CN113966548B - 搬送设备、搬送方法和搬送系统 - Google Patents

搬送设备、搬送方法和搬送系统 Download PDF

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Publication number
CN113966548B
CN113966548B CN202080037031.8A CN202080037031A CN113966548B CN 113966548 B CN113966548 B CN 113966548B CN 202080037031 A CN202080037031 A CN 202080037031A CN 113966548 B CN113966548 B CN 113966548B
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CN
China
Prior art keywords
robot
substrate
chamber
movement
buffer
Prior art date
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Active
Application number
CN202080037031.8A
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English (en)
Chinese (zh)
Other versions
CN113966548A (zh
Inventor
山口刚
赤江裕光
大仁健辅
小宫路修
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yaskawa Electric Corp
Original Assignee
Yaskawa Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yaskawa Electric Corp filed Critical Yaskawa Electric Corp
Publication of CN113966548A publication Critical patent/CN113966548A/zh
Application granted granted Critical
Publication of CN113966548B publication Critical patent/CN113966548B/zh
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Program-controlled manipulators
    • B25J9/0084—Program-controlled manipulators comprising a plurality of manipulators
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0464—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the transfer chamber
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/0095—Gripping heads and other end effectors with an external support, i.e. a support which does not belong to the manipulator or the object to be gripped, e.g. for maintaining the gripping head in an accurate position, guiding it or preventing vibrations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/0052—Gripping heads and other end effectors multiple gripper units or multiple end effectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/04—Gripping heads and other end effectors with provision for the remote detachment or exchange of the head or parts thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J21/00—Chambers provided with manipulation devices
    • B25J21/005—Clean rooms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Program-controlled manipulators
    • B25J9/003—Program-controlled manipulators having parallel kinematics
    • B25J9/0045—Program-controlled manipulators having parallel kinematics with kinematics chains having a rotary joint at the base
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Program-controlled manipulators
    • B25J9/0093—Program-controlled manipulators co-operating with conveyor means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Program-controlled manipulators
    • B25J9/02—Program-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
    • B25J9/04—Program-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
    • B25J9/041—Cylindrical coordinate type
    • B25J9/042—Cylindrical coordinate type comprising an articulated arm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Program-controlled manipulators
    • B25J9/16—Program controls
    • B25J9/1679—Program controls characterised by the tasks executed
    • B25J9/1682—Dual arm manipulator; Coordination of several manipulators
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3306—Horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance

Landscapes

  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CN202080037031.8A 2020-05-21 2020-05-21 搬送设备、搬送方法和搬送系统 Active CN113966548B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2020/020197 WO2021234928A1 (ja) 2020-05-21 2020-05-21 搬送装置、搬送方法および搬送システム

Publications (2)

Publication Number Publication Date
CN113966548A CN113966548A (zh) 2022-01-21
CN113966548B true CN113966548B (zh) 2025-04-11

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080037031.8A Active CN113966548B (zh) 2020-05-21 2020-05-21 搬送设备、搬送方法和搬送系统

Country Status (5)

Country Link
US (1) US11701785B2 (https=)
JP (1) JP7279858B2 (https=)
KR (1) KR102672414B1 (https=)
CN (1) CN113966548B (https=)
WO (1) WO2021234928A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12163228B2 (en) * 2021-05-18 2024-12-10 Mellanox Technologies, Ltd. CVD system with substrate carrier and associated mechanisms for moving substrate therethrough
JP7771651B2 (ja) * 2021-11-12 2025-11-18 東京エレクトロン株式会社 基板搬送装置及び基板搬送方法
JP2025038375A (ja) * 2023-09-07 2025-03-19 株式会社安川電機 ロボット、システム、制御方法、及びプログラム
KR20260001720A (ko) * 2024-06-28 2026-01-06 주식회사 원익아이피에스 버퍼모듈 및 이를 포함하는 기판처리시스템

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008028179A (ja) * 2006-07-21 2008-02-07 Yaskawa Electric Corp 搬送機構およびそれを備えた処理装置
TW201919973A (zh) * 2017-09-29 2019-06-01 日商芝浦機械電子裝置股份有限公司 基板處理裝置及基板處理方法

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US7067018B2 (en) * 1997-05-05 2006-06-27 Semitool, Inc. Automated system for handling and processing wafers within a carrier
AU2001268656A1 (en) * 2000-07-07 2002-01-21 Semitool, Inc. Automated processing system
JP4389424B2 (ja) * 2001-12-25 2009-12-24 東京エレクトロン株式会社 被処理体の搬送機構及び処理システム
JP4220173B2 (ja) 2002-03-26 2009-02-04 株式会社日立ハイテクノロジーズ 基板の搬送方法
KR100805397B1 (ko) 2004-08-17 2008-02-20 맷슨 테크놀로지, 인크. 웨이퍼 가공 장치 및 그 구성 방법
US8668422B2 (en) * 2004-08-17 2014-03-11 Mattson Technology, Inc. Low cost high throughput processing platform
US20090022574A1 (en) * 2007-07-16 2009-01-22 Eudy Steve L Workpiece loading system
US9443749B2 (en) * 2011-01-20 2016-09-13 Tokyo Electron Limited Vacuum processing apparatus
US9293317B2 (en) 2012-09-12 2016-03-22 Lam Research Corporation Method and system related to semiconductor processing equipment
JP2014216519A (ja) 2013-04-26 2014-11-17 株式会社ディスコ 加工装置及びウエーハの輸送方法
KR101736855B1 (ko) * 2015-05-29 2017-05-18 세메스 주식회사 기판 처리 설비
JP2020027936A (ja) * 2018-08-09 2020-02-20 株式会社安川電機 搬送システムおよび搬送方法
JP6985531B1 (ja) * 2020-02-05 2021-12-22 株式会社安川電機 搬送システム、搬送方法および搬送装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008028179A (ja) * 2006-07-21 2008-02-07 Yaskawa Electric Corp 搬送機構およびそれを備えた処理装置
TW201919973A (zh) * 2017-09-29 2019-06-01 日商芝浦機械電子裝置股份有限公司 基板處理裝置及基板處理方法

Also Published As

Publication number Publication date
CN113966548A (zh) 2022-01-21
WO2021234928A1 (ja) 2021-11-25
JP7279858B2 (ja) 2023-05-23
KR102672414B1 (ko) 2024-06-04
JPWO2021234928A1 (https=) 2021-11-25
US20220111539A1 (en) 2022-04-14
KR20220007145A (ko) 2022-01-18
US11701785B2 (en) 2023-07-18

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