JPWO2021234928A1 - - Google Patents

Info

Publication number
JPWO2021234928A1
JPWO2021234928A1 JP2022524820A JP2022524820A JPWO2021234928A1 JP WO2021234928 A1 JPWO2021234928 A1 JP WO2021234928A1 JP 2022524820 A JP2022524820 A JP 2022524820A JP 2022524820 A JP2022524820 A JP 2022524820A JP WO2021234928 A1 JPWO2021234928 A1 JP WO2021234928A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022524820A
Other languages
Japanese (ja)
Other versions
JP7279858B2 (ja
JPWO2021234928A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021234928A1 publication Critical patent/JPWO2021234928A1/ja
Publication of JPWO2021234928A5 publication Critical patent/JPWO2021234928A5/ja
Application granted granted Critical
Publication of JP7279858B2 publication Critical patent/JP7279858B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0464—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the transfer chamber
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/0095—Gripping heads and other end effectors with an external support, i.e. a support which does not belong to the manipulator or the object to be gripped, e.g. for maintaining the gripping head in an accurate position, guiding it or preventing vibrations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Program-controlled manipulators
    • B25J9/0084—Program-controlled manipulators comprising a plurality of manipulators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/0052—Gripping heads and other end effectors multiple gripper units or multiple end effectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/04—Gripping heads and other end effectors with provision for the remote detachment or exchange of the head or parts thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J21/00—Chambers provided with manipulation devices
    • B25J21/005—Clean rooms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Program-controlled manipulators
    • B25J9/003—Program-controlled manipulators having parallel kinematics
    • B25J9/0045—Program-controlled manipulators having parallel kinematics with kinematics chains having a rotary joint at the base
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Program-controlled manipulators
    • B25J9/0093—Program-controlled manipulators co-operating with conveyor means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Program-controlled manipulators
    • B25J9/02—Program-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
    • B25J9/04—Program-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
    • B25J9/041—Cylindrical coordinate type
    • B25J9/042—Cylindrical coordinate type comprising an articulated arm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Program-controlled manipulators
    • B25J9/16—Program controls
    • B25J9/1679—Program controls characterised by the tasks executed
    • B25J9/1682—Dual arm manipulator; Coordination of several manipulators
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3306—Horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance

Landscapes

  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2022524820A 2020-05-21 2020-05-21 搬送装置、搬送方法および搬送システム Active JP7279858B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2020/020197 WO2021234928A1 (ja) 2020-05-21 2020-05-21 搬送装置、搬送方法および搬送システム

Publications (3)

Publication Number Publication Date
JPWO2021234928A1 true JPWO2021234928A1 (https=) 2021-11-25
JPWO2021234928A5 JPWO2021234928A5 (https=) 2022-07-21
JP7279858B2 JP7279858B2 (ja) 2023-05-23

Family

ID=78707881

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022524820A Active JP7279858B2 (ja) 2020-05-21 2020-05-21 搬送装置、搬送方法および搬送システム

Country Status (5)

Country Link
US (1) US11701785B2 (https=)
JP (1) JP7279858B2 (https=)
KR (1) KR102672414B1 (https=)
CN (1) CN113966548B (https=)
WO (1) WO2021234928A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12163228B2 (en) * 2021-05-18 2024-12-10 Mellanox Technologies, Ltd. CVD system with substrate carrier and associated mechanisms for moving substrate therethrough
JP7771651B2 (ja) * 2021-11-12 2025-11-18 東京エレクトロン株式会社 基板搬送装置及び基板搬送方法
JP2025038375A (ja) * 2023-09-07 2025-03-19 株式会社安川電機 ロボット、システム、制御方法、及びプログラム
KR20260001720A (ko) * 2024-06-28 2026-01-06 주식회사 원익아이피에스 버퍼모듈 및 이를 포함하는 기판처리시스템

