JPWO2021215115A1 - - Google Patents
Info
- Publication number
- JPWO2021215115A1 JPWO2021215115A1 JP2022516874A JP2022516874A JPWO2021215115A1 JP WO2021215115 A1 JPWO2021215115 A1 JP WO2021215115A1 JP 2022516874 A JP2022516874 A JP 2022516874A JP 2022516874 A JP2022516874 A JP 2022516874A JP WO2021215115 A1 JPWO2021215115 A1 JP WO2021215115A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C19/00—Surface treatment of glass, not in the form of fibres or filaments, by mechanical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/28—Work carriers for double side lapping of plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020076645 | 2020-04-23 | ||
| PCT/JP2021/007736 WO2021215115A1 (ja) | 2020-04-23 | 2021-03-01 | ガラス物品およびガラス物品の製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2021215115A1 true JPWO2021215115A1 (ja) | 2021-10-28 |
Family
ID=78270596
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022516874A Pending JPWO2021215115A1 (ja) | 2020-04-23 | 2021-03-01 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US11969857B2 (ja) |
| JP (1) | JPWO2021215115A1 (ja) |
| KR (1) | KR20230008030A (ja) |
| CN (1) | CN115427367A (ja) |
| DE (1) | DE112021002489T5 (ja) |
| TW (1) | TW202140400A (ja) |
| WO (1) | WO2021215115A1 (ja) |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62232280A (ja) * | 1986-03-28 | 1987-10-12 | 張 克農 | 画像拡大投写システム |
| JPS62278501A (ja) * | 1986-05-28 | 1987-12-03 | Hitachi Ltd | 屈折率分布型レンズの製造方法とその製造装置 |
| JPH09180264A (ja) * | 1995-12-25 | 1997-07-11 | Sony Corp | スキュー検査装置の較正治具及び較正方法 |
| DE102010063179B4 (de) * | 2010-12-15 | 2012-10-04 | Siltronic Ag | Verfahren zur gleichzeitigen Material abtragenden Bearbeitung beider Seiten mindestens dreier Halbleiterscheiben |
| JP6231098B2 (ja) * | 2012-07-23 | 2017-11-15 | ジェイエイチ ローデス カンパニー， インコーポレイテッド | 非平面ガラス研磨パッドおよび製造方法 |
| JP5983422B2 (ja) | 2013-01-21 | 2016-08-31 | 旭硝子株式会社 | ガラス基板の研磨方法及び製造方法 |
| JP2016036857A (ja) * | 2014-08-05 | 2016-03-22 | 株式会社Sumco | ワークの研磨方法およびワークの研磨装置 |
| JP6823376B2 (ja) * | 2016-03-25 | 2021-02-03 | Hoya株式会社 | 基板の製造方法、マスクブランクの製造方法、および転写用マスクの製造方法 |
| JP6819853B2 (ja) * | 2016-07-19 | 2021-01-27 | 日本電気硝子株式会社 | 円盤状の板ガラス及びその製造方法 |
| JP6695318B2 (ja) * | 2017-12-27 | 2020-05-20 | Hoya株式会社 | 円盤状ガラス基板の製造方法、薄板ガラス基板の製造方法、導光板の製造方法及び円盤状ガラス基板 |
| CN110303423B (zh) * | 2018-03-20 | 2021-10-26 | 胜高股份有限公司 | 工件的研磨方法及研磨装置 |
| CN110962039A (zh) * | 2018-09-29 | 2020-04-07 | 康宁股份有限公司 | 载体晶片和形成载体晶片的方法 |
| JP7199054B2 (ja) | 2018-11-07 | 2023-01-05 | 国立大学法人東海国立大学機構 | サンプル中の元素の質量分析方法、該質量分析方法に用いる分析用デバイス、および、サンプル捕捉用キット |
-
2021
- 2021-03-01 JP JP2022516874A patent/JPWO2021215115A1/ja active Pending
- 2021-03-01 KR KR1020227034744A patent/KR20230008030A/ko unknown
- 2021-03-01 WO PCT/JP2021/007736 patent/WO2021215115A1/ja active Application Filing
- 2021-03-01 CN CN202180029494.4A patent/CN115427367A/zh active Pending
- 2021-03-01 DE DE112021002489.2T patent/DE112021002489T5/de active Pending
- 2021-03-05 TW TW110107910A patent/TW202140400A/zh unknown
-
2022
- 2022-10-19 US US17/969,012 patent/US11969857B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| TW202140400A (zh) | 2021-11-01 |
| KR20230008030A (ko) | 2023-01-13 |
| WO2021215115A1 (ja) | 2021-10-28 |
| DE112021002489T5 (de) | 2023-03-16 |
| CN115427367A (zh) | 2022-12-02 |
| US11969857B2 (en) | 2024-04-30 |
| US20230051824A1 (en) | 2023-02-16 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20230807 |