JPWO2021161582A1 - - Google Patents

Info

Publication number
JPWO2021161582A1
JPWO2021161582A1 JP2022500224A JP2022500224A JPWO2021161582A1 JP WO2021161582 A1 JPWO2021161582 A1 JP WO2021161582A1 JP 2022500224 A JP2022500224 A JP 2022500224A JP 2022500224 A JP2022500224 A JP 2022500224A JP WO2021161582 A1 JPWO2021161582 A1 JP WO2021161582A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022500224A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021161582A1 publication Critical patent/JPWO2021161582A1/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J13/00—Controls for manipulators
    • B25J13/08—Controls for manipulators by means of sensing devices, e.g. viewing or touching devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/0014—Gripping heads and other end effectors having fork, comb or plate shaped means for engaging the lower surface on a object to be transported
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/02—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
    • B25J9/04—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
    • B25J9/041—Cylindrical coordinate type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/16—Programme controls
    • B25J9/1679—Programme controls characterised by the tasks executed
    • B25J9/1692—Calibration of manipulator
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/16—Programme controls
    • B25J9/1694—Programme controls characterised by use of sensors other than normal servo-feedback from position, speed or acceleration sensors, perception control, multi-sensor controlled systems, sensor fusion
    • B25J9/1697—Vision controlled systems
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Human Computer Interaction (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
  • Wire Bonding (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2022500224A 2020-02-13 2020-10-07 Pending JPWO2021161582A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US16/789,814 US11335578B2 (en) 2020-02-13 2020-02-13 Substrate transfer apparatus and method of measuring positional deviation of substrate
PCT/JP2020/038033 WO2021161582A1 (ja) 2020-02-13 2020-10-07 基板搬送装置及び基板位置ずれ測定方法

Publications (1)

Publication Number Publication Date
JPWO2021161582A1 true JPWO2021161582A1 (ja) 2021-08-19

Family

ID=77271953

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022500224A Pending JPWO2021161582A1 (ja) 2020-02-13 2020-10-07

Country Status (6)

Country Link
US (1) US11335578B2 (ja)
JP (1) JPWO2021161582A1 (ja)
KR (1) KR20220137071A (ja)
CN (1) CN115039214A (ja)
TW (1) TWI778436B (ja)
WO (1) WO2021161582A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022011045A (ja) * 2020-06-29 2022-01-17 キヤノン株式会社 搬送装置、基板処理装置、および物品製造方法
JP7470586B2 (ja) * 2020-07-14 2024-04-18 東京エレクトロン株式会社 基板搬送システム及び基板搬送方法

