997-07-15 1999-02-12 Mitsubishi Electric Corp 電圧制御発振器
JP2007306502A (ja) * 2006-05-15 2007-11-22 Japan Radio Co Ltd マイクロストリップ線路終端器
JP2009021485A (ja) * 2007-07-13 2009-01-29 Mitsubishi Electric Corp 電子部品装置
JP2009105480A (ja) * 2007-10-19 2009-05-14 Mitsubishi Electric Corp 排熱回路および高出力増幅器
JP2009124072A (ja) * 2007-11-19 2009-06-04 Mitsubishi Electric Corp 高周波モジュール
JP2010154235A (ja) * 2008-12-25 2010-07-08 Mitsubishi Electric Corp 高周波半導体増幅器
JP2017059884A (ja) * 2015-09-14 2017-03-23 株式会社東芝 断熱導波路及び無線通信装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4670723A (en) * 1985-03-18 1987-06-02 Tektronix, Inc. Broad band, thin film attenuator and method for construction thereof
JP3121601B2 (ja) 1989-04-12 2001-01-09 株式会社東芝 微粉砕装置
JP3136403B2 (ja) 1998-10-06 2001-02-19 大塚化学株式会社 発泡剤粉末及びその製造方法
US6693939B2 (en) 2001-01-29 2004-02-17 Cymer, Inc. Laser lithography light source with beam delivery
JP5342995B2 (ja) * 2009-12-28 2013-11-13 京セラ株式会社 高周波モジュール
JP7221509B2 (ja) 2016-04-27 2023-02-14 クラシエホームプロダクツ株式会社 毛髪の洗浄及びコンディショニング用の組成物
JP6737634B2 (ja) * 2016-05-12 2020-08-12 イリソ電子工業株式会社 放熱チップ及び放熱構造
JP6683020B2 (ja) * 2016-06-01 2020-04-15 株式会社デンソー 電力変換装置、及び、これを用いた電動パワーステアリング装置
US11083079B2 (en) * 2016-12-26 2021-08-03 Mitsubishi Electric Corporation Terminal device
US11345043B2 (en) 2018-07-02 2022-05-31 Flexiv Ltd. Axial force sensor, robot gripper, and robot having the same

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63500838A (ja) * 1984-12-19 1988-03-24 マ−チン・マリエッタ・コ−ポレ−ション 複式誘電体多心伝送回線とその応用装置
JPH03121601A (ja) * 1989-10-04 1991-05-23 Fujitsu Ltd マイクロ波帯終端器
JPH03136403A (ja) * 1989-10-20 1991-06-11 Fujitsu Ltd Ｔ型固定減衰器
JPH04290001A (ja) * 1991-03-19 1992-10-14 Toshiba Lighting & Technol Corp 電子回路板
JPH07106759A (ja) * 1993-09-30 1995-04-21 Sony Corp 薄膜多層基板
JPH07221509A (ja) * 1994-02-01 1995-08-18 Hitachi Ltd マイクロ波帯終端器
JPH1141031A (ja) * 1997-07-15 1999-02-12 Mitsubishi Electric Corp 電圧制御発振器
JP2007306502A (ja) * 2006-05-15 2007-11-22 Japan Radio Co Ltd マイクロストリップ線路終端器
JP2009021485A (ja) * 2007-07-13 2009-01-29 Mitsubishi Electric Corp 電子部品装置
JP2009105480A (ja) * 2007-10-19 2009-05-14 Mitsubishi Electric Corp 排熱回路および高出力増幅器
JP2009124072A (ja) * 2007-11-19 2009-06-04 Mitsubishi Electric Corp 高周波モジュール
JP2010154235A (ja) * 2008-12-25 2010-07-08 Mitsubishi Electric Corp 高周波半導体増幅器
JP2017059884A (ja) * 2015-09-14 2017-03-23 株式会社東芝 断熱導波路及び無線通信装置

Also Published As

Publication number Publication date
JP7267511B2 (ja) 2023-05-01
US20230223363A1 (en) 2023-07-13
GB2615426A (en) 2023-08-09
GB2615426B (en) 2024-04-10
GB202304927D0 (en) 2023-05-17
WO2022091192A1 (ja) 2022-05-05

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