JPWO2022039121A1 - - Google Patents

Info

Publication number
JPWO2022039121A1
JPWO2022039121A1 JP2022543934A JP2022543934A JPWO2022039121A1 JP WO2022039121 A1 JPWO2022039121 A1 JP WO2022039121A1 JP 2022543934 A JP2022543934 A JP 2022543934A JP 2022543934 A JP2022543934 A JP 2022543934A JP WO2022039121 A1 JPWO2022039121 A1 JP WO2022039121A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022543934A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022039121A1 publication Critical patent/JPWO2022039121A1/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D4/00—Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Epoxy Resins (AREA)
JP2022543934A 2020-08-17 2021-08-16 Pending JPWO2022039121A1 (enrdf_load_stackoverflow)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020137443 2020-08-17
PCT/JP2021/029877 WO2022039121A2 (ja) 2020-08-17 2021-08-16 熱硬化性樹脂組成物

Publications (1)

Publication Number Publication Date
JPWO2022039121A1 true JPWO2022039121A1 (enrdf_load_stackoverflow) 2022-02-24

Family

ID=80322822

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022543934A Pending JPWO2022039121A1 (enrdf_load_stackoverflow) 2020-08-17 2021-08-16

Country Status (2)

Country Link
JP (1) JPWO2022039121A1 (enrdf_load_stackoverflow)
WO (1) WO2022039121A2 (enrdf_load_stackoverflow)

Citations (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5730719A (en) * 1980-08-01 1982-02-19 Mitsubishi Petrochem Co Ltd Preparation of cured novolak type epoxy resin
JPS5930818A (ja) * 1982-06-14 1984-02-18 シエル・インタ−ナシヨネイル・リサ−チ・マ−チヤツピイ・ベ−・ウイ 熱硬化性エポキシ組成物および成形品を製造するに際してのそれの使用
JPS60155279A (ja) * 1983-12-12 1985-08-15 Somar Corp 粉体塗料用樹脂組成物
JPS6112718A (ja) * 1984-06-29 1986-01-21 Mitsubishi Electric Corp エポキシ含浸樹脂組成物
JPS62265320A (ja) * 1986-05-12 1987-11-18 Kanegafuchi Chem Ind Co Ltd 熱硬化性樹脂組成物及びその成形方法
JPS63170410A (ja) * 1987-01-07 1988-07-14 Koei Chem Co Ltd 硬化性樹脂組成物
JP2005200444A (ja) * 2004-01-13 2005-07-28 Sumitomo Bakelite Co Ltd 熱硬化性液状封止樹脂組成物及びそれを用いた半導体装置
JP2012116979A (ja) * 2010-12-02 2012-06-21 Hitachi Chemical Co Ltd エポキシ樹脂組成物、半導体封止充てん用樹脂組成物及び半導体装置
WO2012118208A1 (ja) * 2011-03-03 2012-09-07 三菱レイヨン株式会社 マトリックス樹脂組成物、プリプレグとその製造方法、ならびに繊維強化複合材料
JP2013256637A (ja) * 2012-05-16 2013-12-26 Hitachi Industrial Equipment Systems Co Ltd エポキシ‐ビニル共重合型液状樹脂組成物、その硬化物、製造方法及び硬化物を用いた絶縁材料、電子・電気機器
JP2014013382A (ja) * 2012-06-07 2014-01-23 Sekisui Chem Co Ltd 液晶滴下工法用シール剤、上下導通材料、及び、液晶表示素子
JP2016017110A (ja) * 2014-07-07 2016-02-01 三菱レイヨン株式会社 圧力容器の製造方法
WO2017061006A1 (ja) * 2015-10-08 2017-04-13 三菱電機株式会社 無溶剤型ワニス組成物、絶縁コイル及びその製造方法、回転機、並びに密閉型電動圧縮機
WO2018123442A1 (ja) * 2016-12-27 2018-07-05 新日鉄住金化学株式会社 硬化性エポキシ樹脂組成物、それを用いた繊維強化複合材料及び成形体
JP2019157056A (ja) * 2018-03-16 2019-09-19 三菱ケミカル株式会社 硬化性樹脂組成物、並びにこれを用いたフィルム、成形品、プリプレグ及び繊維強化プラスチック
JP2019172898A (ja) * 2018-03-29 2019-10-10 味の素株式会社 樹脂組成物、シート状積層材料、プリント配線板及び半導体装置
WO2024135755A1 (ja) * 2022-12-22 2024-06-27 東亞合成株式会社 硬化型接着剤組成物