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003197709A (ja) * 2001-12-25 2003-07-11 Tokyo Electron Ltd 被処理体の搬送機構及び処理システム
JP2003282669A (ja) * 2002-03-26 2003-10-03 Hitachi High-Technologies Corp 基板の搬送方法及びその装置
JP2008510317A (ja) * 2004-08-17 2008-04-03 マットソン テクノロジイ インコーポレイテッド 高度な低コスト・高スループット処理プラットフォーム
JP2014068009A (ja) * 2012-09-12 2014-04-17 Lam Research Corporation 半導体処理装置に関する方法およびシステム
JP2014216519A (ja) * 2013-04-26 2014-11-17 株式会社ディスコ 加工装置及びウエーハの輸送方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7067018B2 (en) * 1997-05-05 2006-06-27 Semitool, Inc. Automated system for handling and processing wafers within a carrier
AU2001268656A1 (en) * 2000-07-07 2002-01-21 Semitool, Inc. Automated processing system
US8668422B2 (en) * 2004-08-17 2014-03-11 Mattson Technology, Inc. Low cost high throughput processing platform
JP4660434B2 (ja) * 2006-07-21 2011-03-30 株式会社安川電機 搬送機構およびそれを備えた処理装置
US20090022574A1 (en) * 2007-07-16 2009-01-22 Eudy Steve L Workpiece loading system
US9443749B2 (en) * 2011-01-20 2016-09-13 Tokyo Electron Limited Vacuum processing apparatus
KR101736855B1 (ko) * 2015-05-29 2017-05-18 세메스 주식회사 기판 처리 설비
JP7246147B2 (ja) * 2017-09-29 2023-03-27 芝浦メカトロニクス株式会社 基板処理装置及び基板処理方法
JP2020027936A (ja) * 2018-08-09 2020-02-20 株式会社安川電機 搬送システムおよび搬送方法
JP6985531B1 (ja) * 2020-02-05 2021-12-22 株式会社安川電機 搬送システム、搬送方法および搬送装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003197709A (ja) * 2001-12-25 2003-07-11 Tokyo Electron Ltd 被処理体の搬送機構及び処理システム
JP2003282669A (ja) * 2002-03-26 2003-10-03 Hitachi High-Technologies Corp 基板の搬送方法及びその装置
JP2008510317A (ja) * 2004-08-17 2008-04-03 マットソン テクノロジイ インコーポレイテッド 高度な低コスト・高スループット処理プラットフォーム
JP2014068009A (ja) * 2012-09-12 2014-04-17 Lam Research Corporation 半導体処理装置に関する方法およびシステム
JP2014216519A (ja) * 2013-04-26 2014-11-17 株式会社ディスコ 加工装置及びウエーハの輸送方法

Also Published As

Publication number Publication date
CN113966548A (zh) 2022-01-21
WO2021234928A1 (ja) 2021-11-25
JP7279858B2 (ja) 2023-05-23
KR102672414B1 (ko) 2024-06-04
US20220111539A1 (en) 2022-04-14
CN113966548B (zh) 2025-04-11
KR20220007145A (ko) 2022-01-18
US11701785B2 (en) 2023-07-18

Similar Documents

Publication Publication Date Title
BR112023005462A2 (https=)
BR112023012656A2 (https=)
BR112021014123A2 (https=)
BR112023009656A2 (https=)
BR112022009896A2 (https=)
BR112021017747A2 (https=)
BR112022024743A2 (https=)
BR112022026905A2 (https=)
BR112023011738A2 (https=)
BR112023004146A2 (https=)
BR112023006729A2 (https=)
BR102021018859A2 (https=)
BR102021015500A2 (https=)
BR102021007058A2 (https=)
BR102020022030A2 (https=)
BR112023016292A2 (https=)
BR112023011539A2 (https=)
BR112023011610A2 (https=)
BR112023008976A2 (https=)
BR102021020147A2 (https=)
BR102021018926A2 (https=)
BR102021018167A2 (https=)
BR102021017576A2 (https=)
BR102021016837A2 (https=)
BR102021016551A2 (https=)

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20220329

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20220519

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20221206

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20230111

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20230411

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20230424

R150 Certificate of patent or registration of utility model

Ref document number: 7279858

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250