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08288356A (ja) * 1995-04-18 1996-11-01 Metsukusu:Kk 薄型基板搬送装置におけるハンド保護装置
JP2000049212A (ja) * 1998-07-31 2000-02-18 Komatsu Ltd 基板位置検出装置
JP2002046087A (ja) * 2000-08-01 2002-02-12 Mitsubishi Heavy Ind Ltd ３次元位置計測方法及び計測装置並びにロボット制御装置
JP2003086658A (ja) * 2001-09-11 2003-03-20 Anelva Corp 基板搬送装置の監視装置
JP2005286211A (ja) * 2004-03-30 2005-10-13 Tokyo Electron Ltd 真空処理装置及び真空処理方法
JP2006120820A (ja) * 2004-10-21 2006-05-11 Hitachi Sci Syst Ltd 薄型基板処理装置及び薄型基板搬送装置
JP2007329256A (ja) * 2006-06-07 2007-12-20 Nec Electronics Corp 薄板材の搬送装置
JP2009107107A (ja) * 2007-08-30 2009-05-21 Applied Materials Inc カメラによるロボットキャリブレーションのための方法及び装置
JP2009218622A (ja) * 2009-06-29 2009-09-24 Canon Anelva Corp 基板処理装置及び基板処理装置における基板位置ずれ補正方法
JP2011155106A (ja) * 2010-01-27 2011-08-11 Canon Anelva Corp 真空処理装置及び基板搬送機構の調整方法
JP2012089809A (ja) * 2010-10-22 2012-05-10 Tokyo Electron Ltd 保持部材の姿勢判定装置、その方法、基板処理装置及び記憶媒体
JP2015119003A (ja) * 2013-12-17 2015-06-25 株式会社ディスコ 加工装置
JP2018523288A (ja) * 2015-07-22 2018-08-16 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ ロボットによるウェハ配置の光学式較正のための装置及び方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07105432B2 (ja) 1986-10-09 1995-11-13 タツモ株式会社 基板の自動位置合せ装置
JPH0825151B2 (ja) * 1988-09-16 1996-03-13 東京応化工業株式会社 ハンドリングユニット
US5486080A (en) * 1994-06-30 1996-01-23 Diamond Semiconductor Group, Inc. High speed movement of workpieces in vacuum processing
US6481956B1 (en) * 1995-10-27 2002-11-19 Brooks Automation Inc. Method of transferring substrates with two different substrate holding end effectors
EP2099061A3 (en) * 1997-11-28 2013-06-12 Mattson Technology, Inc. Systems and methods for low contamination, high throughput handling of workpieces for vacuum processing
JP3068546B2 (ja) * 1998-01-28 2000-07-24 山形日本電気株式会社 ロボットの制御方法及びその装置
EP1454340B1 (en) * 2001-11-29 2006-09-13 Diamond Semiconductor Group, LLC. Wafer handling apparatus and method
US6748293B1 (en) * 2003-03-24 2004-06-08 Varian Semiconductor Equipment Associates, Inc. Methods and apparatus for high speed object handling
US7690881B2 (en) * 2006-08-30 2010-04-06 Asm Japan K.K. Substrate-processing apparatus with buffer mechanism and substrate-transferring apparatus
US7585142B2 (en) * 2007-03-16 2009-09-08 Asm America, Inc. Substrate handling chamber with movable substrate carrier loading platform
US8285418B2 (en) * 2009-07-23 2012-10-09 Kla-Tencor Corporation Dual scanning stage
US9149936B2 (en) * 2013-01-18 2015-10-06 Persimmon Technologies, Corp. Robot having arm with unequal link lengths
US10224232B2 (en) * 2013-01-18 2019-03-05 Persimmon Technologies Corporation Robot having two arms with unequal link lengths
JP6394220B2 (ja) * 2014-09-17 2018-09-26 東京エレクトロン株式会社 アライメント装置及び基板処理装置
JP6858041B2 (ja) * 2017-03-16 2021-04-14 川崎重工業株式会社 基板搬送装置
JP6783185B2 (ja) * 2017-05-15 2020-11-11 東京エレクトロン株式会社 検査装置
US10724967B2 (en) * 2018-04-20 2020-07-28 Samsung Electronics Co., Ltd. Inspection apparatus for semiconductor process and semiconductor process device

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08288356A (ja) * 1995-04-18 1996-11-01 Metsukusu:Kk 薄型基板搬送装置におけるハンド保護装置
JP2000049212A (ja) * 1998-07-31 2000-02-18 Komatsu Ltd 基板位置検出装置
JP2002046087A (ja) * 2000-08-01 2002-02-12 Mitsubishi Heavy Ind Ltd ３次元位置計測方法及び計測装置並びにロボット制御装置
JP2003086658A (ja) * 2001-09-11 2003-03-20 Anelva Corp 基板搬送装置の監視装置
JP2005286211A (ja) * 2004-03-30 2005-10-13 Tokyo Electron Ltd 真空処理装置及び真空処理方法
JP2006120820A (ja) * 2004-10-21 2006-05-11 Hitachi Sci Syst Ltd 薄型基板処理装置及び薄型基板搬送装置
JP2007329256A (ja) * 2006-06-07 2007-12-20 Nec Electronics Corp 薄板材の搬送装置
JP2009107107A (ja) * 2007-08-30 2009-05-21 Applied Materials Inc カメラによるロボットキャリブレーションのための方法及び装置
JP2009218622A (ja) * 2009-06-29 2009-09-24 Canon Anelva Corp 基板処理装置及び基板処理装置における基板位置ずれ補正方法
JP2011155106A (ja) * 2010-01-27 2011-08-11 Canon Anelva Corp 真空処理装置及び基板搬送機構の調整方法
JP2012089809A (ja) * 2010-10-22 2012-05-10 Tokyo Electron Ltd 保持部材の姿勢判定装置、その方法、基板処理装置及び記憶媒体
JP2015119003A (ja) * 2013-12-17 2015-06-25 株式会社ディスコ 加工装置
JP2018523288A (ja) * 2015-07-22 2018-08-16 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ ロボットによるウェハ配置の光学式較正のための装置及び方法

Also Published As

Publication number Publication date
WO2021161582A1 (ja) 2021-08-19
TW202131438A (zh) 2021-08-16
US11335578B2 (en) 2022-05-17
US20210257242A1 (en) 2021-08-19
KR20220137071A (ko) 2022-10-11
TWI778436B (zh) 2022-09-21
CN115039214A (zh) 2022-09-09

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