Patent Citations (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5730719A (en) * 1980-08-01 1982-02-19 Mitsubishi Petrochem Co Ltd Preparation of cured novolak type epoxy resin
JPS5930818A (ja) * 1982-06-14 1984-02-18 シエル・インタ−ナシヨネイル・リサ−チ・マ−チヤツピイ・ベ−・ウイ 熱硬化性エポキシ組成物および成形品を製造するに際してのそれの使用
JPS60155279A (ja) * 1983-12-12 1985-08-15 Somar Corp 粉体塗料用樹脂組成物
JPS6112718A (ja) * 1984-06-29 1986-01-21 Mitsubishi Electric Corp エポキシ含浸樹脂組成物
JPS62265320A (ja) * 1986-05-12 1987-11-18 Kanegafuchi Chem Ind Co Ltd 熱硬化性樹脂組成物及びその成形方法
JPS63170410A (ja) * 1987-01-07 1988-07-14 Koei Chem Co Ltd 硬化性樹脂組成物
JP2005200444A (ja) * 2004-01-13 2005-07-28 Sumitomo Bakelite Co Ltd 熱硬化性液状封止樹脂組成物及びそれを用いた半導体装置
JP2012116979A (ja) * 2010-12-02 2012-06-21 Hitachi Chemical Co Ltd エポキシ樹脂組成物、半導体封止充てん用樹脂組成物及び半導体装置
WO2012118208A1 (ja) * 2011-03-03 2012-09-07 三菱レイヨン株式会社 マトリックス樹脂組成物、プリプレグとその製造方法、ならびに繊維強化複合材料
JP2013256637A (ja) * 2012-05-16 2013-12-26 Hitachi Industrial Equipment Systems Co Ltd エポキシ‐ビニル共重合型液状樹脂組成物、その硬化物、製造方法及び硬化物を用いた絶縁材料、電子・電気機器
JP2014013382A (ja) * 2012-06-07 2014-01-23 Sekisui Chem Co Ltd 液晶滴下工法用シール剤、上下導通材料、及び、液晶表示素子
JP2016017110A (ja) * 2014-07-07 2016-02-01 三菱レイヨン株式会社 圧力容器の製造方法
WO2017061006A1 (ja) * 2015-10-08 2017-04-13 三菱電機株式会社 無溶剤型ワニス組成物、絶縁コイル及びその製造方法、回転機、並びに密閉型電動圧縮機
WO2018123442A1 (ja) * 2016-12-27 2018-07-05 新日鉄住金化学株式会社 硬化性エポキシ樹脂組成物、それを用いた繊維強化複合材料及び成形体
JP2019157056A (ja) * 2018-03-16 2019-09-19 三菱ケミカル株式会社 硬化性樹脂組成物、並びにこれを用いたフィルム、成形品、プリプレグ及び繊維強化プラスチック
JP2019172898A (ja) * 2018-03-29 2019-10-10 味の素株式会社 樹脂組成物、シート状積層材料、プリント配線板及び半導体装置
WO2024135755A1 (ja) * 2022-12-22 2024-06-27 東亞合成株式会社 硬化型接着剤組成物

Also Published As

Publication number Publication date
WO2022039121A3 (ja) 2022-04-21
WO2022039121A2 (ja) 2022-02-24

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